ZHCSKT0J November   1998  – August 2024 CD4066B , CD4066B-MIL

PRODUCTION DATA  

  1.   1
  2. 1 特性
  3. 2 应用
  4. 3 说明
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Switching Characteristics
    7. 5.7 Typical Characteristics
  7. 6 Parameter Measurement Information
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
    4. 7.4 Device Functional Modes
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curve
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 接收文档更新通知
    2. 9.2 支持资源
    3. 9.3 Trademarks
    4. 9.4 静电放电警告
    5. 9.5 术语表
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

5.7 Typical Characteristics

CD4066B System Settling Time vs Signal Rise/Fall Time Figure 5-1 System Settling Time vs Signal Rise/Fall Time
CD4066B System Settling Time vs Signal Voltage Figure 5-3 System Settling Time vs Signal Voltage
CD4066B Power Dissipation per Package vs Switching FrequencyFigure 5-5 Power Dissipation per Package vs Switching Frequency
CD4066B System Settling Time vs Signal Voltage Figure 5-2 System Settling Time vs Signal Voltage
CD4066B Typical ON Characteristics for 1 of 4 ChannelsFigure 5-4 Typical ON Characteristics for 1 of 4 Channels