ZHCSMM8A December   2020  – June 2021 TLV320ADC3120

PRODUCTION DATA  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 Revision History
  5. 5 Device Comparison Table
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  Recommended Operating Conditions
    4. 7.4  Thermal Information
    5. 7.5  Electrical Characteristics
    6. 7.6  Timing Requirements: I2C Interface
    7. 7.7  Switching Characteristics: I2C Interface
    8. 7.8  Timing Requirements: TDM, I2S or LJ Interface
    9. 7.9  Switching Characteristics: TDM, I2S or LJ Interface
    10. 7.10 Timing Requirements: PDM Digital Microphone Interface
    11. 7.11 Switching Characteristics: PDM Digital Microphone Interface
    12. 7.12 Timing Diagrams
    13. 7.13 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1  Serial Interfaces
        1. 8.3.1.1 Control Serial Interfaces
        2. 8.3.1.2 Audio Serial Interfaces
          1. 8.3.1.2.1 Time Division Multiplexed Audio (TDM) Interface
          2. 8.3.1.2.2 Inter IC Sound (I2S) Interface
          3. 8.3.1.2.3 Left-Justified (LJ) Interface
        3. 8.3.1.3 Using Multiple Devices With Shared Buses
      2. 8.3.2  Phase-Locked Loop (PLL) and Clock Generation
      3. 8.3.3  Input Channel Configurations
      4. 8.3.4  Reference Voltage
      5. 8.3.5  Programmable Microphone Bias
      6. 8.3.6  Signal-Chain Processing
        1. 8.3.6.1 Programmable Channel Gain and Digital Volume Control
        2. 8.3.6.2 Programmable Channel Gain Calibration
        3. 8.3.6.3 Programmable Channel Phase Calibration
        4. 8.3.6.4 Programmable Digital High-Pass Filter
        5. 8.3.6.5 Programmable Digital Biquad Filters
        6. 8.3.6.6 Programmable Channel Summer and Digital Mixer
        7. 8.3.6.7 Configurable Digital Decimation Filters
          1. 8.3.6.7.1 Linear Phase Filters
            1. 8.3.6.7.1.1 Sampling Rate: 7.35 kHz to 8 kHz
            2. 8.3.6.7.1.2 Sampling Rate: 14.7 kHz to 16 kHz
            3. 8.3.6.7.1.3 Sampling Rate: 22.05 kHz to 24 kHz
            4. 8.3.6.7.1.4 Sampling Rate: 29.4 kHz to 32 kHz
            5. 8.3.6.7.1.5 Sampling Rate: 44.1 kHz to 48 kHz
            6. 8.3.6.7.1.6 Sampling Rate: 88.2 kHz to 96 kHz
            7. 8.3.6.7.1.7 Sampling Rate: 176.4 kHz to 192 kHz
            8. 8.3.6.7.1.8 Sampling Rate: 352.8 kHz to 384 kHz
            9. 8.3.6.7.1.9 Sampling Rate: 705.6 kHz to 768 kHz
          2. 8.3.6.7.2 Low-Latency Filters
            1. 8.3.6.7.2.1 Sampling Rate: 14.7 kHz to 16 kHz
            2. 8.3.6.7.2.2 Sampling Rate: 22.05 kHz to 24 kHz
            3. 8.3.6.7.2.3 Sampling Rate: 29.4 kHz to 32 kHz
            4. 8.3.6.7.2.4 Sampling Rate: 44.1 kHz to 48 kHz
            5. 8.3.6.7.2.5 Sampling Rate: 88.2 kHz to 96 kHz
            6. 8.3.6.7.2.6 Sampling Rate: 176.4 kHz to 192 kHz
          3. 8.3.6.7.3 Ultra-Low Latency Filters
            1. 8.3.6.7.3.1 Sampling Rate: 14.7 kHz to 16 kHz
            2. 8.3.6.7.3.2 Sampling Rate: 22.05 kHz to 24 kHz
            3. 8.3.6.7.3.3 Sampling Rate: 29.4 kHz to 32 kHz
            4. 8.3.6.7.3.4 Sampling Rate: 44.1 kHz to 48 kHz
            5. 8.3.6.7.3.5 Sampling Rate: 88.2 kHz to 96 kHz
            6. 8.3.6.7.3.6 Sampling Rate: 176.4 kHz to 192 kHz
            7. 8.3.6.7.3.7 Sampling Rate: 352.8 kHz to 384 kHz
      7. 8.3.7  Automatic Gain Controller (AGC)
      8. 8.3.8  Voice Activity Detection (VAD)
      9. 8.3.9  Digital PDM Microphone Record Channel
      10. 8.3.10 Interrupts, Status, and Digital I/O Pin Multiplexing
    4. 8.4 Device Functional Modes
      1. 8.4.1 Sleep Mode or Software Shutdown
      2. 8.4.2 Active Mode
      3. 8.4.3 Software Reset
    5. 8.5 Programming
      1. 8.5.1 Control Serial Interfaces
        1. 8.5.1.1 I2C Control Interface
          1. 8.5.1.1.1 General I2C Operation
          2. 8.5.1.1.2 I2C Single-Byte and Multiple-Byte Transfers
            1. 8.5.1.1.2.1 I2C Single-Byte Write
            2. 8.5.1.1.2.2 I2C Multiple-Byte Write
            3. 8.5.1.1.2.3 I2C Single-Byte Read
            4. 8.5.1.1.2.4 I2C Multiple-Byte Read
    6. 8.6 Register Maps
      1. 8.6.1 Device Configuration Registers
        1. 8.6.1.1 TLV320ADC3120 Access Codes
      2. 8.6.2 Page 0 Registers
      3. 8.6.3 Page 1 Registers
      4. 8.6.4 Programmable Coefficient Registers
        1. 8.6.4.1 Programmable Coefficient Registers: Page 2
        2. 8.6.4.2 Programmable Coefficient Registers: Page 3
        3. 8.6.4.3 Programmable Coefficient Registers: Page 4
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Applications
      1. 9.2.1 Two-Channel Analog Microphone Recording
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
          1. 9.2.1.2.1 Example Device Register Configuration Script for EVM Setup
        3. 9.2.1.3 Application Curves
      2. 9.2.2 Four-Channel Digital PDM Microphone Recording
        1. 9.2.2.1 Design Requirements
        2. 9.2.2.2 Detailed Design Procedure
          1. 9.2.2.2.1 Example Device Register Configuration Script for EVM Setup
    3. 9.3 What to Do and What Not to Do
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 接收文档更新通知
    3. 12.3 支持资源
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 术语表
  13. 13Mechanical, Packaging, and Orderable Information

3 说明

TLV320ADC3120 是一款高性能 Burr-Brown™ 音频模数转换器 (ADC)，最多可支持对脉冲密度调制 (PDM) 麦克风输入的两个模拟通道或四个数字通道进行同步采样。该器件支持线路和麦克风输入，并允许单端和差分输入配置。该器件集成了可编程通道增益、数字音量控制、可编程麦克风偏置电压、锁相环 (PLL)、可编程高通滤波器 (HPF)、双二阶滤波器、低延迟滤波器模式，并可实现高达 768kHz 的采样率，并可实现高达 192kHz 的采样率。该器件支持时分多路复用 (TDM)、I2S 或左平衡 (LJ) 音频格式，并可通过 I2C 接口进行控制。这些集成的高性能特性，以及采用 3.3V 或 1.8 V 单电源供电的功能，使该器件非常适用于远场麦克风录音应用中空间受限的音频系统。

TLV320ADC3120 的额定工作温度范围为 –40°C 至 +125°C，并且采用 20 引脚 WQFN 封装。

器件信息(1)
器件型号 封装 封装尺寸（标称值）
TLV320ADC3120 WQFN (20) 3.00mm × 3.00mm，间距为 0.5mm
(1) 如需了解所有可用封装，请参阅数据表末尾的封装选项附录。
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