ZHCSMK3B November   2020  – November 2021 ADS131B04-Q1

PRODUCTION DATA  

  1. 特性
  2. 应用
  3. 说明
  4. Revision History
  5. Pin Configuration and Functions
  6. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Requirements
    7. 6.7 Switching Characteristics
    8. 6.8 Timing Diagrams
    9. 6.9 Typical Characteristics
  7. Parameter Measurement Information
    1. 7.1 Noise Measurements
  8. Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1  Input ESD Protection Circuitry
      2. 8.3.2  Input Multiplexer
      3. 8.3.3  Programmable Gain Amplifier (PGA)
      4. 8.3.4  Voltage Reference
      5. 8.3.5  Internal Test Signals
      6. 8.3.6  Clocking
        1. 8.3.6.1 External Clock Using CLKIN Pin
        2. 8.3.6.2 Internal Oscillator
      7. 8.3.7  ΔΣ Modulator
      8. 8.3.8  Digital Filter
        1. 8.3.8.1 Digital Filter Implementation
          1. 8.3.8.1.1 Fast-Settling Filter
          2. 8.3.8.1.2 SINC3 and SINC3 + SINC1 Filter
        2. 8.3.8.2 Digital Filter Characteristic
      9. 8.3.9  Calibration Registers
      10. 8.3.10 Register Map CRC
    4. 8.4 Device Functional Modes
      1. 8.4.1 Power-Up and Reset
        1. 8.4.1.1 Power-On Reset
        2. 8.4.1.2 SYNC/RESET Pin
        3. 8.4.1.3 RESET Command
      2. 8.4.2 Fast Start-Up Behavior
      3. 8.4.3 Conversion Modes
        1. 8.4.3.1 Continuous-Conversion Mode
        2. 8.4.3.2 Global-Chop Mode
      4. 8.4.4 Power Modes
      5. 8.4.5 Standby Mode
      6. 8.4.6 Synchronization
    5. 8.5 Programming
      1. 8.5.1 Serial Interface
        1. 8.5.1.1  Chip Select (CS)
        2. 8.5.1.2  Serial Data Clock (SCLK)
        3. 8.5.1.3  Serial Data Input (DIN)
        4. 8.5.1.4  Serial Data Output (DOUT)
        5. 8.5.1.5  Data Ready (DRDY)
        6. 8.5.1.6  SPI Communication Frames
        7. 8.5.1.7  SPI Communication Words
        8. 8.5.1.8  Short SPI Frames
        9. 8.5.1.9  Communication Cyclic Redundancy Check (CRC)
        10. 8.5.1.10 SPI Timeout
      2. 8.5.2 ADC Conversion Data Format
      3. 8.5.3 Commands
        1. 8.5.3.1 NULL (0000 0000 0000 0000)
        2. 8.5.3.2 RESET (0000 0000 0001 0001)
        3. 8.5.3.3 STANDBY (0000 0000 0010 0010)
        4. 8.5.3.4 WAKEUP (0000 0000 0011 0011)
        5. 8.5.3.5 LOCK (0000 0101 0101 0101)
        6. 8.5.3.6 UNLOCK (0000 0110 0110 0110)
        7. 8.5.3.7 RREG (101a aaaa annn nnnn)
          1. 8.5.3.7.1 Reading a Single Register
          2. 8.5.3.7.2 Reading Multiple Registers
        8. 8.5.3.8 WREG (011a aaaa annn nnnn)
      4. 8.5.4 Collecting Data for the First Time or After a Pause in Data Collection
    6. 8.6 Register Map
  9. Application and Implementation
    1. 9.1 Application Information
      1. 9.1.1 Troubleshooting
      2. 9.1.2 Unused Inputs and Outputs
      3. 9.1.3 Antialias Filter
      4. 9.1.4 Minimum Interface Connections
      5. 9.1.5 Multiple Device Configuration
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Current Shunt Measurement
        2. 9.2.2.2 Battery Pack Voltage Measurement
        3. 9.2.2.3 Shunt Temperature Measurement
        4. 9.2.2.4 Auxiliary Analog Supply Voltage Measurement
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
    1. 10.1 CAP Pin Capacitor Requirement
    2. 10.2 Power-Supply Sequencing
    3. 10.3 Power-Supply Decoupling
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 Receiving Notification of Documentation Updates
    3. 12.3 支持资源
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 术语表
  13. 13Mechanical, Packaging, and Orderable Information

Typical Characteristics

at TA = 25°C, AVDD = 3.3 V, DVDD = 3.3 V, fCLKIN = 8.192 MHz, data rate = 4 kSPS, and gain = 1 (unless otherwise noted)

GUID-20201212-CA0I-X5ZK-69RR-RRMX9DNZK5SL-low.gif
Gain = 8, global-chop mode disabled
Figure 6-4 Offset Error vs Temperature
GUID-20201212-CA0I-NKZD-DXD0-CJJZPRPG5DGC-low.gif
Global-chop mode disabled
Figure 6-6 Offset Error vs Temperature
GUID-20201214-CA0I-MTV2-MGXT-Q9SKFLQSFS3B-low.gif
Including error of internal voltage reference
Figure 6-8 Gain Error vs Temperature
GUID-20201212-CA0I-DMJT-R5LH-LCTTTLQKXSQB-low.gif
Gain = 8, global-chop mode disabled
Figure 6-10 Input-referred Noise vs Temperature
GUID-20201212-CA0I-3CLV-TPV6-KW23TLZ3SMCH-low.gif
Gain = 1, OSR = 1024, all four ADC channels enabled
Figure 6-12 Analog Supply Current vs Temperature
GUID-20201212-CA0I-LB7M-BV5M-7VVNJFPF79DH-low.gif
OSR = 1024
Figure 6-14 Digital Supply Current vs Temperature
GUID-20201212-CA0I-DTC0-G4F7-MFGD6MHF4XDK-low.gif
Gain = 8, global-chop mode enabled
Figure 6-5 Offset Error vs Temperature
GUID-20201212-CA0I-61QW-FFJ4-50RKLKTMRV1Z-low.gif
Global-chop mode enabled
Figure 6-7 Offset Error vs Temperature
Gain = 1, including error of internal voltage reference
 
Figure 6-9 Gain Error Long-Term Drift
 
 
Figure 6-11 Oscillator Frequency Error vs Temperature
GUID-20201212-CA0I-TLDN-8STP-MMQVWV93RBBN-low.gif
Gain = 8, OSR = 1024, all four ADC channels enabled
Figure 6-13 Analog Supply Current vs Temperature
GUID-20201213-CA0I-LN5Q-KST9-KCKKMZ8LNZDH-low.gif
Standby mode
Figure 6-15 Supply Current vs Temperature