ZHCSR53B October   2023  – May 2024 TPSM86837 , TPSM86838

PRODUCTION DATA  

  1.   1
  2. 1 特性
  3. 2 应用
  4. 3 说明
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1  The Adaptive On-Time Control and PWM Operation
      2. 6.3.2  Mode Selection
        1. 6.3.2.1 FCCM Control and Eco-mode Control
      3. 6.3.3  Soft Start and Prebiased Soft Start
      4. 6.3.4  Enable and Adjusting Undervoltage Lockout
      5. 6.3.5  Output Overcurrent Limit and Undervoltage Protection
      6. 6.3.6  Overvoltage Protection
      7. 6.3.7  UVLO Protection
      8. 6.3.8  Thermal Shutdown
      9. 6.3.9  Output Voltage Discharge
      10. 6.3.10 Power Good
      11. 6.3.11 Large Duty Operation
    4. 6.4 Device Functional Modes
      1. 6.4.1 Standby Operation
      2. 6.4.2 Light Load Operation
  8. 7 Application and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Application
      1. 7.2.1 Design Requirements
      2. 7.2.2 Detailed Design Procedure
        1. 7.2.2.1 Output Voltage Resistors Selection
        2. 7.2.2.2 Output Filter Selection
        3. 7.2.2.3 Input Capacitor Selection
      3. 7.2.3 Application Curves
    3. 7.3 Power Supply Recommendations
      1. 7.3.1 Application Thermal Considerations
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
      2. 7.4.2 Layout Example
  9. 8 Device and Documentation Support
    1. 8.1 Device Support
      1. 8.1.1 第三方产品免责声明
    2. 8.2 Documentation Support
      1. 8.2.1 Related Documentation
    3. 8.3 接收文档更新通知
    4. 8.4 支持资源
    5. 8.5 Trademarks
    6. 8.6 静电放电警告
    7. 8.7 术语表
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

5.4 Thermal Information

THERMAL METRIC1TPSM8683xUNIT
RCG

(B3QFN)

19 PINS
Eff RθJAEffective Junction-to-ambient thermal resistance (TPSM8683x EVM)

24

°C/W
RθJAJunction-to-ambient thermal resistance (JEDEC)36°C/W
ΨJTJunction-to-top characterization parameter20.5°C/W
ΨJBJunction-to-board characterization parameter312°C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.
(2) The junction-to-top board characterization parameter, ΨJT, estimates the junction temperature, TJ , of a device in a real system, using a procedure described in JESD51-2A (section 6 and 7). TJ = ΨJT × PDIS + TT; where PDIS is the power dissipated in the device and TT is the temperature of the top of the device.
(3) The junction-to-top board characterization parameter, ΨJB, estimates the junction temperature, TJ, of a device in a real system, using a procedure described in JESD51-2A (section 6 and 7). TJ = ΨJB × PDIS + TB; where PDIS is the power dissipated in the device and TB is the temperature of the board 1mm from the device.