ZHCSN30D December   2020  – October 2024 LMP7704-SP

PRODUCTION DATA  

  1.   1
  2. 特性
  3. 应用
  4. 说明
  5. Pin Configuration and Functions
  6. Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics VS = 5 V
    6. 5.6 Electrical Characteristics VS = 10 V
    7. 5.7 Typical Characteristics
  7. Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Radiation Hardened Performance
      2. 6.3.2 Engineering Model (Devices With /EM Suffix)
      3. 6.3.3 Diodes Between the Inputs
      4. 6.3.4 Capacitive Load
      5. 6.3.5 Input Capacitance
    4. 6.4 Device Functional Modes
      1. 6.4.1 Precision Current Source
  8. Application and Implementation
    1. 7.1 Application Information
      1. 7.1.1 Low Input Voltage Noise
      2. 7.1.2 Total Noise Contribution
    2. 7.2 Typical Application
      1. 7.2.1 Design Requirements
      2. 7.2.2 Detailed Design Procedure
      3. 7.2.3 Application Curves
    3. 7.3 Power Supply Recommendations
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
      2. 7.4.2 Layout Example
  9. Device and Documentation Support
    1. 8.1 Related Documentation
    2. 8.2 接收文档更新通知
    3. 8.3 支持资源
    4. 8.4 Trademarks
    5. 8.5 静电放电警告
    6. 8.6 术语表
  10. Revision History
  11. 10Mechanical, Packaging, and Orderable Information

Revision History

Changes from Revision C (March 2022) to Revision D (October 2024)

  • 特性 中 SEL 特性的英文说明从“SEL immune”更改为“SEL resilient”;另请参阅耐辐射性能 Go
  • 为清晰起见,更新了器件信息 表的表注Go
  • Changed LID pin description to clarify connections between thermal pad, metal lid, and device substrate in Pin Functions tableGo
  • Updated table note 1 in Absolute Maximum Ratings Go
  • Changed differential voltage parameter to input differential voltage, per channel, added clarifying table note, changed maximum value from (V+) – (V–) + 0.3 to 0.3 V, and added minimum value of –0.3 V, in Absolute Maximum Ratings Go
  • Added "flight model post-HDR exposure" condition, with minimum value of 82dB, to "power-supply rejection ratio"Go
  • Added "flight model post-TID exposure" condition, with maximum value of ±400 pA, to "input bias current"Go
  • Added table note to "common-mode voltage", clarifying input differential voltage limitationsGo
  • Added "flight model post-HDR exposure" condition, with minimum value of 82 dB, to "power-supply rejection ratio"Go
  • Added "flight model post-TID exposure" condition, with maximum value of ±400 pA, to "input bias current"Go
  • Added table note to "common-mode voltage", clarifying input differential voltage limitations, and added "TA = –55°C to +125°C" conditionGo
  • Changed description of TID RLAT levels from 30-krad, 50-krad, and 100-krad, to 100-krad(Si) in Radiation Hardened Performance Go
  • Changed description of NDD test levels from 15 units irradiated up to 1 × 1012 n/cm2, to 12 units irradiated up to 1 × 1013 n/cm2, and summarized test results in Radiation Hardened Performance Go
  • Added discussion of application-specific SEE concerns in Radiation Hardened Performance Go
  • Changed decoupling capacitor guidance from "10-nF to 1-µF" to "1nF to 100nF" in Power Supply Recommendations Go
  • Added text discussing bulk decoupling capacitance isolation for SEE-mitigation in Power Supply Recommendations Go
  • Added guidance regarding power pad and lid metalization to Layout Guidelines Go
  • Deleted "LMP7704-SP Example Layout for a Single Channel" figure, and replaced with "LMP7704-SP Example Layout" figure, in Layout Example Go
  • Added "LMP7704-SP Supply Decoupling Capacitance Example Layout" figure in Layout Example Go
  • Added Related Documentation sectionGo
  • Deleted outdated and incorrect HBH0014A package outline drawing from Mechanical, Packaging, and Orderable Information Go

Changes from Revision B (September 2021) to Revision C (March 2022)

  • 将 5962R1920601VXC 飞行模型从预发布更改为量产数据(正在供货)Go
  • 删除了器件信息 表中已淘汰的 5962-1920601VXC 飞行模型Go

Changes from Revision A (January 2021) to Revision B (September 2021)

  • 将器件状态从“预告信息(预发布)”更改为“量产数据(正在供货)”Go