9 Revision History
Changes from Revision C (March 2022) to Revision D (October 2024)
- 将特性 中 SEL 特性的英文说明从“SEL immune”更改为“SEL resilient”;另请参阅耐辐射性能
Go
- 为清晰起见,更新了器件信息 表的表注Go
- Changed LID pin description to clarify connections between thermal
pad, metal lid, and device substrate in Pin Functions
tableGo
- Updated table note 1 in Absolute Maximum Ratings
Go
- Changed differential voltage parameter to input differential voltage, per channel, added clarifying table note, changed maximum value from (V+) – (V–) + 0.3 to 0.3 V, and added minimum value of –0.3 V, in Absolute Maximum Ratings
Go
- Added "flight model post-HDR exposure" condition, with minimum value of 82dB, to "power-supply rejection ratio"Go
- Added "flight model post-TID exposure" condition, with maximum value of ±400 pA, to "input bias current"Go
- Added table note to "common-mode voltage", clarifying input differential voltage limitationsGo
- Added "flight model post-HDR exposure" condition, with minimum value of 82 dB, to "power-supply rejection ratio"Go
- Added "flight model post-TID exposure" condition, with maximum value of ±400 pA, to "input bias current"Go
- Added table note to "common-mode voltage", clarifying input differential voltage limitations, and added "TA = –55°C to +125°C" conditionGo
- Changed description of TID RLAT levels from 30-krad, 50-krad, and
100-krad, to 100-krad(Si) in Radiation Hardened
Performance
Go
- Changed description of NDD test levels from 15 units irradiated up
to 1 × 1012 n/cm2, to 12 units irradiated up to 1 ×
1013 n/cm2, and summarized test results in
Radiation Hardened Performance
Go
- Added discussion of application-specific SEE concerns in
Radiation Hardened Performance
Go
- Changed decoupling capacitor guidance from "10-nF to 1-µF" to "1nF
to 100nF" in Power Supply Recommendations
Go
- Added text discussing bulk decoupling capacitance isolation for
SEE-mitigation in Power Supply Recommendations
Go
- Added guidance regarding power pad and lid metalization to Layout
Guidelines
Go
- Deleted "LMP7704-SP Example Layout for a Single Channel" figure, and
replaced with "LMP7704-SP Example Layout" figure, in Layout
Example
Go
- Added "LMP7704-SP Supply Decoupling Capacitance Example Layout" figure in Layout
Example
Go
- Added Related Documentation sectionGo
- Deleted outdated and incorrect HBH0014A package outline drawing from
Mechanical, Packaging, and Orderable Information
Go
Changes from Revision B (September 2021) to Revision C (March 2022)
- 将 5962R1920601VXC 飞行模型从预发布更改为量产数据(正在供货)Go
- 删除了器件信息 表中已淘汰的 5962-1920601VXC 飞行模型Go
Changes from Revision A (January 2021) to Revision B (September 2021)
- 将器件状态从“预告信息(预发布)”更改为“量产数据(正在供货)”Go