ZHCSN33C November   2017  – December 2024 DLP550JE

PRODUCTION DATA  

  1.   1
  2. 1 特性
  3. 2 应用
  4. 3 说明
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  Storage Conditions
    3. 5.3  ESD Ratings
    4. 5.4  Recommended Operating Conditions
    5. 5.5  Thermal Information
    6. 5.6  Electrical Characteristics
    7. 5.7  Timing Requirements
    8. 5.8  Window Characteristics
    9. 5.9  System Mounting Interface Loads
    10. 5.10 Micromirror Array Physical Characteristics
    11. 5.11 Micromirror Array Optical Characteristics
    12. 5.12 Chipset Component Usage Specification
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Feature Description
      1. 6.2.1 Power Interface
      2. 6.2.2 Timing
    3. 6.3 Optical Interface and System Image Quality Considerations
      1. 6.3.1 Numerical Aperture and Stray Light Control
      2. 6.3.2 Pupil Match
      3. 6.3.3 Illumination Overfill
    4. 6.4 Micromirror Array Temperature Calculation
      1. 6.4.1 Micromirror Array Temperature Calculation
    5. 6.5 Micromirror Power Density Calculation
    6. 6.6 Micromirror Landed-on/Landed-Off Duty Cycle
      1. 6.6.1 Definition of Micromirror Landed-On/Landed-Off Duty Cycle
      2. 6.6.2 Landed Duty Cycle and Useful Life of the DMD
      3. 6.6.3 Landed Duty Cycle and Operational DMD Temperature
      4. 6.6.4 Estimating the Long-Term Average Landed Duty Cycle of a Product or Application
  8. 7 Application and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Application
      1. 7.2.1 Design Requirements
      2. 7.2.2 Detailed Design Procedure
  9. 8 Power Supply Recommendations
    1. 8.1 DMD Power-Up and Power-Down Procedures
  10. 9 Device and Documentation Support
    1. 9.1 Device Support
      1. 9.1.1 第三方产品免责声明
      2. 9.1.2 Device Nomenclature
      3. 9.1.3 Device Markings
    2. 9.2 支持资源
      1. 9.2.1 Related Documentation
    3. 9.3 接收文档更新通知
    4. 9.4 Trademarks
    5. 9.5 静电放电警告
    6. 9.6 术语表
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

5.1 Absolute Maximum Ratings

Over operating free-air temperature range (unless otherwise noted)(7)
MINMAXUNIT
SUPPLY VOLTAGES
VCCSupply voltage for LVCMOS core logic(1)–0.54V
VCCISupply voltage for LVDS Interface(1)–0.54V
VOFFSETMicromirror Electrode and HVCMOS voltage(1)(2)–0.59V
VMBRSTVoltage applied to MBRST[0:15] Input Pins–2828V
|VCC – VCCI|Supply voltage change(3)0.3V
INPUT VOLTAGES
Input voltage for all other input pins(1)–0.5VCC + 0.3V
|VID|Input differential voltage (absolute value) (4)700mV
CLOCKS
ƒclockClock frequency for LVDS interface, DCLK_A400MHz
ƒclockClock frequency for LVDS interface, DCLK_B400MHz
ENVIRONMENTAL
TARRAY and TWINDOWTemperature, operating(5)090°C
Temperature, non-operating (5)–4090°C
|TDELTA|Absolute Temperature delta between any point on the window edge and the ceramic test point TP1(6)30°C
TDPDew Point Temperature, operating and non-operating (non-condensing)81°C
(1) All voltages are referenced to common ground VSS. Voltages VCC, VCCI, and VOFFSET are required for proper DMD operation. VSS must also be connected.
(2) VOFFSET supply transients must fall within specified voltages.
(3) Exceeding the recommended allowable absolute voltage difference between VCC and VCCI may result in excess current draw.
(4) This maximum LVDS input voltage rating applies when each input of a differential pair is at the same voltage potential.
(5) The highest temperature of the active array (as calculated by the Section 6.4) or of any point along the Window Edge as defined in Figure 6-1. The locations of thermal test points TP2, TP3, TP4, and TP5 in Figure 6-1 are intended to measure the highest window edge temperature. If a particular application causes another point on the window edge to be at a higher temperature, that point should be used.
(6) Temperature delta is the highest difference between the ceramic test point 1 (TP1) and anywhere on the window edge as shown in Figure 6-1. The window test points TP2, TP3, TP4, and TP5 shown in Figure 6-1 are intended to result in the worst-case delta. If a particular application causes another point on the window edge to result in a larger delta temperature, that point should be used.
(7) Stresses beyond those listed under Section 5.1 may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Section 5.4. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.