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  • THVD24x9 采用小型封装、具有集成浪涌保护和高总线故障保护功能的 3V 至 5.5V RS-485 收发器

    • ZHCSPL9A January   2024  – August 2024 THVD2419 , THVD2429

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  • THVD24x9 采用小型封装、具有集成浪涌保护和高总线故障保护功能的 3V 至 5.5V RS-485 收发器
  1.   1
  2. 1 特性
  3. 2 应用
  4. 3 说明
  5. 4 Device Comparison Table
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  ESD Ratings - IEC Specifications
    4. 6.4  Recommended Operating Conditions
    5. 6.5  Thermal Information
    6. 6.6  Power Dissipation
    7. 6.7  Electrical Characteristics
    8. 6.8  Switching Characteristics 250kbps
    9. 6.9  Switching Characteristics 20Mbps
    10. 6.10 Typical Characteristics
  8. 7 Parameter Measurement Information
  9. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagrams
    3. 8.3 Feature Description
      1. 8.3.1 Electrostatic Discharge (ESD) Protection
      2. 8.3.2 Electrical Fast Transient (EFT) Protection
      3. 8.3.3 Surge Protection
      4. 8.3.4 Enhanced Receiver Noise Immunity
      5. 8.3.5 Failsafe Receiver
    4. 8.4 Device Functional Modes
  10. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
        1. 9.2.1.1 Data Rate and Bus Length
        2. 9.2.1.2 Stub Length
        3. 9.2.1.3 Bus Loading
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curves
    3. 9.3 Power Supply Recommendations
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
      2. 9.4.2 Layout Example
  11. 10Device and Documentation Support
    1. 10.1 Device Support
    2. 10.2 接收文档更新通知
    3. 10.3 支持资源
    4. 10.4 Trademarks
    5. 10.5 静电放电警告
    6. 10.6 术语表
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information
  14. 重要声明
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Data Sheet

THVD24x9 采用小型封装、具有集成浪涌保护和高总线故障保护功能的 3V 至 5.5V RS-485 收发器

本资源的原文使用英文撰写。 为方便起见，TI 提供了译文；由于翻译过程中可能使用了自动化工具，TI 不保证译文的准确性。 为确认准确性，请务必访问 ti.com 参考最新的英文版本（控制文档）。

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1 特性

  • 符合或超出 TIA/EIA-485A 标准要求
  • 3V 至 5.5V 电源电压
  • 采用 9mm2 封装、集成浪涌保护功能的业界超小型 RS-485 器件
  • VIO 支持从 1.65V 到 VCC 的电源电平
  • 总线 I/O 保护
    • ±3kV/42Ω IEC 61000-4-5 1.2/50μs 浪涌 (SOIC)
    • ±1.5kV/42Ω IEC 61000-4-5 1.2/50μs 浪涌 (VSON)
    • ±8kV IEC 61000-4-2 接触放电
    • ±4kV IEC 61000-4-4 电气快速瞬变
    • ±15kV HBM ESD
    • ±42V 直流总线故障
  • 有两种速度等级
    • THVD2419：250kbps
    • THVD2429：20Mbps
  • 工作环境
    温度范围：-40°C 至 125°C
  • 扩展级运行
    共模范围：±25V
  • 用于噪声抑制的较大接收器滞后
  • 关断模式下的低功耗：< 5µA
  • 适用于热插拔功能的无干扰上电和断电
  • 开路、短路和空闲总线失效防护
  • 1/8 单位负载（多达 256 个总线节点）
  • 采用可实现快插兼容性的
    业界通用 8 引脚 SOIC 封装
  • 采用 3mm x 3mm 无引线 (VSON) 封装、集成浪涌保护功能的小型 RS-485 器件

2 应用

  • 无线基础设施
  • 工厂自动化
  • 电机驱动器
  • 楼宇自动化
  • HVAC
  • 电网基础设施

3 说明

THVD24x9 器件是半双工 RS-485 收发器，集成了浪涌保护功能。浪涌保护是通过在标准 8 引脚 SOIC (D) 封装以及小型 10 引脚 VSON 封装中集成瞬态电压抑制器 (TVS) 二极管实现的。此功能提高了可靠性，可以更好地抵抗耦合到数据电缆的噪声瞬变，而无需外部保护元件。

采用标准引脚排列 SOIC 封装的 THVD24x9 器件由 3.3V 或 5V 单电源供电。此外，采用 10 引脚 VSON 封装的 THVD24x9 器件支持额外的 VIO 电源，可在低至 1.65V 的电源电平下运行 IO。此系列器件具有宽共模电压范围，因而适用于长线缆上的多点应用。

封装信息
器件型号封装(1)封装尺寸(2)
THVD2419
THVD2429		SOIC (8)4.9mm × 6mm
VSON (10)3mm × 3mm
(1) 有关更多信息，请参阅节 12。
(2) 封装尺寸（长 × 宽）为标称值，并包括引脚（如适用）。
THVD2419 THVD2429 THVD24x9 方框图（SOIC 封装）THVD24x9 方框图（SOIC 封装）
THVD2419 THVD2429 THVD24x9 方框图（VSON 封装）THVD24x9 方框图（VSON 封装）

4 Device Comparison Table

PART NUMBERPACKAGEVIOSIGNALING RATENODES
THVD2419SOIC-8Noup to 250kbps256
THVD2429up to 20Mbps
THVD2419VSON-10Yesup to 250kbps
THVD2429up to 20Mbps

5 Pin Configuration and Functions

Figure 5-1 THVD2419, THVD2429, 8-Pin (SOIC)
(Top View)
Figure 5-2 THVD2419, THVD2429, 10-Pin (VSON)
(Top View)
PINTYPEDESCRIPTION
NAMESOIC-8VSON-10
VIO-1P1.8V to 5V supply for R, D, and RE and DE
R12OReceiver data output
RE2

4

IReceiver enable, active low (integrated pull-up)
DE3

3

IDriver enable, active high (integrated pull-down)
D45IDriver data input (integrated pull-up)
GND56, 7-Device ground
A68I/OBus I/O port, A (complementary to B)
B79I/OBus I/O port, B (complementary to A)
VCC810P3.3V to 5V supply for the device

6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1)
MIN MAX UNIT
Logic supply voltage VIO  –0.5 VCC + 0.2 V
Bus supply voltage VCC –0.5 6.5 V
Bus voltage Range at any bus pin (A or B) as differential or common-mode with respect to GND –42 42 V
Input voltage Range at any logic pin (D, DE, SLR or RE) for devices with VIO pin –0.3 VIO + 0.2 V
Input voltage Range at any logic pin (D, DE, SLR or RE) for devices with no VIO pin –0.3 VCC + 0.2 V
Receiver output current IO –24 24 mA
Storage temperature Tstg –65 170 °C
(1) Operation outside the Absolute Maximum Ratings may cause permanent device damage. Absolute Maximum Ratings do not imply functional operation of the device at these or any other conditions beyond those listed under Recommended Operating Conditions. If used outside the Recommended Operating Conditions but within the Absolute Maximum Ratings, the device may not be fully functional, and this may affect device reliability, functionality, performance, and shorten the device lifetime.

6.2 ESD Ratings

VALUE UNIT
V(ESD) Electrostatic discharge Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) Bus terminals and GND ±16,000 V
All pins except bus terminals and GND ±4,000 V
Charged-device model (CDM), per JEDEC specification JESD22-C101(2) ±1,500 V
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.3 ESD Ratings - IEC Specifications

VALUE UNIT
V(ESD) Electrostatic discharge, bus terminals Contact discharge, per IEC 61000-4-2 (1) Bus terminals and GND ±8,000 V
Air-gap discharge, per IEC 61000-4-2 (1) Bus terminals and GND ±15,000
V(SURGE) Surge  Per IEC 61000-4-5, 1.2/50-8/20μs CWG (DRC Package)
 Bus terminals and GND ±1500 V
V(SURGE) Surge  Per IEC 61000-4-5, 1.2/50-8/20μs CWG (D Package)
 Bus terminals and GND ±3,000 V
(1) For optimised IEC ESD performance, it is recommended to have series resistor (≥ 50 Ω) on all logic inputs to minimize transient currents going into or out of the logic pins.

6.4 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)
MIN NOM MAX UNIT
VCC Supply voltage 3 5.5 V
VIO I/O supply voltage (devices with VIO pin) 1.65 VCC V
VIH High-level input voltage (D, DE, RE)
devices with VIO pin

 0.7 1 VIO
VIL Low-level input voltage (D, DE, RE) 0 0.3 VIO
VIH High-level input voltage (D, DE, RE) devices without VIO pin 0.7 1 VCC
VIL Low-level input voltage (D, DE, RE) 0 0.3 VCC
VI Input voltage at any bus terminal (separately or common mode)(1) –25 25 V
VID Differential input voltage –25 25 V
IO Output current, driver –60 60 mA
IOR Output current, receiver VIO = 1.8V or 2.5V (devices with VIO pin) –4 4 mA
IOR Output current, receiver VIO = 3.3V or 5V (devices with VIO pin) or VCC = 3.3V or 5V (devices without VIO pin) –8 8 mA
RL Differential load resistance 54 60 Ω
1/tUI Signaling rate THVD2419  250 kbps
THVD2429 20 Mbps
TA Operating ambient temperature -40 125 °C
TJ Junction temperature  -40 150 °C
(1) The algebraic convention, in which the least positive (most negative) limit is designated as minimum is used in this data sheet.

6.5 Thermal Information

THERMAL METRIC(1) THVD2419, THVD2429 UNIT
DRC (VSON) D (SOIC)
10 PINS 8 PINS
RθJA Junction-to-ambient thermal resistance 65.2 117.2 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 41.7 40.2 °C/W
RθJB Junction-to-board thermal resistance 36.4 65.3 °C/W
ψJT Junction-to-top characterization parameter 1.4 3.3 °C/W
ψJB Junction-to-board characterization parameter 36.3 64.4 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance 24.9 N/A °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.

6.6 Power Dissipation

PARAMETER TEST CONDITIONS VALUE UNIT
PD Driver and receiver enabled, 
VCC = 5.5 V, TA = 125 °C,
square wave at 50% duty cycle		 Unterminated
RL = 300Ω, CL = 50pF (driver)		 THVD2419 250kbps 180 mW
THVD2429 20Mbps 310
RS-422 load
RL = 100Ω, CL = 50pF (driver)		 THVD2419 250kbps 180 mW
THVD2429 20Mbps 310
RS-485 load
RL = 54Ω, CL = 50pF (driver)		 THVD2419 250kbps 270 mW
THVD2429 20Mbps 325

6.7 Electrical Characteristics

over operating free-air temperature range (unless otherwise noted). All typical values are at 25°C and supply voltage of VCC = 5V, VIO = 3.3V , unless otherwise noted.  
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
Driver
|VOD| Driver differential output voltage magnitude RL = 60Ω, –25V ≤ Vtest ≤ 25V (See Figure 7-1) 1.5 2.8 V
RL = 60Ω, –25V ≤ Vtest ≤ 25V, 4.5V ≤ VCC ≤ 5.5V (See Figure 7-1) 2.1 3.3 V
RL = 100Ω (See Figure 7-2) 2 2.9 V
RL = 54Ω (See Figure 7-2) 1.5 2.5 V
Δ|VOD| Change in differential output voltage RL = 54Ω or 100Ω (See Figure 7-2) –50 50 mV
VOC Common-mode output voltage 1 VCC/2 3 V
ΔVOC(SS) Change in steady-state common-mode output voltage –50 50 mV
IOS Short-circuit output current DE = VIO, -42V ≤ (VA or VB) ≤42 V, or A shorted to B   –250 250 mA
Receiver
II Bus input current DE = 0V, VCC and VIO = 0V or 5.5V VI = 12V 90 125 μA
VI = 25V 200 250 μA
VI = –7V –100 –80 μA
VI = –25V –350 –240 μA
VTH+ Positive-going input threshold voltage(1) Over common-mode range of ± 25V 20 125 200 mV
VTH- Negative-going input threshold voltage(1) –200 –125 -20 mV
VHYS Input hysteresis 250 mV
VTH_FSH Input fail-safe threshold –20 20 mV
CA,B Input differential capacitance Measured between A and B, f = 1MHz 50 pF
VOH Output high voltage IOH = –8mA, VIO = 3 to 3.6V or 4.5V to 5.5V VIO – 0.4 VIO – 0.2 V
VOL Output low voltage IOL = 8mA, VIO = 3 to 3.6V or 4.5V to 5.5V 0.2 0.4 V
VOH Output high voltage IOH = –4mA, VIO = 1.65 to 1.95V or 2.25V to 2.75V VIO – 0.4 VIO – 0.2 V
VOL Output low voltage IOL = 4mA, VIO = 1.65 to 1.95V or 2.25V to 2.75V 0.2 0.4 V
IOZ Output high-impedance current, R pin VO = 0V or VIO, RE = VIO –1 1 µA
Logic
IIN Input current (DE , SLR) DRC: 1.65V ≤ VIO ≤ 5.5V, 0V ≤ VIN ≤ VIO
D: 3V  ≤ VCC ≤ 5.5V, 0 V ≤ VIN ≤ 5.5V		 5 µA
IIN Input current (D, RE) DRC: 1.65V ≤ VIO ≤ 5.5V, 0V ≤ VIN ≤ VIO
D: 3V  ≤ VCC ≤ 5.5V, 0 V ≤ VIN ≤ 5.5V		 –5 µA
Thermal Protection
TSHDN Thermal shutdown threshold Temperature rising 150 180 °C
THYS Thermal shutdown hysteresis 10 °C
Supply
UVVCC (rising) Rising under-voltage threshold on VCC 2.3 2.6 V
UVVCC (falling) Falling under-voltage threshold on VCC 1.95 2.2 V
UVVCC(hys) Hysteresis on under-voltage of VCC 150 mV
UVVIO (rising) Rising under-voltage threshold on VIO 1.4 1.6 V
UVVIO (falling) Falling under-voltage threshold on VIO 1.2 1.3 V
UVVIO(hys) Hysteresis on under-voltage of VIO 120 mV
ICC Supply current (quiescent), VCC = 4.5 V to 5.5 V Driver and receiver enabled RE = 0V, DE = VIO, No load 3.5 5.7 mA
Driver enabled, receiver disabled RE = VIO, DE = VIO, No load 2.5 4.4 mA
Driver disabled, receiver enabled RE = 0V, DE = 0V, No load 1.8 2.4 mA
Driver and receiver disabled (devices without VIO pin) RE = VCC, DE = 0V, D = open, No load 1.7 5 µA
Driver and receiver disabled (devices  with VIO pin) RE = VIO, DE = 0V, D = open, No load 0.1 3 µA
ICC Supply current (quiescent), VCC = 3 V to 3.6 V Driver and receiver enabled RE = 0V, DE = VIO, No load 3 4.6 mA
Driver enabled, receiver disabled RE = VIO, DE = VIO, No load 2.2 3.3 mA
Driver disabled, receiver enabled RE = 0V, DE = 0V, No load 1.6 2.2 mA
Driver and receiver disabled (Devices without VIO pin) RE = VCC, DE = 0V, D = open, No load 1 4 µA
Driver and receiver disabled (Devices  with VIO pin) RE = VIO, DE = 0V, D = open, No load 1 2 µA
IIO Logic supply current (quiescent), VIO = 3 to 3.6 V, Devices with VIO pin Driver disabled, Receiver enabled DE = 0V, RE = 0V, No load 3.3 8.4 µA
Driver disabled, Receiver disabled DE = 0V, RE = VIO, No load 0.1 2 µA
(1) Under any specific conditions, VTH+ is assured to be at least VHYS higher than VTH–.

6.8 Switching Characteristics 250kbps

250kbps (THVD2419) over recommended operating conditions. All typical values are at 25°C and supply voltage of VCC = 5V , VIO = 3.3V, unless otherwise noted. (1) 
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
Driver
tr, tf Differential output rise/fall time RL = 54 Ω, CL = 50 pF 
See Figure 7-3		 VCC = 3 to 3.6V, Typical at 3.3V 400 625 1200 ns
VCC = 4.5 to 5.5V, Typical at 5V 500 725 1200 ns
tPHL, tPLH Propagation delay RL = 54 Ω, CL = 50 pF 
See Figure 7-3		 510 750 ns
tSK(P) Pulse skew, |tPHL – tPLH| 5 70 ns
tPHZ, tPLZ Disable time See Figure 7-4 and Figure 7-5 RE = X 45 75 ns
tPZH, tPZL Enable time RE = 0V 80 290 ns
RE = VIO  2.5 4.5 µs
tSHDN Time to shutdown RE = VIO 50 500 ns
Receiver
tr, tf Output rise/fall time CL = 15 pF
See Figure 7-6		 3 20 ns
tPHL, tPLH Propagation delay 750 1270 ns
tSK(P) Pulse skew, |tPHL – tPLH| 5 45 ns
tPHZ, tPLZ Disable time DE = X 30 40 ns
tPZH(1) Enable time 80 130 ns
tPZL(1) Enable time See Figure 7-7 800 1320 ns
tPZH(2),
tPZL(2)		 Enable time See Figure 7-8 DE = 0V 3 5.4 μs
tD(OFS) Delay to enter fail-safe operation See Figure 7-9 CL = 15pF 7 11 18 μs
tD(FSO) Delay to exit fail-safe operation 540 750 1260 ns
tSHDN Time to shutdown See Figure 7-8 DE = 0V 50 500 ns
(1) A, B are driver output and receiver input terminals for Half duplex devices. A, B are RX input, Y/Z are driver output terminals for Full duplex device

6.9 Switching Characteristics 20Mbps

20Mbps (THVD2429) over recommended operating conditions. All typical values are at 25°C and supply voltage of VCC = 5 V, VIO = 3.3 V, unless otherwise noted. (1) 
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
Driver
tr, tf Differential output rise/fall time RL = 54Ω, CL = 50pF
See Figure 7-3		 3.5 5 15 ns
tPHL, tPLH Propagation delay RL = 54Ω, CL = 50pF
See Figure 7-3		 6 15 30 ns
tSK(P) Pulse skew, |tPHL – tPLH| RL = 54Ω, CL = 50pF
See Figure 7-3		 0.5 3 ns
tPHZ, tPLZ Disable time See Figure 7-4 and Figure 7-5 RE = X 20 35 ns
tPZH, tPZL Enable time RE = 0V 16 40 ns
RE = VIO 2.5 4.5 μs
tSHDN Time to shutdown RE = VIO 50 500 ns
Receiver
tr, tf Output rise/fall time CL = 15pF, See Figure 7-6 1.5 6 ns
tPHL, tPLH Propagation delay 25 35 60 ns
tSK(P) Pulse skew, |tPHL – tPLH| 5.5 ns
tPHZ, tPLZ Disable time DE = X 18 25 ns
tPZH(1),
tPZL(1)		 Enable time See Figure 7-7 DE = VIO 55 82 ns
tPZH(2),
tPZL(2)		 Enable time See Figure 7-8 DE = 0V 2.5 4.5 μs
tD(OFS) Delay to enter fail-safe operation See Figure 7-9 CL = 15pF 7 10 18 μs
tD(FSO) Delay to exit fail-safe operation 19 35 50 ns
tSHDN Time to shutdown See Figure 7-8 DE = 0V 50 500 ns
(1) A, B are driver output and receiver input terminals for Half duplex devices. A, B are RX input, Y/Z are driver output terminals for Full duplex device

6.10 Typical Characteristics

THVD2419 THVD2429 Driver Output Voltage vs Driver Output Current
DE = VIO or VCCD = 0VTA = 25°C
Figure 6-1 Driver Output Voltage vs Driver Output Current
THVD2419 THVD2429 Driver Output Current vs Supply Voltage
TA = 25°CRL = 54ΩDE = D = VIO or VCC
Figure 6-3 Driver Output Current vs Supply Voltage
THVD2419 THVD2429 THVD2419 Driver Propagation Delay vs Temperature
DE = VIO or VCCRL = 54ΩCL = 50pF
Figure 6-5 THVD2419 Driver Propagation Delay vs Temperature
THVD2419 THVD2429 THVD2429 Driver Propagation Delay vs Temperature
DE = VIO or VCCRL = 50ΩCL = 50pF
Figure 6-7 THVD2429 Driver Propagation Delay vs Temperature
THVD2419 THVD2429 THVD2429 Supply Current vs Signal Rate
TA = 25°CRL = 54Ω
Figure 6-9 THVD2429 Supply Current vs Signal Rate
THVD2419 THVD2429 Driver Differential Output voltage vs Driver Output Current
DE = VIO or VCCD = 0VTA= 25°C
Figure 6-2 Driver Differential Output voltage vs Driver Output Current
THVD2419 THVD2429 THVD2419 Driver Rise or Fall Time vs Temperature
DE = VIO or VCCRL = 54ΩCL = 50pF
Figure 6-4 THVD2419 Driver Rise or Fall Time vs Temperature
THVD2419 THVD2429 THVD2419 Supply Current vs Signal Rate
TA = 25°CRL = 54Ω
Figure 6-6 THVD2419 Supply Current vs Signal Rate
THVD2419 THVD2429 THVD2429 Driver Rise or Fall Time vs Temperature
DE = VIO or VCCRL = 50ΩCL = 50pF
Figure 6-8 THVD2429 Driver Rise or Fall Time vs Temperature

7 Parameter Measurement Information

Note: Note: Digital input/output supply in the diagrams below could either be VCC (devices without VIO pin) or VIO (devices with VIO pin)
THVD2419 THVD2429 Measurement of Driver Differential Output Voltage With Common-Mode LoadFigure 7-1 Measurement of Driver Differential Output Voltage With Common-Mode Load
THVD2419 THVD2429 Measurement of Driver Differential and Common-Mode Output With RS-485 LoadFigure 7-2 Measurement of Driver Differential and Common-Mode Output With RS-485 Load
THVD2419 THVD2429 Measurement of Driver Differential Output Rise and Fall Times and Propagation DelaysFigure 7-3 Measurement of Driver Differential Output Rise and Fall Times and Propagation Delays
THVD2419 THVD2429 Measurement of Driver Enable and Disable Times With Active High Output and Pull-Down LoadFigure 7-4 Measurement of Driver Enable and Disable Times With Active High Output and Pull-Down Load
THVD2419 THVD2429 Measurement of Driver Enable and Disable Times With Active Low Output and Pull-up LoadFigure 7-5 Measurement of Driver Enable and Disable Times With Active Low Output and Pull-up Load
THVD2419 THVD2429 Measurement of Receiver Output Rise and Fall Times and Propagation DelaysFigure 7-6 Measurement of Receiver Output Rise and Fall Times and Propagation Delays
THVD2419 THVD2429 Measurement of Receiver Enable/Disable Times With Driver EnabledFigure 7-7 Measurement of Receiver Enable/Disable Times With Driver Enabled
THVD2419 THVD2429 Measurement of Receiver Enable Times With Driver DisabledFigure 7-8 Measurement of Receiver Enable Times With Driver Disabled
THVD2419 THVD2429 Fail-Safe Delay MeasurementsFigure 7-9 Fail-Safe Delay Measurements

8 Detailed Description

8.1 Overview

THVD24x9 devices are surge-protected, half duplex RS-485 transceivers available in two speed grades suitable for data transmission up to 250kbps and 20Mbps respectively. Surge protection is achieved by integrating transient voltage suppressor (TVS) diodes in the standard 8-pin SOIC (D) package and a small 10-pin leadless package.

THVD2419 and THVD2429 devices have active-high driver enables and active-low receiver enables. A low standby current can be achieved by disabling both driver and receiver.

8.2 Functional Block Diagrams

THVD2419 THVD2429 THVD2419 and THVD2429 Block Diagram (SOIC Package)Figure 8-1 THVD2419 and THVD2429 Block Diagram (SOIC Package)
THVD2419 THVD2429 THVD2419 and THVD2429 Block Diagram (VSON Package)Figure 8-2 THVD2419 and THVD2429 Block Diagram (VSON Package)

 
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