ZHCSJ23C November 2018 – September 2019 UCC20225-Q1 , UCC20225A-Q1
PRODUCTION DATA.
是UCC20225-Q1 系列是一款单输入、双输出隔离式栅极驱动器,具有 4A 峰值拉电流和 6A 峰值灌电流,并且采用 5mm x 5mm LGA-13 封装。该器件旨在以一流的传播延迟和脉宽失真度驱动功率晶体管,频率最高可达 5MHz。
输入侧通过一个 2.5kVRMS 隔离栅与两个输出驱动器隔离,共模瞬态抗扰度 (CMTI) 的最小值为 100V/ns。两个输出侧驱动器之间的内部功能隔离支持高达 700VDC 的工作电压。
UCC20225-Q1 系列通过 DT 引脚上的电阻器支持可编程死区时间。DIS 引脚在设为高电平时可同时关断两个输出,在接地时允许器件正常运行。
该器件接受的 VDD 电源电压高达 25V。凭借 3V 至 18V 的宽 VCCI 范围,该驱动器非常适合连接模拟和数字控制器。所有电源电压引脚都具有欠压锁定 (UVLO) 保护功能。
凭借上述所有高级 功能,UCC20225-Q1 系列可在各种汽车 应用中实现高功率密度、高效率和稳健性。
器件型号 | 封装 | UVLO |
---|---|---|
UCC20225A-Q1 | LGA (13) 5 × 5 mm | 5V |
UCC20225-Q1 | LGA (13) 5 × 5 mm | 8V |
PIN | I/O(1) | DESCRIPTION | |
---|---|---|---|
NAME | NO. | ||
DISABLE | 5 | I | Disables both driver outputs if asserted high, enables if set low or left open. This pin is pulled low internally if left open. It is recommended to tie this pin to ground if not used to achieve better noise immunity. Bypass using a ≈1nF low ESR/ESL capacitor close to DIS pin when connecting to a micro controller with distance. |
DT | 6 | I | Programmable dead time function.
Tying DT to VCCI disables the DT function with dead time ≈ 0ns. Placing a resistor (RDT) between DT and GND adjusts dead time according to: DT (in ns) = 10 x RDT (in kΩ). It is recommended to parallel a ceramic capacitor, 2.2nF or above, close to DT pin to achieve better noise immunity when using RDT. |
GND | 1 | G | Primary-side ground reference. All signals in the primary side are referenced to this ground. |
NC | 3 | – | No internal connection. |
OUTA | 12 | O | Output of driver A. Connect to the gate of the A channel FET or IGBT. Output A is in phase with PWM input with a propagation delay |
OUTB | 9 | O | Output of driver B. Connect to the gate of the B channel FET or IGBT. Output B is always complementary to output A with a programmed dead time. |
PWM | 2 | I | PWM input has a TTL/CMOS compatible input threshold. This pin is pulled low internally if left open. |
VCCI | 4 | P | Primary-side supply voltage. Locally decoupled to GND using a low ESR/ESL capacitor located as close to the device as possible. |
VCCI | 7 | P | This pin is internally shorted to pin 4. Preference should be given to bypassing pin-4 to pin-1 instead of pin-7 to pin-1. |
VDDA | 13 | P | Secondary-side power for driver A. Locally decoupled to VSSA using a low ESR/ESL capacitor located as close to the device as possible. |
VDDB | 10 | P | Secondary-side power for driver B. Locally decoupled to VSSB using a low ESR/ESL capacitor located as close to the device as possible. |
VSSA | 11 | G | Ground for secondary-side driver A. Ground reference for secondary side A channel. |
VSSB | 8 | G | Ground for secondary-side driver B. Ground reference for secondary side B channel. |
MIN | MAX | UNIT | |||
---|---|---|---|---|---|
Input bias pin supply voltage | VCCI to GND | –0.3 | 20 | V | |
Driver bias supply | VDDA-VSSA, VDDB-VSSB | –0.3 | 30 | V | |
Output signal voltage | OUTA to VSSA, OUTB to VSSB | –0.3 | VVDDA+0.3, VVDDB+0.3 | V | |
OUTA to VSSA, OUTB to VSSB, Transient for 200 ns | –2 | VVDDA+0.3, VVDDB+0.3 | V | ||
Input signal voltage | PWM, DIS, DT to GND | –0.3 | VVCCI+0.3 | V | |
PWM Transient for 50ns | –5 | VVCCI+0.3 | V | ||
Channel to channel voltage | VSSA-VSSB, VSSB-VSSA | 700 | V | ||
Junction temperature, TJ(2) | –40 | 150 | °C | ||
Storage temperature, Tstg | –65 | 150 | °C |
VALUE | UNIT | |||
---|---|---|---|---|
V(ESD) | Electrostatic discharge | Human-body model (HBM), per AEC Q100-002(1) | ±4000 | V |
Charged-device model (CDM), per AEC Q100-011 | ±1500 |
MIN | MAX | UNIT | |||
---|---|---|---|---|---|
VCCI | VCCI Input supply voltage | 3 | 18 | V | |
VDDA, VDDB | Driver output bias supply | UCC20225A-Q1 | 6.5 | 25 | V |
UCC20225-Q1 | 9.2 | 25 | |||
TA | Ambient Temperature | –40 | 125 | °C | |
TJ | Junction Temperature | –40 | 130 | °C |
THERMAL METRIC(1) | UCC20225A-Q1, UCC20225-Q1 | UNIT | |
---|---|---|---|
LGA (13)(2) | |||
RθJA | Junction-to-ambient thermal resistance | 98.0 | °C/W |
RθJC(top) | Junction-to-case (top) thermal resistance | 48.8 | |
RθJB | Junction-to-board thermal resistance | 78.9 | |
ψJT | Junction-to-top characterization parameter | 26.2 | |
ψJB | Junction-to-board characterization parameter | 76.8 |
VALUE | UNIT | |||
---|---|---|---|---|
PD | Power dissipation by UCC20225A-Q1, UCC20225-Q1 | VCCI = 18 V, VDDA/B = 12 V, PWM = 3.3 V, 2.7 MHz 50% duty cycle square wave 1-nF load | 0.95 | W |
PDI | Power dissipation by primary side of UCC20225A-Q1, UCC20225-Q1 | 0.05 | ||
PDA, PDB | Power dissipation by each driver side of UCC20225A-Q1, UCC20225-Q1 | 0.45 |
PARAMETER | TEST CONDITIONS | VALUE | UNIT | |
---|---|---|---|---|
CLR | External clearance(1)(2) | Shortest pin-to-pin distance through air | 3.5 | mm |
CPG | External creepage(1) | Shortest pin-to-pin distance across the package surface | 3.5 | mm |
DTI | Distance through the insulation | Minimum internal gap (internal clearance) | >21 | µm |
CTI | Comparative tracking index | DIN EN 60112 (VDE 0303-11); IEC 60112 | > 600 | V |
Material group | I | |||
Overvoltage category per IEC 60664-1 | Rated mains voltage ≤ 150 VRMS | I-III | ||
Rated mains voltage ≤ 300 VRMS | I-II | |||
DIN V VDE V 0884-11 (VDE V 0884-11): 2017-01(3) | ||||
VIORM | Maximum repetitive peak isolation voltage | AC voltage (bipolar) | 792 | VPK |
VIOWM | Maximum working isolation voltage | AC voltage (sine wave); time dependent dielectric breakdown (TDDB) test; (See Figure 1) | 560 | VRMS |
DC Voltage | 792 | VDC | ||
VIOTM | Maximum transient isolation voltage | VTEST = VIOTM, t = 60 s (qualification); VTEST = 1.2 × VIOTM, t = 1 s (100% production) | 3535 | VPK |
VIOSM | Maximum surge isolation voltage(4) | Test method per IEC 62368-1, 1.2/50 μs waveform, VTEST = 1.3 × VIOSM (qualification) | 3500 | VPK |
qpd | Apparent charge(5) | Method a, After Input/Output safety test subgroup 2/3,
Vini = VIOTM, tini = 60s; Vpd(m) = 1.2 × VIORM, tm = 10s |
<5 | pC |
Method a, After environmental tests subgroup 1,
Vini = VIOTM, tini = 60s; Vpd(m) = 1.2 × VIORM, tm = 10s |
<5 | |||
Method b1; At routine test (100% production) and preconditioning (type test)
Vini = 1.2 × VIOTM; tini = 1 s; Vpd(m) = 1.5 × VIORM , tm = 1s |
<5 | |||
CIO | Barrier capacitance, input to output(6) | VIO = 0.4 sin (2πft), f =1 MHz | 1.2 | pF |
RIO | Isolation resistance, input to output | VIO = 500 V at TA = 25°C | > 1012 | Ω |
VIO = 500 V at 100°C ≤ TA ≤ 125°C | > 1011 | |||
VIO = 500 V at TS =150°C | > 109 | |||
Pollution degree | 2 | |||
Climatic category | 40/125/21 | |||
UL 1577 | ||||
VISO | Withstand isolation voltage | VTEST = VISO = 3000 VRMS, t = 60 sec. (qualification),
VTEST = 1.2 × VISO = 3000VRMS, t = 1 sec (100% production) |
2500 | VRMS |
VDE | UL | CQC | |
---|---|---|---|
Certified according to DIN V VDE V 0884-11:2017-01 | Recognized under UL 1577 Component Recognition Program | Certified according to GB 4943.1-2011 | |
Basic Insulation Maximum Transient Overvoltage, 3535 VPK;
Maximum Repetitive Peak Voltage, 792 VPK; Maximum Surge Isolation Voltage, 2719 VPK |
Single protection, 2500 VRMS | Basic Insulation,
Altitude ≤ 5000 m, Tropical Climate 320-VRMS maximum working voltage |
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Certification Number: 40016131 | Certification Number: E181974 | Certification Number: CQC18001186974 |