• Menu
  • Product
  • Email
  • PDF
  • Order now
  • ADC3660 16 位、0.5 至 65 MSPS、低噪声、低功率双通道 ADC

    • ZHCSM31B September   2020  – March 2022 ADC3660

      PRODUCTION DATA  

  • CONTENTS
  • SEARCH
  • ADC3660 16 位、0.5 至 65 MSPS、低噪声、低功率双通道 ADC
  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics - Power Consumption
    6. 6.6 Electrical Characteristics - DC Specifications
    7. 6.7 Electrical Characteristics - AC Specifications
    8. 6.8 Timing Requirements
    9. 6.9 Typical Characteristics
  7. 7 Parameter Measurement Information
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Analog Input
        1. 8.3.1.1 Analog Input Bandwidth
        2. 8.3.1.2 Analog Front End Design
          1. 8.3.1.2.1 Sampling Glitch Filter Design
          2. 8.3.1.2.2 Analog Input Termination and DC Bias
            1. 8.3.1.2.2.1 AC-Coupling
            2. 8.3.1.2.2.2 DC-Coupling
        3. 8.3.1.3 Auto-Zero Feature
      2. 8.3.2 Clock Input
        1. 8.3.2.1 Single Ended vs Differential Clock Input
        2. 8.3.2.2 Signal Acquisition Time Adjust
      3. 8.3.3 Voltage Reference
        1. 8.3.3.1 Internal voltage reference
        2. 8.3.3.2 External voltage reference (VREF)
        3. 8.3.3.3 External voltage reference with internal buffer (REFBUF)
      4. 8.3.4 Digital Down Converter
        1. 8.3.4.1 DDC MUX
        2. 8.3.4.2 Digital Filter Operation
          1. 8.3.4.2.1 FS/4 Mixing with Real Output
        3. 8.3.4.3 Numerically Controlled Oscillator (NCO) and Digital Mixer
        4. 8.3.4.4 Decimation Filter
        5. 8.3.4.5 SYNC
        6. 8.3.4.6 Output Formatting with Decimation
      5. 8.3.5 Digital Interface
        1. 8.3.5.1 SDR Output Clocking
        2. 8.3.5.2 Output Data Format
        3. 8.3.5.3 Output Formatter
        4. 8.3.5.4 Output Bit Mapper
        5. 8.3.5.5 Output Interface/Mode Configuration
          1. 8.3.5.5.1 Configuration Example
      6. 8.3.6 Test Pattern
    4. 8.4 Device Functional Modes
      1. 8.4.1 Normal Operation
      2. 8.4.2 Power Down Options
      3. 8.4.3 Digital Channel Averaging
    5. 8.5 Programming
      1. 8.5.1 Configuration using PINs only
      2. 8.5.2 Configuration using the SPI interface
        1. 8.5.2.1 Register Write
        2. 8.5.2.2 Register Read
    6. 8.6 Register Maps
      1. 8.6.1 Detailed Register Description
  9. 9 Application and Implementation
    1. 9.1 Typical Application
      1. 9.1.1 Design Requirements
      2. 9.1.2 Detailed Design Procedure
        1. 9.1.2.1 Input Signal Path
        2. 9.1.2.2 Sampling Clock
        3. 9.1.2.3 Voltage Reference
      3. 9.1.3 Application Curves
    2. 9.2 Initialization Set Up
      1. 9.2.1 Register Initialization During Operation
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 支持资源
    2. 12.2 Trademarks
    3. 12.3 Electrostatic Discharge Caution
    4. 12.4 术语表
  13. 13Mechanical, Packaging, and Orderable Information
  14. 重要声明
search No matches found.
  • Full reading width
    • Full reading width
    • Comfortable reading width
    • Expanded reading width
  • Card for each section
  • Card with all content

 

DATA SHEET

ADC3660 16 位、0.5 至 65 MSPS、低噪声、低功率双通道 ADC

本资源的原文使用英文撰写。 为方便起见,TI 提供了译文;由于翻译过程中可能使用了自动化工具,TI 不保证译文的准确性。 为确认准确性,请务必访问 ti.com 参考最新的英文版本(控制文档)。

1 特性

  • 双通道
  • 16 位 65MSPS ADC(最大输出速率 = 31Msps)
  • 本底噪声:-159dBFS/Hz
  • 超低功耗:65MSPS 时为每通道 71mW
  • 16 位,无丢码
  • INL:±2LSB;DNL:±0.2LSB
  • 基准:外部或内部
  • 输入带宽:900MHz (3dB)
  • 工业温度范围:-40°C 至 +105°C
  • 片上数字下变频器
    • 2 倍、4 倍、8 倍、16 倍、32 倍抽取率
    • 32 位 NCO
  • 串行 CMOS 接口
  • 1.8V 单电源
  • 小尺寸: 40 引脚 WQFN (5mm × 5mm) 封装
  • 频谱性能 (fIN = 5MHz):
    • SNR:81.9dBFS
    • SFDR:88dBc HD2、HD3
    • SFDR:102dBFS 最严重毛刺

2 应用

  • 数据采集 (DAQ)
  • 电机诊断和监控
  • 电能质量分析仪
  • 电源品质测定器
  • 声纳
  • 雷达
  • 国防无线电
  • 无线通信
  • 实验室和现场仪表
  • 光谱仪

3 说明

ADC3660 器件是一款低噪声、超低功耗、16 位、65MSPS 双通道高速模数转换器 (ADC)。该器件可实现低功耗,噪声频谱密度为 –159dBFS/Hz,还具有出色的线性度和动态范围。ADC3660 可实现出色的直流精度以及中频采样支持,因此是各种应用的出色选择。该 ADC 在 65MSPS 下的功耗仅为每通道 71mW,功耗随采样率减小而迅速降低。在旁路模式(最高 31MSPS)下,您可以在 1 或 2 个时钟周期后获取输出数据。

ADC3660 使用串行 CMOS (SCMOS) 接口输出数据,可更大限度减少数字互连的次数。该器件提供双通道、单通道和半通道选项。串行 CMOS 接口支持高达 250Mbps 的输出速率,相当于在复杂抽取后大约 15MSPS(双线)到大约 3.75MSPS(0.5 线)的输出速率。因此,ADC3660 可以使用内部抽取滤波器在“过采样和抽取”模式下运行,从而改进动态范围并省去外部抗混叠滤波器。

该器件采用 40 引脚 WQFN 封装(5mm × 5mm),支持 –40 至 +105⁰C 的工业级工作温度范围。

器件信息
器件型号 (1)封装封装尺寸(标称值)
ADC3660WQFN (40)5.00 × 5.00mm
(1) 如需了解所有可用封装,请参阅数据表末尾的封装选项附录。
GUID-20200916-CA0I-7BGT-JT07-0QFDZDD16FBB-low.gifFS = 65MSPS,Fin = 1MHz,16 倍抽取,实时

4 Revision History

Changes from Revision A (October 2020) to Revision B (March 2022)

  • Changed the output clock jitter unit from ps to ps pk-pk in the Timing RequirementsGo
  • Changed the ADC latency CMOS 2-wire NOM value from 1 to 2 and 1/2-wire NOM value from 2 to 1Go
  • Changed Figure 8-3 Go
  • Added GND symbol to REFGND pin for all voltage reference option diagramsGo
  • Added the Output Bit Mapper sectionGo
  • Added default power up configuration summary Table 8-11 Go
  • Updated power-up initialization diagram Figure 9-4 with the correct indexing Go

Changes from Revision * (September 2020) to Revision A (October 2020)

  • Added Updated characterization data for tCD and tDV Go
  • Added condition to resynch during operation to the SYNC sectionGo
  • added wait condition of 200000 clock cyclesGo

5 Pin Configuration and Functions

GUID-D9E1F570-A76B-4210-94AB-8CC82AAAEF43-low.gifFigure 5-1 RSB Package, 40-Pin WQFN
(Top View)
Table 5-1 Pin Descriptions
PINI/ODescription
NameNo.
INPUT/REFERENCE
AINP12IPositive analog input, channel A
AINM13INegative analog input, channel A
BINP39IPositive analog input, channel B
BINM38INegative analog input, channel B
VCM8OCommon-mode voltage output for the analog inputs, 0.95 V
VREF2IExternal voltage reference input, 1.6 V
REFBUF4I1.2V external voltage reference input for use with internal reference buffer. Internal 100 kΩ pull-up resistor to AVDD. This pin is also used to configure default operating conditions.
REFGND3IReference ground input, 0 V
CLOCK
CLKP6IPositive differential sampling clock input for the ADC
CLKM7INegative differential sampling clock input for the ADC
CONFIGURATION
PDN/SYNC1IPower down/Synchronization input. This pin can be configured via the SPI interface. Active high. This pin has an internal 21 kΩ pull-down resistor.
RESET9IHardware reset. Active high. This pin has an internal 21 kΩ pull-down resistor.
SEN16ISerial interface enable. Active low. This pin has an internal 21 kΩ pull-up resistor to AVDD.
SCLK35ISerial interface clock input. This pin has an internal 21 kΩ pull-down resistor.
SDIO10I/OSerial interface data input and output. This pin has an internal 21 kΩ pull-down resistor.
NC17,19,20,22, 29,31,32,34-Do not connect
DIGITAL INTERFACE
DA624OCMOS data output.
DA523OCMOS data output
FCLK18OCMOS frame clock output
DB627OCMOS data output.
DB528OCMOS data output
DCLKIN33ICMOS bit clock input
DCLK25OCMOS bit clock output
POWER SUPPLY
AVDD5,15,36IAnalog 1.8V power supply
GND11,14,37,40, PowerPadIGround, 0V
IOVDD21,30I1.8V power supply for digital interface
IOGND26IGround, 0V for digital interface

6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1)
PARAMETER TEST CONDITIONS MIN MAX UNIT
Supply voltage range, AVDD, IOVDD –0.3 2.1 V
Supply voltage range, GND, IOGND, REFGND –0.3 0.3 V
Voltage applied to input pins AINP/M, BINP/M, CLKP/M –0.3 2.1 V
VREF, REFBUF –0.3 2.1
PDN/SYNC, RESET, SCLK, SEN, SDIO, DCLKIN –0.3 2.1
Junction temperature, TJ 105 °C
Storage temperature, Tstg –65 150 °C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

6.2 ESD Ratings

VALUE UNIT
V(ESD) Electrostatic discharge Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all pins(1) 2500 V
Charged device model (CDM), per JEDEC specification JESD22-C101, all pins(2) 1000
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)
MIN NOM MAX UNIT
Supply voltage range AVDD(1) 1.75 1.8 1.85 V
IOVDD(1) 1.75 1.8 1.85 V
TA Operating free-air temperature –40 105 °C
TJ Operating junction temperature 105(2) °C
(1) Measured to GND.
(2) Prolonged use above this junction temperature may increase the device failure-in-time (FIT) rate.

6.4 Thermal Information

THERMAL METRIC(1) ADC3660 UNIT
RSB (QFN)
40 Pins
RΘJA Junction-to-ambient thermal resistance 30.7 °C/W
RΘJC(top) Junction-to-case (top) thermal resistance 16.4 °C/W
RΘJB Junction-to-board thermal resistance 10.5 °C/W
ΨJT Junction-to-top characterization parameter 0.2 °C/W
ΨJB Junction-to-board characterization parameter 10.5 °C/W
RΘJC(bot) Junction-to-case (bottom) thermal resistance 2.0 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953.

6.5 Electrical Characteristics - Power Consumption

Typical values are over the operating free-air temperature range, at TA = 25°C, full temperature range is TMIN = –40°C to TMAX = 105°C, ADC sampling rate = 65 MSPS, 50% clock duty cycle, AVDD = IOVDD = 1.8 V, external 1.6 V reference, 5 pF output load, and –1-dBFS differential input, unless otherwise noted
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
FS = 65 MSPS
IAVDD Analog supply current FS = 65 MSPS, External reference 64 78 mA
IIOVDD I/O supply current(1) 8x real decimation, 2-wire CMOS 15 20
PDIS Power dissipation(1) External reference 142 178 mW
IIOVDD I/O supply current(1) 16x real decimation, 1-wire CMOS 14 mA
32x real decimation, 1-wire CMOS 12 mA
32x real decimation, 1/2-wire CMOS 13 mA
8x complex decimation, 2-wire CMOS 19 mA
16x complex decimation, 1-wire CMOS 17 mA
32x complex decimation, 1-wire CMOS 15
32x complex decimation, 1/2-wire CMOS 16
MISCELLANEOUS
IAVDD Internal reference, additional analog supply current Enabled via SPI 3 mA
Internal reference buffer, additional analog supply current 0.3
Single ended clock input, reduces analog supply current by 0.7
PDIS Power consumption in global power down mode Default mask settings, internal reference 5 mW
Default mask settings, external reference 9
(1) Measured with a 1 MHz input frequency full-scale sine wave at specified sample rate, with ~ 5 pF loading on each CMOS output pin.

6.6 Electrical Characteristics - DC Specifications

Typical values are over the operating free-air temperature range, at TA = 25°C, full temperature range is TMIN = –40°C to TMAX = 105°C, ADC sampling rate = 65 MSPS, 50% clock duty cycle, AVDD = IOVDD = 1.8 V, external 1.6 V reference, and –1-dBFS differential input, unless otherwise noted
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
DC ACCURACY
No missing codes 16 bits
PSRR FIN = 1 MHz 50 dB
DNL Differential nonlinearity FIN = 5 MHz -0.5 ± 0.2 +1 LSB
INL(1) Integral nonlinearity FIN = 5 MHz -4.5 ± 2 +4.5 LSB
VOS_ERR Offset error -130 2 130 LSB
VOS_DRIFT Offset drift over temperature -3.5 LSB/ºC
GAINERR Gain error External 1.6V Reference 0 %FSR
GAINDRIFT Gain drift over temperature External 1.6V Reference 10.3 ppm/ºC
GAINERR Gain error Internal Reference 2.4 %FSR
GAINDRIFT Gain drift over temperature Internal Reference 108.8 ppm/ºC
Transition Noise 1.5 LSB
ADC ANALOG INPUT (AINP/M, BINP/M)
FS Input full scale Differential 3.2 Vpp
VCM Input common model voltage 0.9 0.95 1.0 V
RIN Differential input resistance FIN = 100 kHz 8 kΩ
CIN Differential input Capacitance FIN = 100 kHz 7 pF
VOCM Output common mode voltage 0.95 V
BW Analog Input Bandwidth (-3dB) 900 MHz
INTERNAL VOLTAGE REFERENCE
VREF Internal reference voltage 1.6 V
VREF Output Impedance 8 Ω
REFERENCE INPUT BUFFER (REFBUF)
External reference voltage 1.2 V
EXTERNAL VOLTAGE REFERENCE (VREF)
VREF External voltage reference 1.6 V
Input Current 0.3 mA
Input impedance 5.3 kΩ
CLOCK INPUT (CLKP/M)
Input clock frequency 0.5 65 MHz
VID Differential input voltage 1 3.6 Vpp
VCM Input common mode voltage 0.9 V
RIN Single ended input resistance to common mode. 5 kΩ
CIN Single ended input capacitance 1.5 pF
Clock duty cycle 40 50 60 %
DIGITAL INPUTS (RESET, PDN, SCLK, SEN, SDIO)
VIH High level input voltage 1.4 V
VIL Low level input voltage 0.4 V
IIH High level input current 90 150 uA
IIL Low level input current -150 -90 uA
CI Input capacitance 1.5 pF
DIGITAL OUTPUT (SDOUT)
VOH High level output voltage ILOAD = -400 uA IOVDD – 0.1 IOVDD V
VOL Low level output voltage ILOAD = 400 uA 0.1 V
DIGITAL SCMOS OUTPUTS (DA5/6, DB5/6)
Output data rate per CMOS output pin 250 MHz
VOH High level output voltage IOVDD – 0.1 IOVDD V
VOL Low level output voltage ILOAD = 400 uA 0.1 V
VIH High level input voltage DCLKIN IOVDD – 0.1 IOVDD V
VIL Low level input voltage 0.1 V
(1) Performance data shown is prior to decimation filtering. With DDC enabled, performance improves by the decimation filtering process.

6.7 Electrical Characteristics - AC Specifications

Typical values are over the operating free-air temperature range, at TA = 25°C, full temperature range is TMIN = –40°C to TMAX = 105°C, ADC sampling rate = 65 MSPS, 50% clock duty cycle, AVDD = IOVDD = 1.8 V, external 1.6 V reference, and –1-dBFS differential input, unless otherwise noted
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
NSD Noise Spectral Density fIN = 1.1 MHz, AIN = -20 dBFS -159 dBFS/Hz
SNR(1) Signal to noise ratio fIN = 1.1 MHz 82.0 dBFS
fIN = 5 MHz 77.5 81.9
fIN = 10 MHz 81.2
fIN = 20 MHz 79.9
fIN = 40 MHz 77.6
fIN = 64 MHz 74.6
SNR Signal to noise ratio, complex decimation by 16 fIN = 1.1 MHz, fNCO = 2.5 MHz 88.3 dBFS
fIN = 5 MHz, fNCO = 5 MHz 89.2
fIN = 10 MHz, fNCO = 10 MHz 89.3
fIN = 20 MHz, fNCO = 20 MHz 88.7
fIN = 40 MHz, fNCO = 40 MHz 86.5
fIN = 64 MHz, fNCO = 62.6 MHz 84.3
SINAD(1) Signal to noise and distortion ratio fIN = 1.1 MHz 80.0 dBFS
fIN = 5 MHz 76.2 80.9
fIN = 10 MHz 80.8
fIN = 20 MHz 78.1
fIN = 40 MHz 76.2
fIN = 64 MHz 73.6
ENOB(1) Effective number of bits fIN = 1.1 MHz 13.3 bit
fIN = 5 MHz 12.6 13.3
fIN = 10 MHz 13.2
fIN = 20 MHz 13.0
fIN = 40 MHz 12.6
fIN = 64 MHz 12.1
THD(1) Total Harmonic Distortion (First five harmonics) fIN = 1.1 MHz 83 dBc
fIN = 5 MHz 81 87
fIN = 10 MHz 90
fIN = 20 MHz 82
fIN = 40 MHz 81
fIN = 64 MHz 80
SFDR(1) Spur free dynamic range including second and third harmonic fIN = 1.1 MHz 84 dBc
fIN = 5 MHz 83 88
fIN = 10 MHz 94
fIN = 20 MHz 85
fIN = 40 MHz 83
fIN = 64 MHz 84 dBc
Non HD2,3(1) Spur free dynamic range (excluding HD2 and HD3) fIN = 1.1 MHz 101 dBFS
fIN = 5 MHz 91 102
fIN = 10 MHz 99
fIN = 20 MHz 95
fIN = 40 MHz 93
fIN = 64 MHz 87
IMD3 Two tone inter-modulation distortion f1 = 3 MHz, f2 = 4 MHz, AIN = -7 dBFS/tone 88 dBc
f1 = 10 MHz, f2 = 12 MHz, AIN = -7 dBFS/tone 90
(1) Performance data shown is prior to decimation filtering. With DDC enabled, performance improves by the decimation filtering process.

6.8 Timing Requirements

Typical values are over the operating free-air temperature range, at TA = 25°C, full temperature range is TMIN = –40°C to TMAX = 105°C, ADC sampling rate = 65 MSPS, 50% clock duty cycle, AVDD = IOVDD = 1.8 V, external 1.6 V reference, 5 pF output load, and –1-dBFS differential input, unless otherwise noted
PARAMETER TEST CONDITIONS MIN NOM MAX UNIT
ADC TIMING SPECIFICATIONS
tAD Aperture Delay 0.85 ns
tA Aperture Jitter square wave clock with fast edges 180 fs
tJ Jitter on DCLKIN ± 50 ps pk-pk 
tACQ Signal acquisition period, Default referenced to sampling clock falling edge -TS/4 Sampling Clock Period
tCONV Signal conversion period referenced to sampling clock falling edge 10 ns
Wake up time Time to valid data after coming out of power down. Internal reference. Bandgap reference enabled, single ended clock 14.6 us
Bandgap reference enabled, differential clock 14.0
Bandgap reference disabled, single ended clock 1.7 ms
Bandgap reference disabled, differential clock 2.1
Time to valid data after coming out of power down. External  1.6V reference. Bandgap reference enabled, single ended clock 14.6 us
Bandgap reference enabled, differential clock 14.0
Bandgap reference disabled, single ended clock 1.8 ms
Bandgap reference disabled, differential clock 1.7
tS,SYNC Setup time for SYNC input signal Referenced to sampling clock rising edge 500 ps
tH,SYNC Hold time for SYNC input signal 600
ADC Latency  Signal input to data output Serialized CMOS: 2-wire 2 ADC clock cycles
Serialized CMOS: 1-wire 1
Serialized CMOS: 1/2-wire 1
Add. Latency Real decimation by 2 21   Output clock cycles
Complex decimation by 2   22  
Real or complex decimation by 4, 8, 16, 32     23  
INTERFACE TIMING
tPD Propagation delay: sampling clock falling edge to DCLK rising edge Delay between sampling clock falling edge to DCLKIN falling edge < 2.5ns.
TDCLK = DCLK period
tCDCLK = Sampling clock falling edge to DCLKIN falling edge
2 + TDCLK + tCDCLK 3 + TDCLK + tCDCLK 4 + TDCLK + tCDCLK ns
Delay between sampling clock falling edge to DCLKIN falling edge >= 2.5ns.
TDCLK = DCLK period
tCDCLK = Sampling clock falling edge to DCLKIN falling edge
2 + tCDCLK 3 + tCDCLK 4 + tCDCLK
tCD DCLK rising edge to output data delay
2-wire serial CMOS
Fout = 10 MSPS, DA/B5,6 = 80 MBPS -0.24 0.10 ns
Fout = 20 MSPS, DA/B5,6 = 160 MBPS -0.29 0.10
Fout = 30 MSPS, DA/B5,6 = 240 MBPS -0.28 0.09
DCLK rising edge to output data delay
1-wire serial CMOS
Fout = 5 MSPS, DA/B6 = 80 MBPS -0.22 0.11
Fout = 10 MSPS, DA/B6 = 160 MBPS -0.27 0.11
Fout = 15 MSPS, DA/B6 = 240 MBPS -0.52 0.08
DCLK rising edge to output data delay
1/2-wire serial CMOS
Fout = 5 MSPS, DA6 = 160 MBPS  -0.24 0.1
tDV Data valid, 2-wire serial CMOS Fout = 10 MSPS, DA/B5,6 = 80 MBPS 12.19 12.36 ns
Fout = 20 MSPS, DA/B5,6 = 160 MBPS 5.93 6.1
Fout = 30 MSPS, DA/B5,6 = 240 MBPS 3.91 4.07
Data valid, 1-wire serial CMOS Fout = 5 MSPS, DA/B6 = 80 MBPS 12.21 12.39
Fout = 10 MSPS, DA/B6 = 160 MBPS 5.95 6.10
Fout = 15 MSPS, DA/B6 = 240 MBPS 3.83 4.08
Data valid, 1/2-wire serial CMOS Fout = 5 MSPS, DA6 = 160 MBPS  5.36 6.13
SERIAL PROGRAMMING INTERFACE (SCLK, SEN, SDIO) - Input
fCLK,SCLK Serial clock frequency 20 MHz
tS,SEN SEN falling edge to SCLK rising edge 10 ns
tH,SEN SCLK rising edge to SEN rising edge 9
tS,SDIO SDIO setup time from rising edge of SCLK 17
tH,SDIO SDIO hold time from rising edge of SCLK 9
SERIAL PROGRAMMING INTERFACE (SDIO) - Output
tOZD Delay from falling edge of 16th SCLK cycle during read operation for SDIO transition from tri-state to valid data 3.9 10.8 ns
tODZ Delay from SEN rising edge for SDIO transition from valid data to tri-state 3.4 14
tOD Delay from falling edge of 16th SCLK cycle during read operation to SDIO valid 3.9 10.8

6.9 Typical Characteristics

Typical values at TA = 25 °C, ADC sampling rate = 65 MSPS, AIN = –1 dBFS differential input, 50% clock duty cycle, AVDD = IOVDD = 1.8 V, external 1.6 V reference, 5 pF output load, unless otherwise noted.

GUID-20200811-CA0I-ZTKH-KFQG-ZQX83XBP5VNG-low.gif
DECIMATION BYPASS(1)
Figure 6-1 Single Tone FFT at FIN = 1.1 MHz
GUID-20200811-CA0I-GP0F-R5QL-GXDC6SDWCPX5-low.gif
DECIMATION BYPASS1
Figure 6-3 Single Tone FFT at FIN = 10 MHz
GUID-20200903-CA0I-2SNL-WC58-WQZWCN72KMTM-low.gif
AIN = -7 dBFS/tone, DECIMATION BYPASS1
Figure 6-5 Two Tone FFT at FIN = 3,4 MHz
GUID-20200903-CA0I-5WGX-HZKN-RGFPGQ6FGP1B-low.gif
AIN = -7 dBFS/tone, DECIMATION BYPASS1
Figure 6-7 Two Tone FFT at FIN = 10,12 MHz
GUID-20200825-CA0I-ZJK2-RMB2-PRLF4HQM7GL3-low.gif
Decimation by 32, complex. NCO = 10.1 MHz
Figure 6-9 Single Tone FFT at FIN = 10 MHz
GUID-20200901-CA0I-DMF0-29HJ-3MCFVWWMKZ3H-low.gif
DECIMATION BYPASS1
Figure 6-11 ENOB vs Input Frequency
GUID-20200901-CA0I-ZG10-JQ7H-WTLPKS3K8VTZ-low.gif
FIN = 5 MHz, DECIMATION BYPASS1
Figure 6-13 AC Performance vs Sampling Rate
GUID-20200827-CA0I-TH8V-CLQL-S5SVHJX6GTLG-low.gif
FIN = 5 MHz, DECIMATION BYPASS1
Figure 6-15 AC Performance vs Clock Duty cycle
GUID-20200901-CA0I-WRF4-4L9Z-C0MGKQRMQ8QT-low.gif
FIN = 5 MHz, DECIMATION BYPASS1
Figure 6-17 ENOB vs AVDD
GUID-20200918-CA0I-0JNH-GQ0M-4TMP71L88XMD-low.gif
DECIMATION BYPASS1
Figure 6-19 DC Offset Histogramm
GUID-20200903-CA0I-G1TT-XMXH-HCKKDM5THRFX-low.gif
FIN = 5 MHz, DECIMATION BYPASS1
Figure 6-21 DNL vs Code
GUID-20200811-CA0I-NCPW-GFHG-LXPN8TVM0FFK-low.gif
FS = 25 MSPS, AIN = –20 dBFS, DECIMATION BYPASS1
Figure 6-23 Single Tone FFT at FIN = 1.1 MHz
GUID-20200825-CA0I-CXDW-7VL9-V4RSCDVQJD5M-low.gif
FS = 25 MSPS, Decimation by 8, real
Figure 6-25 Single Tone FFT at FIN = 1 MHz
GUID-20200811-CA0I-F3SK-4CTQ-LV3VCCHDSKHR-low.gif
FS = 25 MSPS, DECIMATION BYPASS1
Figure 6-27 ENOB vs Input Frequency
GUID-20200901-CA0I-BCKC-BQWQ-BX9B3SGFCPMR-low.gif
FS = 25 MSPS, FIN = 5 MHz, DECIMATION BYPASS1
Figure 6-29 AC Performance vs Clock Amplitude
GUID-20200901-CA0I-ZFCR-ZGMT-CNPBWTN69J46-low.gif
FS = 25 MSPS, FIN = 5 MHz, DECIMATION BYPASS1
Figure 6-31 AC Performance vs VCM vs Temperature
GUID-20200903-CA0I-NF3P-9CDB-M2VJT3JQCTL8-low.gif
FS = 25 MSPS, FIN = 5 MHz, DECIMATION BYPASS1
Figure 6-33 DNL vs Code
GUID-20200911-CA0I-HTP1-R4LL-S3NXKNT1V6L4-low.gif
FIN = 5 MHz, 50 mVpp signal on AVDD
Figure 6-35 PSRR vs Frequency
GUID-20200909-CA0I-KJCM-QZ8L-GWQ7LR4RQLB3-low.gif
FIN = 1 MHz, 16-bit resolution, 2-w
Figure 6-37 IIOVDD Current vs Decimation
GUID-20200811-CA0I-SKFM-JF1P-1C9FHTGT4NR7-low.gif
AIN = –20 dBFS, DECIMATION BYPASS1
Figure 6-2 Single Tone FFT at FIN = 1.1 MHz
GUID-20200903-CA0I-QB0D-GG5S-2NRRHKTXQZJP-low.gif
DECIMATION BYPASS1
Figure 6-4 Single Tone FFT at FIN = 40 MHz
GUID-20200903-CA0I-RXDB-6G5Q-VW42NPSFX1DL-low.gif
AIN = -20 dBFS/tone, DECIMATION BYPASS1
Figure 6-6 Two Tone FFT at FIN = 3,4 MHz
GUID-20200825-CA0I-JVX1-SLRC-VDFVKHWW400K-low.gif
Decimation by 16, real
Figure 6-8 Single Tone FFT at FIN = 1 MHz
GUID-20200901-CA0I-KZ2P-PKHC-S3ZCWXDFPTQX-low.gif
DECIMATION BYPASS1
Figure 6-10 AC Performance vs Input Frequency
GUID-20200901-CA0I-9GQW-6ZWR-SNSC7ZD3GWSF-low.gif
FIN = 5 MHz, DECIMATION BYPASS1
Figure 6-12 AC Performance vs Input Amplitude
GUID-20200901-CA0I-QB0T-NCSF-5ZXH1GZ0QWNZ-low.gif
DECIMATION BYPASS1
Figure 6-14 AC Performance vs Clock Amplitude
GUID-20200811-CA0I-DLSS-SB9Z-NNSHXVQ7PC9Q-low.gif
FIN = 5 MHz, DECIMATION BYPASS1
Figure 6-16 AC Performance vs AVDD
GUID-20200901-CA0I-PGQJ-SBRB-8QCS5ZF1TFWC-low.gif
FIN = 5 MHz, DECIMATION BYPASS1
Figure 6-18 AC Performance vs VCM vs Temperature
GUID-20200903-CA0I-9TJL-SNNV-4WN8XGVHB3W1-low.gif
FIN = 5 MHz, DECIMATION BYPASS1
Figure 6-20 INL vs Code
GUID-20200811-CA0I-2SDM-N8Z9-B8XKQRGLHTTV-low.gif
FS = 25 MSPS, DECIMATION BYPASS1
Figure 6-22 Single Tone FFT at FIN = 1.1 MHz
GUID-20200811-CA0I-VDWZ-ZMKC-G05QCJ0RG8MF-low.gif
FS = 25 MSPS, DECIMATION BYPASS1
Figure 6-24 Single Tone FFT at FIN = 10 MHz
GUID-20200811-CA0I-NQSM-1ZCN-GVLRN7RFT40T-low.gif
FS = 25 MSPS, DECIMATION BYPASS1
Figure 6-26 AC Performance vs Input Frequency
GUID-20200901-CA0I-TMSD-12XM-RQXHHNRF0KVB-low.gif
FS = 25 MSPS, FIN = 5 MHz, DECIMATION BYPASS1
Figure 6-28 AC Performance vs Input Amplitude
GUID-20200811-CA0I-DPNR-K2R8-QN813SDR3PMT-low.gif
FS = 25 MSPS, FIN = 5 MHz, DECIMATION BYPASS1
Figure 6-30 AC Performance vs AVDD
GUID-20200903-CA0I-TW5K-5MJX-RHRNSMHXTRRL-low.gif
FS = 25 MSPS, FIN = 5 MHz, DECIMATION BYPASS1
Figure 6-32 INL vs Code
GUID-20200908-CA0I-PV3K-V1CX-W0DWHJBLR5DF-low.gif
Aggressor at -1 dBFS
Figure 6-34 Isolation vs Input Frequency
GUID-20200903-CA0I-NM5D-4ZKK-GD1JXPDKWSRR-low.gif
FIN = 1 MHz, 32x complex decimation, 16-bit resolution
Figure 6-36 Current vs Sampling Rate
GUID-20200908-CA0I-CCXZ-DSWH-Q8GFZDJ2CJHD-low.gif
FIN = 1 MHz, 32x complex decimation, 16-bit resolution, 2-w
Figure 6-38 IIOVDD Current vs Load Capacitance
1.

Decimation bypass mode is for full Nyquist zone illustration only.

7 Parameter Measurement Information

GUID-20200909-CA0I-HQPK-04KW-SZGRRK5H3RVH-low.gifFigure 7-1 Timing diagram: 2-wire SCMOS (changed from 18-bit to 16-bit output after power up)
GUID-20200909-CA0I-3XZS-85MN-9VRKGLSVRXNM-low.gifFigure 7-2 Timing diagram: 1-wire SCMOS (changed from 18-bit to 16-bit output after power up)
GUID-20200909-CA0I-KMPM-PHGB-HHVMRLDMN4Q7-low.gifFigure 7-3 Timing diagram: 1/2-wire SCMOS (changed from 18-bit to 16-bit output after power up)

8 Detailed Description

8.1 Overview

The ADC3660 is a low noise, ultra-low power 16-bit high-speed dual channel ADC family supporting sampling rates up to 65Msps. It offers excellent DC precision together with IF sampling support which makes it ideally suited for a wide range of applications. The ADC3660 is equipped with an internal reference option but it also supports the use of an external, high precision 1.6V voltage reference or an external 1.2V reference which is buffered and gained up internally.

An optional programmable digital down converter enables external anti-alias filter relaxation as well as output data rate reduction. The digital filter provides a 32-bit programmable NCO and supports both real or complex decimation.

Note: The ADC3660 uses a serial CMOS (SCMOS) interface to output the data which minimizes the number of digital interconnects. The device supports a two-lane (2-wire), a one-lane (1-wire) and a half lane (1/2-wire) interface option. The serialized CMOS interface supports output rates up to 250Mbps which translates to the following maximum output rates:
  • Decimation Bypass Mode: ~ 31 Msps (2-wire) to ~ 8 Msps (0.5-wire)
  • Complex Decimation: ~ 15 Msps (2-wire) to ~4 Msps (0.5-wire)
  • Real Decimation: ~ 30 Msps (2-wire) to ~ 8 Msps (0.5-wire)
Hence the ADC3660 can be operated in 'oversampling and decimating' mode using the internal decimation filter in order to improve the dynamic range and relax external anti-aliasing filter.

The ADC3660 includes a digital output formatter which supports output resolutions from 14 to 20-bit.

The device features and control options can be set up either through pin configurations or via SPI register writes.

8.2 Functional Block Diagram

GUID-20200901-CA0I-BCC3-XMBT-WJ0QR3H8NR3J-low.gif

8.3 Feature Description

8.3.1 Analog Input

The analog inputs of ADC3660 are intended to be driven differentially. Both AC coupling and DC coupling of the analog inputs is supported. The analog inputs are designed for an input common mode voltage of 0.95 V which must be provided externally on each input pin. DC-coupled input signals must have a common mode voltage that meets the device input common mode voltage range.

The equivalent input network diagram is shown in Figure 8-1. All four sampling switches, on-resistance shown in red, are in same position (open or closed) simultaneously.

GUID-0612D156-D9AC-4F9D-8D82-F0C157DD9F75-low.gifFigure 8-1 Equivalent Input Network

8.3.1.1 Analog Input Bandwidth

Figure 8-2 shows the analog full power input bandwidth of the ADC3660 with a 50 Ω differential termination. The -3 dB bandwidth is approximately 900 MHz and the useful input bandwidth with good AC performance is approximately 120 MHz.

The equivalent differential input resistance RIN and input capacitance CIN vs frequency are shown in Figure 8-3.

GUID-20200915-CA0I-8KG7-ZP6W-KD3RSTRWZVCJ-low.gifFigure 8-2 ADC Analog Input Bandwidth Response
Figure 8-3 Equivant RIN, CIN vs Input Frequency

8.3.1.2 Analog Front End Design

The ADC3660 is an unbuffered ADC and thus a passive kick-back filter is recommended to absorb the glitch from the sampling operation. Depending on if the input is driven by a balun or a differential amplifier with low output impedance, a termination network may be needed. Additionally a passive DC bias circuit is needed in AC-coupled applications which can be combined with the termination network.

8.3.1.2.1 Sampling Glitch Filter Design

The front end sampling glitch filter is designed to optimize the SNR and HD3 performance of the ADC. The filter performance is dependent on input frequency and therefore the following filter designs are recommended for different input frequency ranges as shown in Figure 8-4 and Figure 8-5 (assuming 50 Ω source impedance).

GUID-20200908-CA0I-LTQQ-H16W-MM0BNVVZPJHR-low.gifFigure 8-4 Sampling glitch filter for input frequencies from DC to 30 MHz
GUID-20200923-CA0I-PWHV-FWWN-S2ZDTDFQ0RDT-low.gifFigure 8-5 Sampling glitch filter for input frequencies from 30 to 70 MHz
8.3.1.2.2 Analog Input Termination and DC Bias

Depending on the input drive circuitry, a termination network and/or DC biasing needs to be provided.

8.3.1.2.2.1 AC-Coupling

The ADC3660 requires external DC bias using the common mode output voltage (VCM) of the ADC together with the termination network as shown in Figure 8-6. The termination is located within the glitch filter network. When using a balun on the input, the termination impedance has to be adjusted to account for the turns ratio of the transformer. When using an amplifier, the termination impedance can be adjusted to optimize the amplifier performance.

GUID-20200910-CA0I-C1L9-VLXJ-BB3BJW2SZJKW-low.gifFigure 8-6 AC-Coupling: termination network provides DC bias (glitch filter example for DC - 30 MHz)
8.3.1.2.2.2 DC-Coupling

In DC coupled applications the DC bias needs to be provided from the fully differential amplifier (FDA) using VCM output of the ADC as shown in Figure 8-7. The glitch filter in this case is located between the anti-alias filter and the ADC. No termination may be needed if amplifier is located close to the ADC or if the termination is part of the anti-alias filter.

GUID-4FC6183E-B9A5-4840-92B0-9E9D2B844A9C-low.gifFigure 8-7 DC-Coupling: DC bias provided by FDA (glitch filter example for DC - 30 MHz)

8.3.1.3 Auto-Zero Feature

The ADC3660 includes an internal auto-zero front end amplifier circuit which improves the 1/f flicker noise. This auto-zero feature can be enabled using SPI register writes (register 0x11, D0).

GUID-20200909-CA0I-RLBN-SZJT-FWRV8TRSCHVV-low.gifFigure 8-8 FFT at 25 MSPS with input frequency of 5 MHz (auto-zero feature enable vs disable, 4M point FFT)
GUID-20200909-CA0I-ZSG6-N1LP-6GT0BFPBVVFH-low.gifFigure 8-10 FFT at 65 MSPS with input frequency of 5 MHz (auto-zero feature enable vs disable, 4M point FFT)
GUID-20200909-CA0I-GQMB-DVFN-9NWVGGJFLMWS-low.gifFigure 8-9 FFT at 25 MSPS with input frequency of 5 MHz (auto-zero feature enable vs disable, 4M point FFT)
GUID-20200909-CA0I-DGZC-TMFD-X7BGZJ2RMCBZ-low.gifFigure 8-11 FFT at 65 MSPS with input frequency of 5 MHz (auto-zero feature enabled vs disabled, 4M point FFT)

8.3.2 Clock Input

In order to maximize the ADC SNR performance, the external sampling clock should be low jitter and differential signaling with a high slew rate. This is especially important in IF sampling applications. For less jitter sensitive applications, the ADC3660 provides the option to operate with single ended signaling which saves additional power consumption.

8.3.2.1 Single Ended vs Differential Clock Input

The ADC3660 can be operated using a differential or a single ended clock input where the single ended clock consumes less power consumption. However clock amplitude impacts the ADC aperture jitter and consequently the SNR. For maximum SNR performance, a large clock signal with fast slew rates needs to be provided.

  • Differential Clock Input: The clock input can be AC coupled externally. The ADC3660 provides internal biasing for that use case.
  • ingle Ended Clock Input: This mode needs to be configured using SPI register (0x0E, D2 and D0) or with the REFBUF pin. In this mode there is no internal clock biasing and thus the clock input needs to be DC coupled around a 0.9V center. The unused input needs to be AC coupled to ground.
GUID-20200817-CA0I-T0X8-3HMH-XZBWWHHNGHL5-low.gifFigure 8-12 External and internal connection using differential (left) and single ended (right) clock input

8.3.2.2 Signal Acquisition Time Adjust

The ADC3660 includes a register (DLL PDN (0x11, D2) which increases the signal acquisition time window for clock rates below 40 MSPS from 25% to 50% of the clock period. Increasing the sampling time provides a longer time for the driving amplifier to settle out the signal which can improve the SNR performance of the system. When powering down the DLL, the acquisition time will track the clock duty cycle (50% is recommended).

Table 8-1 Acquisition time vs DLL PDN setting
SAMPLING CLOCK FS (MSPS)DLL PDN (0x11, D2)ACQUISITION TIME (tACQ)
650TS / 4
≤ 401TS / 2

TS: Sampling clock period

8.3.3 Voltage Reference

The ADC3660 provides three different options for supplying the voltage reference to the ADC. An external 1.6V reference can be directly connected to the VREF input; a voltage 1.2V reference can be connected to the REFBUF input using the internal gain buffer or the internal 1.2V reference can be enabled to generate a 1.6V reference voltage. For best performance, the reference noise should be filtered by connecting a 10 uF and a 0.1 uF ceramic bypass capacitor to the VREF pin. The internal reference circuitry of the ADC3660 is shown in Figure 8-13.

Note: The voltage reference mode can be selected using SPI register writes or by using the REFBUF pin (default) as a control pin (Section 8.5.1). If the REFBUF pin is not used for configuration, the REFBUF pin should be connected to AVDD (even though the REFBUF pin has a weak internal pullup to AVDD) and the voltage reference option has to be selected using the SPI interface.

GUID-4B086BDC-B91D-423E-B37A-739C90700362-low.gifFigure 8-13 Different voltage reference options for ADC3660

8.3.3.1 Internal voltage reference

The 1.6V reference for the ADC can be generated internal using the on-chip 1.2V bandgap reference along with the internal gain buffer. A 10 uF and a 0.1 uF ceramic bypass capacitor (CVREF) should be connected between the VREF and REFGND pins as close to the pins as possible.

Figure 8-14 Internal reference

8.3.3.2 External voltage reference (VREF)

For highest accuracy and lowest temperature drift, the VREF input can be directly connected to an external 1.6V reference. A 10 uF and a 0.1 uF ceramic bypass capacitor (CVREF) should connected between the VREF and REFGND pins and placed as close to the pins as possible is recommended. The load current from the external reference is about 1mA.
Note: The internal reference is also used for other functions inside the device, therefore the reference amplifier should only be powered down in power down state but not during normal operation.

Figure 8-15 External 1.6V reference

 

Texas Instruments

© Copyright 1995-2025 Texas Instruments Incorporated. All rights reserved.
Submit documentation feedback | IMPORTANT NOTICE | Trademarks | Privacy policy | Cookie policy | Terms of use | Terms of sale