ZHCSJ24A November   2018  – May 2019 TPS56339

PRODUCTION DATA.  

  1. 特性
  2. 应用
  3. 说明
    1.     Device Images
      1.      简化原理图
      2.      TPS56339 效率
  4. 修订历史记录
  5. Pin Configuration and Functions
    1.     Pin Functions
  6. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Requirements
    7. 6.7 Typical Characteristics
  7. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Advanced Emulated Current Mode Control
      2. 7.3.2 Enable and Adjusting Undervoltage Lockout
      3. 7.3.3 Soft Start and Pre-Biased Soft Start
      4. 7.3.4 Voltage Reference
      5. 7.3.5 Minimum ON-time, Minimum OFF-time and Frequency Foldback at Dropout Conditions
      6. 7.3.6 Overcurrent and Undervoltage Protection
      7. 7.3.7 Thermal Shutdown
    4. 7.4 Device Functional Modes
      1. 7.4.1 Shutdown Mode
      2. 7.4.2 Active Mode
      3. 7.4.3 CCM Operation
    5. 7.5 Light-Load Operation
  8. Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Custom Design With WEBENCH® Tools
        2. 8.2.2.2 Output Voltage Resistors Selection
        3. 8.2.2.3 Output Inductor Selection
        4. 8.2.2.4 Output Capacitor Selection
        5. 8.2.2.5 Input Capacitor Selection
        6. 8.2.2.6 Bootstrap Capacitor Selection
      3. 8.2.3 Undervoltage Lockout Set Point
      4. 8.2.4 Application Curves
  9. Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11器件和文档支持
    1. 11.1 接收文档更新通知
    2. 11.2 相关链接
    3. 11.3 社区资源
    4. 11.4 商标
    5. 11.5 静电放电警告
    6. 11.6 Glossary
  12. 12机械、封装和可订购信息

Layout Guidelines

  1. VIN and GND traces should be as wide as possible to reduce trace impedance. The wide areas are also of advantage from the view point of heat dissipation.
  2. The input capacitor and output capacitor should be placed as close to the device as possible to minimize trace impedance.
  3. The 0.1-µF ceramic bypass capacitor should be as close as possible to VIN and GND pins.
  4. Provide sufficient vias for the input capacitor and output capacitor.
  5. Keep the SW trace as physically short and wide as practical to minimize radiated emissions.
  6. Do not allow switching current to flow under the device.
  7. A separate VOUT path should be connected to the upper feedback resistor.
  8. Make a Kelvin connection to the GND pin for the feedback path.
  9. Voltage feedback loop should be placed away from the high-voltage switching trace, and preferably has ground shield.
  10. The trace of the VFB node should be as small as possible to avoid noise coupling.
  11. The GND trace between the output capacitor and the GND pin should be as wide as possible to minimize its trace impedance.