ZHCSJL9B April   2019  – April 2019 TPS566235

PRODUCTION DATA.  

  1. 1 特性
  2. 2 应用
  3. 3 说明
    1.     Device Images
      1.      典型应用
      2.      效率与输出电流 Eco-mode
  4. 4 修订历史记录
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 PWM Operation and D-CAP3 Control
      2. 7.3.2 Power Good
      3. 7.3.3 Soft Start and Pre-Biased Soft Start
      4. 7.3.4 Over current Protection and Undervoltage Protection
      5. 7.3.5 Over Voltage Protection
      6. 7.3.6 UVLO Protection
      7. 7.3.7 Thermal Shutdown
    4. 7.4 Device Functional Modes
      1. 7.4.1 Light Load Operation
      2. 7.4.2 MODE Pin Configuration
      3. 7.4.3 Advanced Eco-Mode Control
      4. 7.4.4 Out-Of-Audio Mode
      5. 7.4.5 Force CCM Mode
      6. 7.4.6 Standby Operation
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Custom Design With WEBENCH® Tools
        2. 8.2.2.2 Inductor Selection
        3. 8.2.2.3 Output Capacitor Selection
        4. 8.2.2.4 Input Capacitor Selection
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11器件和文档支持
    1. 11.1 器件支持
      1. 11.1.1 第三方产品免责声明
      2. 11.1.2 开发支持
        1. 11.1.2.1 使用 WEBENCH® 工具创建定制设计
    2. 11.2 接收文档更新通知
    3. 11.3 社区资源
    4. 11.4 商标
    5. 11.5 静电放电警告
    6. 11.6 术语表
  12. 12机械、封装和可订购信息

6.4 Thermal Information

THERMAL METRIC(1) TPS566235 UNIT
RJN (VQFN)
13 PINS
RθJA Junction-to-ambient thermal resistance 70 °C/W
RθJA_effective Junction-to-ambient thermal resistance with TI EVM 34.8 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 46.4 °C/W
RθJB Junction-to-board thermal resistance 22.1 °C/W
ψJT Junction-to-top characterization parameter 1.4 °C/W
ψJB Junction-to-board characterization parameter 22.4 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance N/A °C/W
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.