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  • ADC12DJ2700 5.4GSPS 单通道或 2.7GSPS 双通道 12 位射频采样模数转换器 (ADC)

    • ZHCSHD7A January   2018  – April 2020 ADC12DJ2700

      PRODUCTION DATA.  

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  • ADC12DJ2700 5.4GSPS 单通道或 2.7GSPS 双通道 12 位射频采样模数转换器 (ADC)
  1. 1 特性
    1.     ADC12DJ2700 测量的输入带宽
  2. 2 应用
  3. 3 说明
  4. 4 修订历史记录
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics: DC Specifications
    6. 6.6  Electrical Characteristics: Power Consumption
    7. 6.7  Electrical Characteristics: AC Specifications (Dual-Channel Mode)
    8. 6.8  Electrical Characteristics: AC Specifications (Single-Channel Mode)
    9. 6.9  Timing Requirements
    10. 6.10 Switching Characteristics
    11. 6.11 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Device Comparison
      2. 7.3.2 Analog Inputs
        1. 7.3.2.1 Analog Input Protection
        2. 7.3.2.2 Full-Scale Voltage (VFS) Adjustment
        3. 7.3.2.3 Analog Input Offset Adjust
      3. 7.3.3 ADC Core
        1. 7.3.3.1 ADC Theory of Operation
        2. 7.3.3.2 ADC Core Calibration
        3. 7.3.3.3 Analog Reference Voltage
        4. 7.3.3.4 ADC Overrange Detection
        5. 7.3.3.5 Code Error Rate (CER)
      4. 7.3.4 Temperature Monitoring Diode
      5. 7.3.5 Timestamp
      6. 7.3.6 Clocking
        1. 7.3.6.1 Noiseless Aperture Delay Adjustment (tAD Adjust)
        2. 7.3.6.2 Aperture Delay Ramp Control (TAD_RAMP)
        3. 7.3.6.3 SYSREF Capture for Multi-Device Synchronization and Deterministic Latency
          1. 7.3.6.3.1 SYSREF Position Detector and Sampling Position Selection (SYSREF Windowing)
          2. 7.3.6.3.2 Automatic SYSREF Calibration
      7. 7.3.7 Digital Down Converters (Dual-Channel Mode Only)
        1. 7.3.7.1 Numerically-Controlled Oscillator and Complex Mixer
          1. 7.3.7.1.1 NCO Fast Frequency Hopping (FFH)
          2. 7.3.7.1.2 NCO Selection
          3. 7.3.7.1.3 Basic NCO Frequency Setting Mode
          4. 7.3.7.1.4 Rational NCO Frequency Setting Mode
          5. 7.3.7.1.5 NCO Phase Offset Setting
          6. 7.3.7.1.6 NCO Phase Synchronization
        2. 7.3.7.2 Decimation Filters
        3. 7.3.7.3 Output Data Format
        4. 7.3.7.4 Decimation Settings
          1. 7.3.7.4.1 Decimation Factor
          2. 7.3.7.4.2 DDC Gain Boost
      8. 7.3.8 JESD204B Interface
        1. 7.3.8.1 Transport Layer
        2. 7.3.8.2 Scrambler
        3. 7.3.8.3 Link Layer
          1. 7.3.8.3.1 Code Group Synchronization (CGS)
          2. 7.3.8.3.2 Initial Lane Alignment Sequence (ILAS)
          3. 7.3.8.3.3 8b, 10b Encoding
          4. 7.3.8.3.4 Frame and Multiframe Monitoring
        4. 7.3.8.4 Physical Layer
          1. 7.3.8.4.1 SerDes Pre-Emphasis
        5. 7.3.8.5 JESD204B Enable
        6. 7.3.8.6 Multi-Device Synchronization and Deterministic Latency
        7. 7.3.8.7 Operation in Subclass 0 Systems
      9. 7.3.9 Alarm Monitoring
        1. 7.3.9.1 NCO Upset Detection
        2. 7.3.9.2 Clock Upset Detection
    4. 7.4 Device Functional Modes
      1. 7.4.1 Dual-Channel Mode
      2. 7.4.2 Single-Channel Mode (DES Mode)
      3. 7.4.3 JESD204B Modes
        1. 7.4.3.1 JESD204B Output Data Formats
        2. 7.4.3.2 Dual DDC and Redundant Data Mode
      4. 7.4.4 Power-Down Modes
      5. 7.4.5 Test Modes
        1. 7.4.5.1 Serializer Test-Mode Details
        2. 7.4.5.2 PRBS Test Modes
        3. 7.4.5.3 Ramp Test Mode
        4. 7.4.5.4 Short and Long Transport Test Mode
          1. 7.4.5.4.1 Short Transport Test Pattern
          2. 7.4.5.4.2 Long Transport Test Pattern
        5. 7.4.5.5 D21.5 Test Mode
        6. 7.4.5.6 K28.5 Test Mode
        7. 7.4.5.7 Repeated ILA Test Mode
        8. 7.4.5.8 Modified RPAT Test Mode
      6. 7.4.6 Calibration Modes and Trimming
        1. 7.4.6.1 Foreground Calibration Mode
        2. 7.4.6.2 Background Calibration Mode
        3. 7.4.6.3 Low-Power Background Calibration (LPBG) Mode
      7. 7.4.7 Offset Calibration
      8. 7.4.8 Trimming
      9. 7.4.9 Offset Filtering
    5. 7.5 Programming
      1. 7.5.1 Using the Serial Interface
        1. 7.5.1.1 SCS
        2. 7.5.1.2 SCLK
        3. 7.5.1.3 SDI
        4. 7.5.1.4 SDO
        5. 7.5.1.5 Streaming Mode
    6. 7.6 Register Maps
      1. 7.6.1 Memory Map
      2. 7.6.2 Register Descriptions
        1. 7.6.2.1  Standard SPI-3.0 (0x000 to 0x00F)
          1. Table 46. Standard SPI-3.0 Registers
          2. 7.6.2.1.1 Configuration A Register (address = 0x000) [reset = 0x30]
            1. Table 47. CONFIG_A Field Descriptions
          3. 7.6.2.1.2 Device Configuration Register (address = 0x002) [reset = 0x00]
            1. Table 48. DEVICE_CONFIG Field Descriptions
          4. 7.6.2.1.3 Chip Type Register (address = 0x003) [reset = 0x03]
            1. Table 49. CHIP_TYPE Field Descriptions
          5. 7.6.2.1.4 Chip ID Register (address = 0x004 to 0x005) [reset = 0x0020]
            1. Table 50. CHIP_ID Field Descriptions
          6. 7.6.2.1.5 Chip Version Register (address = 0x006) [reset = 0x01]
            1. Table 51. CHIP_VERSION Field Descriptions
          7. 7.6.2.1.6 Vendor Identification Register (address = 0x00C to 0x00D) [reset = 0x0451]
            1. Table 52. VENDOR_ID Field Descriptions
        2. 7.6.2.2  User SPI Configuration (0x010 to 0x01F)
          1. 7.6.2.2.1 User SPI Configuration Register (address = 0x010) [reset = 0x00]
            1. Table 54. USR0 Field Descriptions
        3. 7.6.2.3  Miscellaneous Analog Registers (0x020 to 0x047)
          1. 7.6.2.3.1 Clock Control Register 0 (address = 0x029) [reset = 0x00]
            1. Table 56. CLK_CTRL0 Field Descriptions
          2. 7.6.2.3.2 Clock Control Register 1 (address = 0x02A) [reset = 0x00]
            1. Table 57. CLK_CTRL1 Field Descriptions
          3. 7.6.2.3.3 SYSREF Capture Position Register (address = 0x02C-0x02E) [reset = Undefined]
            1. Table 58. SYSREF_POS Field Descriptions
          4. 7.6.2.3.4 INA Full-Scale Range Adjust Register (address = 0x030-0x031) [reset = 0xA000]
            1. Table 59. FS_RANGE_A Field Descriptions
          5. 7.6.2.3.5 INB Full-Scale Range Adjust Register (address = 0x032-0x033) [reset = 0xA000]
            1. Table 60. FS_RANGE_B Field Descriptions
          6. 7.6.2.3.6 Internal Reference Bypass Register (address = 0x038) [reset = 0x00]
            1. Table 61. BG_BYPASS Field Descriptions
          7. 7.6.2.3.7 TMSTP± Control Register (address = 0x03B) [reset = 0x00]
            1. Table 62. TMSTP_CTRL Field Descriptions
        4. 7.6.2.4  Serializer Registers (0x048 to 0x05F)
          1. 7.6.2.4.1 Serializer Pre-Emphasis Control Register (address = 0x048) [reset = 0x00]
            1. Table 64. SER_PE Field Descriptions
        5. 7.6.2.5  Calibration Registers (0x060 to 0x0FF)
          1. 7.6.2.5.1  Input Mux Control Register (address = 0x060) [reset = 0x01]
            1. Table 66. INPUT_MUX Field Descriptions
          2. 7.6.2.5.2  Calibration Enable Register (address = 0x061) [reset = 0x01]
            1. Table 67. CAL_EN Field Descriptions
          3. 7.6.2.5.3  Calibration Configuration 0 Register (address = 0x062) [reset = 0x01]
            1. Table 68. CAL_CFG0 Field Descriptions
          4. 7.6.2.5.4  Calibration Status Register (address = 0x06A) [reset = Undefined]
            1. Table 69. CAL_STATUS Field Descriptions
          5. 7.6.2.5.5  Calibration Pin Configuration Register (address = 0x06B) [reset = 0x00]
            1. Table 70. CAL_PIN_CFG Field Descriptions
          6. 7.6.2.5.6  Calibration Software Trigger Register (address = 0x06C) [reset = 0x01]
            1. Table 71. CAL_SOFT_TRIG Field Descriptions
          7. 7.6.2.5.7  Low-Power Background Calibration Register (address = 0x06E) [reset = 0x88]
            1. Table 72. CAL_LP Field Descriptions
          8. 7.6.2.5.8  Calibration Data Enable Register (address = 0x070) [reset = 0x00]
            1. Table 73. CAL_DATA_EN Field Descriptions
          9. 7.6.2.5.9  Calibration Data Register (address = 0x071) [reset = Undefined]
            1. Table 74. CAL_DATA Field Descriptions
          10. 7.6.2.5.10 Channel A Gain Trim Register (address = 0x07A) [reset = Undefined]
            1. Table 75. GAIN_TRIM_A Field Descriptions
          11. 7.6.2.5.11 Channel B Gain Trim Register (address = 0x07B) [reset = Undefined]
            1. Table 76. GAIN_TRIM_B Field Descriptions
          12. 7.6.2.5.12 Band-Gap Reference Trim Register (address = 0x07C) [reset = Undefined]
            1. Table 77. BG_TRIM Field Descriptions
          13. 7.6.2.5.13 VINA Input Resistor Trim Register (address = 0x07E) [reset = Undefined]
            1. Table 78. RTRIM_A Field Descriptions
          14. 7.6.2.5.14 VINB Input Resistor Trim Register (address = 0x07F) [reset = Undefined]
            1. Table 79. RTRIM_B Field Descriptions
          15. 7.6.2.5.15 Timing Adjust for A-ADC, Single-Channel Mode, Foreground Calibration Register (address = 0x080) [reset = Undefined]
            1. Table 80. TADJ_A_FG90 Field Descriptions
          16. 7.6.2.5.16 Timing Adjust for B-ADC, Single-Channel Mode, Foreground Calibration Register (address = 0x081) [reset = Undefined]
            1. Table 81. TADJ_B_FG0 Field Descriptions
          17. 7.6.2.5.17 Timing Adjust for A-ADC, Single-Channel Mode, Background Calibration Register (address = 0x082) [reset = Undefined]
            1. Table 82. TADJ_B_FG0 Field Descriptions
          18. 7.6.2.5.18 Timing Adjust for C-ADC, Single-Channel Mode, Background Calibration Register (address = 0x083) [reset = Undefined]
            1. Table 83. TADJ_B_FG0 Field Descriptions
          19. 7.6.2.5.19 Timing Adjust for C-ADC, Single-Channel Mode, Background Calibration Register (address = 0x084) [reset = Undefined]
            1. Table 84. TADJ_B_FG0 Field Descriptions
          20. 7.6.2.5.20 Timing Adjust for B-ADC, Single-Channel Mode, Background Calibration Register (address = 0x085) [reset = Undefined]
            1. Table 85. TADJ_B_FG0 Field Descriptions
          21. 7.6.2.5.21 Timing Adjust for A-ADC, Dual-Channel Mode Register (address = 0x086) [reset = Undefined]
            1. Table 86. TADJ_A Field Descriptions
          22. 7.6.2.5.22 Timing Adjust for C-ADC Acting for A-ADC, Dual-Channel Mode Register (address = 0x087) [reset = Undefined]
            1. Table 87. TADJ_CA Field Descriptions
          23. 7.6.2.5.23 Timing Adjust for C-ADC Acting for B-ADC, Dual-Channel Mode Register (address = 0x088) [reset = Undefined]
            1. Table 88. TADJ_CB Field Descriptions
          24. 7.6.2.5.24 Timing Adjust for B-ADC, Dual-Channel Mode Register (address = 0x089) [reset = Undefined]
            1. Table 89. TADJ_B Field Descriptions
          25. 7.6.2.5.25 Offset Adjustment for A-ADC and INA Register (address = 0x08A-0x08B) [reset = Undefined]
            1. Table 90. OADJ_A_INA Field Descriptions
          26. 7.6.2.5.26 Offset Adjustment for A-ADC and INB Register (address = 0x08C-0x08D) [reset = Undefined]
            1. Table 91. OADJ_A_INB Field Descriptions
          27. 7.6.2.5.27 Offset Adjustment for C-ADC and INA Register (address = 0x08E-0x08F) [reset = Undefined]
            1. Table 92. OADJ_C_INA Field Descriptions
          28. 7.6.2.5.28 Offset Adjustment for C-ADC and INB Register (address = 0x090-0x091) [reset = Undefined]
            1. Table 93. OADJ_C_INB Field Descriptions
          29. 7.6.2.5.29 Offset Adjustment for B-ADC and INA Register (address = 0x092-0x093) [reset = Undefined]
            1. Table 94. OADJ_B_INA Field Descriptions
          30. 7.6.2.5.30 Offset Adjustment for B-ADC and INB Register (address = 0x094-0x095) [reset = Undefined]
            1. Table 95. OADJ_B_INB Field Descriptions
          31. 7.6.2.5.31 Offset Filtering Control 0 Register (address = 0x097) [reset = 0x00]
            1. Table 96. OSFILT0 Field Descriptions
          32. 7.6.2.5.32 Offset Filtering Control 1 Register (address = 0x098) [reset = 0x33]
            1. Table 97. OSFILT1 Field Descriptions
        6. 7.6.2.6  ADC Bank Registers (0x100 to 0x15F)
          1. 7.6.2.6.1  Timing Adjustment for Bank 0 (0° Clock) Register (address = 0x102) [reset = Undefined]
            1. Table 99. B0_TIME_0 Field Descriptions
          2. 7.6.2.6.2  Timing Adjustment for Bank 0 (–90° Clock) Register (address = 0x103) [reset = Undefined]
            1. Table 100. B0_TIME_90 Field Descriptions
          3. 7.6.2.6.3  Timing Adjustment for Bank 1 (0° Clock) Register (address = 0x112) [reset = Undefined]
            1. Table 101. B1_TIME_0 Field Descriptions
          4. 7.6.2.6.4  Timing Adjustment for Bank 1 (–90° Clock) Register (address = 0x113) [reset = Undefined]
            1. Table 102. B1_TIME_90 Field Descriptions
          5. 7.6.2.6.5  Timing Adjustment for Bank 2 (0° Clock) Register (address = 0x122) [reset = Undefined]
            1. Table 103. B2_TIME_0 Field Descriptions
          6. 7.6.2.6.6  Timing Adjustment for Bank 2 (–90° Clock) Register (address = 0x123) [reset = Undefined]
            1. Table 104. B2_TIME_90 Field Descriptions
          7. 7.6.2.6.7  Timing Adjustment for Bank 3 (0° Clock) Register (address = 0x132) [reset = Undefined]
            1. Table 105. B3_TIME_0 Field Descriptions
          8. 7.6.2.6.8  Timing Adjustment for Bank 3 (–90° Clock) Register (address = 0x133) [reset = Undefined]
            1. Table 106. B3_TIME_90 Field Descriptions
          9. 7.6.2.6.9  Timing Adjustment for Bank 4 (0° Clock) Register (address = 0x142) [reset = Undefined]
            1. Table 107. B4_TIME_0 Field Descriptions
          10. 7.6.2.6.10 Timing Adjustment for Bank 4 (–90° Clock) Register (address = 0x143) [reset = Undefined]
            1. Table 108. B4_TIME_90 Field Descriptions
          11. 7.6.2.6.11 Timing Adjustment for Bank 5 (0° Clock) Register (address = 0x152) [reset = Undefined]
            1. Table 109. B5_TIME_0 Field Descriptions
          12. 7.6.2.6.12 Timing Adjustment for Bank 5 (–90° Clock) Register (address = 0x153) [reset = Undefined]
            1. Table 110. B5_TIME_90 Field Descriptions
        7. 7.6.2.7  LSB Control Registers (0x160 to 0x1FF)
          1. 7.6.2.7.1 LSB Control Bit Output Register (address = 0x160) [reset = 0x00]
            1. Table 112. ENC_LSB Field Descriptions
        8. 7.6.2.8  JESD204B Registers (0x200 to 0x20F)
          1. 7.6.2.8.1  JESD204B Enable Register (address = 0x200) [reset = 0x01]
            1. Table 114. JESD_EN Field Descriptions
          2. 7.6.2.8.2  JESD204B Mode Register (address = 0x201) [reset = 0x02]
            1. Table 115. JMODE Field Descriptions
          3. 7.6.2.8.3  JESD204B K Parameter Register (address = 0x202) [reset = 0x1F]
            1. Table 116. KM1 Field Descriptions
          4. 7.6.2.8.4  JESD204B Manual SYNC Request Register (address = 0x203) [reset = 0x01]
            1. Table 117. JSYNC_N Field Descriptions
          5. 7.6.2.8.5  JESD204B Control Register (address = 0x204) [reset = 0x02]
            1. Table 118. JCTRL Field Descriptions
          6. 7.6.2.8.6  JESD204B Test Pattern Control Register (address = 0x205) [reset = 0x00]
            1. Table 119. JTEST Field Descriptions
          7. 7.6.2.8.7  JESD204B DID Parameter Register (address = 0x206) [reset = 0x00]
            1. Table 120. DID Field Descriptions
          8. 7.6.2.8.8  JESD204B Frame Character Register (address = 0x207) [reset = 0x00]
            1. Table 121. FCHAR Field Descriptions
          9. 7.6.2.8.9  JESD204B, System Status Register (address = 0x208) [reset = Undefined]
            1. Table 122. JESD_STATUS Field Descriptions
          10. 7.6.2.8.10 JESD204B Channel Power-Down Register (address = 0x209) [reset = 0x00]
            1. Table 123. PD_CH Field Descriptions
          11. 7.6.2.8.11 JESD204B Extra Lane Enable (Link A) Register (address = 0x20A) [reset = 0x00]
            1. Table 124. JESD204B Extra Lane Enable (Link A) Field Descriptions
          12. 7.6.2.8.12 JESD204B Extra Lane Enable (Link B) Register (address = 0x20B) [reset = 0x00]
            1. Table 125. JESD204B Extra Lane Enable (Link B) Field Descriptions
        9. 7.6.2.9  Digital Down Converter Registers (0x210-0x2AF)
          1. 7.6.2.9.1  DDC Configuration Register (address = 0x210) [reset = 0x00]
            1. Table 127. DDC_CFG Field Descriptions
          2. 7.6.2.9.2  Overrange Threshold 0 Register (address = 0x211) [reset = 0xF2]
            1. Table 128. OVR_T0 Field Descriptions
          3. 7.6.2.9.3  Overrange Threshold 1 Register (address = 0x212) [reset = 0xAB]
            1. Table 129. OVR_T1 Field Descriptions
          4. 7.6.2.9.4  Overrange Configuration Register (address = 0x213) [reset = 0x07]
            1. Table 130. OVR_CFG Field Descriptions
          5. 7.6.2.9.5  DDC Configuration Preset Mode Register (address = 0x214) [reset = 0x00]
            1. Table 131. CMODE Field Descriptions
          6. 7.6.2.9.6  DDC Configuration Preset Select Register (address = 0x215) [reset = 0x00]
            1. Table 132. CSEL Field Descriptions
          7. 7.6.2.9.7  Digital Channel Binding Register (address = 0x216) [reset = 0x02]
            1. Table 133. DIG_BIND Field Descriptions
          8. 7.6.2.9.8  Rational NCO Reference Divisor Register (address = 0x217 to 0x218) [reset = 0x0000]
            1. Table 134. NCO_RDIV Field Descriptions
          9. 7.6.2.9.9  NCO Synchronization Register (address = 0x219) [reset = 0x02]
            1. Table 135. NCO_SYNC Field Descriptions
          10. 7.6.2.9.10 NCO Frequency (DDC A or DDC B and Preset x) Register (address = see ) [reset = see ]
            1. Table 136. FREQAx or FREQBx Field Descriptions
          11. 7.6.2.9.11 NCO Phase (DDC A or DDC B and Preset x) Register (address = see ) [reset = see ]
            1. Table 137. PHASEAx or PHASEBx Field Descriptions
        10. 7.6.2.10 Spin Identification Register (address = 0x297) [reset = Undefined]
          1. Table 138. SPIN_ID Field Descriptions
      3. 7.6.3 SYSREF Calibration Registers (0x2B0 to 0x2BF)
        1. 7.6.3.1 SYSREF Calibration Enable Register (address = 0x2B0) [reset = 0x00]
          1. Table 140. SRC_EN Field Descriptions
        2. 7.6.3.2 SYSREF Calibration Configuration Register (address = 0x2B1) [reset = 0x05]
          1. Table 141. SRC_CFG Field Descriptions
        3. 7.6.3.3 SYSREF Calibration Status Register (address = 0x2B2 to 0x2B4) [reset = Undefined]
          1. Table 142. SRC_STATUS Field Descriptions
        4. 7.6.3.4 DEVCLK Aperture Delay Adjustment Register (address = 0x2B5 to 0x2B7) [reset = 0x000000]
          1. Table 143. TAD Field Descriptions
        5. 7.6.3.5 DEVCLK Timing Adjust Ramp Control Register (address = 0x2B8) [reset = 0x00]
          1. Table 144. TAD_RAMP Field Descriptions
      4. 7.6.4 Alarm Registers (0x2C0 to 0x2C2)
        1. 7.6.4.1 Alarm Interrupt Register (address = 0x2C0) [reset = Undefined]
          1. Table 146. ALARM Field Descriptions
        2. 7.6.4.2 Alarm Status Register (address = 0x2C1) [reset = 0x1F]
          1. Table 147. ALM_STATUS Field Descriptions
        3. 7.6.4.3 Alarm Mask Register (address = 0x2C2) [reset = 0x1F]
          1. Table 148. ALM_MASK Field Descriptions
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Applications
      1. 8.2.1 Wideband RF Sampling Receiver
        1. 8.2.1.1 Design Requirements
          1. 8.2.1.1.1 Input Signal Path
          2. 8.2.1.1.2 Clocking
        2. 8.2.1.2 Detailed Design Procedure
          1. 8.2.1.2.1 Calculating Values of AC-Coupling Capacitors
        3. 8.2.1.3 Application Curves
      2. 8.2.2 Reconfigurable Dual-Channel 2.5-GSPS or Single-Channel 5.0-Gsps Oscilloscope
        1. 8.2.2.1 Design Requirements
          1. 8.2.2.1.1 Input Signal Path
          2. 8.2.2.1.2 Clocking
          3. 8.2.2.1.3 ADC12DJ2700
        2. 8.2.2.2 Application Curves
    3. 8.3 Initialization Set Up
  9. 9 Power Supply Recommendations
    1. 9.1 Power Sequencing
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11器件和文档支持
    1. 11.1 器件支持
      1. 11.1.1 第三方产品免责声明
      2. 11.1.2 开发支持
    2. 11.2 文档支持
      1. 11.2.1 相关文档
    3. 11.3 接收文档更新通知
    4. 11.4 支持资源
    5. 11.5 商标
    6. 11.6 静电放电警告
    7. 11.7 Glossary
  12. 12机械、封装和可订购信息
  13. 重要声明
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DATA SHEET

ADC12DJ2700 5.4GSPS 单通道或 2.7GSPS 双通道 12 位射频采样模数转换器 (ADC)

本资源的原文使用英文撰写。 为方便起见，TI 提供了译文；由于翻译过程中可能使用了自动化工具，TI 不保证译文的准确性。 为确认准确性，请务必访问 ti.com 参考最新的英文版本（控制文档）。

1 特性

  • ADC 内核：
    • 12 位分辨率
    • 单通道模式下采样率高达 5.4GSPS
    • 双通道模式下采样率高达 2.7GSPS
  • 性能规格：
    • 本底噪声（无信号，VFS = 1.0VPP-DIFF）：
      • 双通道模式：–151.6dBFS/Hz
      • 单通道模式：–153.8dBFS/Hz
    • HD2、HD3：–65dBc，高达 3GHz
  • VCMI 为 0V 时的缓冲模拟输入：
    • 模拟输入带宽 (-3dB)：8.0GHz
    • 可用输入频率范围：>10GHz
    • 满量程输入电压（VFS，默认值）：0.8VPP
    • 模拟输入共模电压 (VICM)：0V
  • 无噪声孔径延迟 (TAD) 调节：
    • 采样精度控制：19fs 步长
    • 简化同步和交错
    • 温度和电压不变延迟
  • 简便易用的同步 特性：
    • 自动 SYSREF 计时校准
    • 样片标记时间戳
  • JESD204B 串行数据接口：
    • 支持子类 0 和 1
    • 最大通道速率：12.8Gbps
    • 多达 16 个通道可降低通道速率
  • 双通道模式下的数字下变频器：
    • 实际输出：DDC 旁路或双倍抽取
    • 复杂输出：4 倍、8 倍或 16 倍抽取
    • 每个 DDC 均具有四个独立的 32 位 NCO
  • 功耗：2.7W
  • 电源电压：1.1V、1.9V

    • ADC12DJ2700 测量的输入带宽

    ADC12DJ2700 D_BW_1stPage_SLVSD97.gif

2 应用

  • 通信测试仪（802.11ad，5G）
  • 卫星通信 (SATCOM)
  • 相控阵雷达、信号情报和电子情报
  • 合成孔径雷达 (SAR)
  • 飞行时间和激光雷达测距
  • 示波器和宽带数字转换器
  • 微波回程连线
  • 射频采样软件定义无线电 (SDR)
  • 光谱测量

3 说明

ADC12DJ2700 器件是一款射频采样千兆采样模数转换器 (ADC)，可对从直流到 10GHz 以上的输入频率进行直接采样。在双通道下，ADC12DJ2700 的最大采样率为 2700MSPS，单通道模式下的最大采样率为 5400MSPS。通道数（双通道模式）和奎斯特带宽（单通道模式）的可编程交换功能可用于开发灵活的硬件，以满足高通道数或宽瞬时信号带宽 应用的需求。8.0GHz 的全功率输入带宽 (-3dB)，可用频率在双通道和单通道模式下均超过 -3dB，可对频率捷变系统的 L、S、C 和 X 频带进行直接射频采样。

ADC12DJ2700 采用具有多达 16 个串行通道和子类 1 兼容性的高速 JESD204B 输出接口，可实现确定性延迟和多器件同步。串行输出通道支持高达 12.8Gbps 的速率，并可配置交换位速率和通道数。 创新同步 具有无噪声孔径延迟 (TAD) 调节和 SYSREF 窗口等创新的同步特性，简化了相控阵雷达和 MIMO 通信的系统设计。 采用双通道模式的可选数字下变频器 (DDC) 可以降低接口速率（实际和复杂抽取模式），支持数字化信号混合（仅复杂抽取模式）。

器件信息(1)

器件型号 封装 封装尺寸（标称值）
ADC12DJ2700 FCBGA (144) 10.00mm × 10.00mm
  1. 如需了解所有可用封装，请参见数据表末尾的封装选项附录。

4 修订历史记录

Changes from * Revision (January 2018) to A Revision

  • Changed Pin Functions table listed in alphanumeric order by pin name.Go
  • Deleted reference to footnote below the Pin Functions table and moved the information to the Power-Down Mode section.Go
  • Added Operating free-air temperature parameter to Absolute Maximum Ratings tableGo
  • Added Storage temperature parameter to Recommended Operating Conditions tableGo
  • Changed FFT plots in Typical Characteristics section to show improved look Go
  • Changed product description in Overview section Go
  • Changed Device Comparison section to include all devices in the family.Go
  • Changed location of Analog Reference Voltage section. Go
  • Changed location of Temperature Monitoring Diode section. Go
  • Added requirement for at least 3 rising edges of SYSREF before SYSREF_POS output is valid.Go
  • Added clarification of NCO synchronization using DC-coupled SYSREF.Go
  • Added clarification of NCO synchronization using AC-coupled SYSREF.Go
  • Changed note in Power-Down Modes section to caution note explaining reliable serializer operation instead of the information being presented under the Pin Functions table.Go
  • Changed the Low-Power Background Calibration (LPBG) Mode section to provide additional detail of how to operate the device in low-power background calibration mode.Go
  • Added clarity about offset calibration when both CAL_OS and CAL_BG are enabled. Go
  • Changed Trimming section to limit trimming to foreground (FG) calibration mode only to better reflect customer use cases and simplify the explanation..Go
  • Changed additional clarity to Offset Filtering section to explain the frequency domain impact of the feature.Go
  • Added ADC12DJ2700 Access Type Codes tableGo
  • Added Reconfigurable Dual-Channel 2.5-GSPS or Single-Channel 5.0-Gsps Oscilloscope sectionGo
  • Changed Top Layer Routing: Analog Inputs, CLK and SYSREF, DA0-3, DB0-3 to Bottom Layer Routing: Additional CLK Routing, DA4-7, DB4-7 figures Go

5 Pin Configuration and Functions

AAV Package
144-Ball Flip Chip BGA
Top View

Pin Functions

PIN I/O DESCRIPTION
NAME NO.
AGND A1, A2, A3, A6, A7, B2, B3, B4, B5, B6, B7, C6, D1, D6, E1, E6, F2, F3, F6, G2, G3, G6, H1, H6, J1, J6, L2, L3, L4, L5, L6, L7, M1, M2, M3, M6, M7 — Analog supply ground. Tie AGND and DGND to a common ground plane (GND) on the circuit board.
BG C3 O Band-gap voltage output. This pin is capable of sourcing only small currents and driving limited capacitive loads, as specified in the Recommended Operating Conditions table. This pin can be left disconnected if not used.
CALSTAT F7 O Foreground calibration status output or device alarm output. Functionality is programmed through CAL_STATUS_SEL. This pin can be left disconnected if not used.
CALTRIG E7 I Foreground calibration trigger input. This pin is only used if hardware calibration triggering is selected in CAL_TRIG_EN, otherwise software triggering is performed using CAL_SOFT_TRIG. Tie this pin to GND if not used.
CLK+ F1 I Device (sampling) clock positive input. The clock signal is strongly recommended to be AC-coupled to this input for best performance. In single-channel mode, the analog input signal is sampled on both the rising and falling edges. In dual-channel mode, the analog signal is sampled on the rising edge. This differential input has an internal untrimmed 100-Ω differential termination and is self-biased to the optimal input common-mode voltage as long as DEVCLK_LVPECL_EN is set to 0.
CLK– G1 I Device (sampling) clock negative input. TI strongly recommends using AC-coupling for best performance.
DA0+ E12 O High-speed serialized data output for channel A, lane 0, positive connection. This differential output must be AC-coupled and must always be terminated with a 100-Ω differential termination at the receiver. This pin can be left disconnected if not used.
DA0– F12 O High-speed serialized data output for channel A, lane 0, negative connection. This pin can be left disconnected if not used.
DA1+ C12 O High-speed serialized data output for channel A, lane 1, positive connection. This differential output must be AC-coupled and must always be terminated with a 100-Ω differential termination at the receiver. This pin can be left disconnected if not used.
DA1– D12 O High-speed serialized data output for channel A, lane 1, negative connection. This pin can be left disconnected if not used.
DA2+ A10 O High-speed serialized-data output for channel A, lane 2, positive connection. This differential output must be AC-coupled and must always be terminated with a 100-Ω differential termination at the receiver. This pin can be left disconnected if not used.
DA2– A11 O High-speed serialized-data output for channel A, lane 2, negative connection. This pin can be left disconnected if not used.
DA3+ A8 O High-speed serialized-data output for channel A, lane 3, positive connection. This differential output must be AC-coupled and must always be terminated with a 100-Ω differential termination at the receiver. This pin can be left disconnected if not used.
DA3– A9 O High-speed serialized-data output for channel A, lane 3, negative connection. This pin can be left disconnected if not used.
DA4+ E11 O High-speed serialized data output for channel A, lane 4, positive connection. This differential output must be AC-coupled and must always be terminated with a 100-Ω differential termination at the receiver. This pin can be left disconnected if not used.
DA4– F11 O High-speed serialized data output for channel A, lane 4, negative connection. This pin can be left disconnected if not used.
DA5+ C11 O High-speed serialized data output for channel A, lane 5, positive connection. This differential output must be AC-coupled and must always be terminated with a 100-Ω differential termination at the receiver. This pin can be left disconnected if not used.
DA5– D11 O High-speed serialized data output for channel A, lane 5, negative connection. This pin can be left disconnected if not used.
DA6+ B10 O High-speed serialized data output for channel A, lane 6, positive connection. This differential output must be AC-coupled and must always be terminated with a 100-Ω differential termination at the receiver. This pin can be left disconnected if not used.
DA6– B11 O High-speed serialized data output for channel A, lane 6, negative connection. This pin can be left disconnected if not used.
DA7+ B8 O High-speed serialized data output for channel A, lane 7, positive connection. This differential output must be AC-coupled and must always be terminated with a 100-Ω differential termination at the receiver. This pin can be left disconnected if not used.
DA7– B9 O High-speed serialized data output for channel A, lane 7, negative connection. This pin can be left disconnected if not used.
DB0+ H12 O High-speed serialized data output for channel B, lane 0, positive connection. This differential output must be AC-coupled and must always be terminated with a 100-Ω differential termination at the receiver. This pin can be left disconnected if not used.
DB0– G12 O High-speed serialized data output for channel B, lane 0, negative connection. This pin can be left disconnected if not used.
DB1+ K12 O High-speed serialized data output for channel B, lane 1, positive connection. This differential output must be AC-coupled and must always be terminated with a 100-Ω differential termination at the receiver. This pin can be left disconnected if not used.
DB1– J12 O High-speed serialized data output for channel B, lane 1, negative connection. This pin can be left disconnected if not used.
DB2+ M10 O High-speed serialized data output for channel B, lane 2, positive connection. This differential output must be AC-coupled and must always be terminated with a 100-Ω differential termination at the receiver. This pin can be left disconnected if not used.
DB2– M11 O High-speed serialized data output for channel B, lane 2, negative connection. This pin can be left disconnected if not used.
DB3+ M8 O High-speed serialized data output for channel B, lane 3, positive connection. This differential output must be AC-coupled and must always be terminated with a 100-Ω differential termination at the receiver. This pin can be left disconnected if not used.
DB3– M9 O High-speed serialized data output for channel B, lane 3, negative connection. This pin can be left disconnected if not used.
DB4+ H11 O High-speed serialized data output for channel B, lane 4, positive connection. This differential output must be AC-coupled and must always be terminated with a 100-Ω differential termination at the receiver. This pin can be left disconnected if not used.
DB4– G11 O High-speed serialized data output for channel B, lane 4, negative connection. This pin can be left disconnected if not used.
DB5+ K11 O High-speed serialized data output for channel B, lane 5, positive connection. This differential output must be AC-coupled and must always be terminated with a 100-Ω differential termination at the receiver. This pin can be left disconnected if not used.
DB5– J11 O High-speed serialized data output for channel B, lane 5, negative connection. This pin can be left disconnected if not used.
DB6+ L10 O High-speed serialized data output for channel B, lane 6, positive connection. This differential output must be AC-coupled and must always be terminated with a 100-Ω differential termination at the receiver. This pin can be left disconnected if not used.
DB6– L11 O High-speed serialized data output for channel B, lane 6, negative connection. This pin can be left disconnected if not used.
DB7+ L8 O High-speed serialized data output for channel B, lane 7, positive connection. This differential output must be AC-coupled and must always be terminated with a 100-Ω differential termination at the receiver. This pin can be left disconnected if not used.
DB7– L9 O High-speed serialized data output for channel B, lane 7, negative connection. This pin can be left disconnected if not used.
DGND A12, B12, D9, D10, F9, F10, G9, G10, J9, J10, L12, M12 — Digital supply ground. Tie AGND and DGND to a common ground plane (GND) on the circuit board.
INA+ A4 I Channel A analog input positive connection. INA± is recommended for use in single channel mode for optimal performance. The differential full-scale input voltage is determined by the FS_RANGE_A register (see the Full-Scale Voltage (VFS) Adjustment section). This input is terminated to ground through a 50-Ω termination resistor. The input common-mode voltage is typically be set to 0 V (GND) and must follow the recommendations in the Recommended Operating Conditions table. This pin can be left disconnected if not used.
INA– A5 I Channel A analog input negative connection. INA± is recommended for use in single channel mode for optimal performance. See INA+ (pin A4) for detailed description. This input is terminated to ground through a 50-Ω termination resistor. This pin can be left disconnected if not used.
INB+ M4 I Channel B analog input positive connection. INA± is recommended for use in single channel mode for optimal performance. The differential full-scale input voltage is determined by the FS_RANGE_B register (see the Full-Scale Voltage (VFS) Adjustment section). This input is terminated to ground through a 50-Ω termination resistor. The input common-mode voltage is typically be set to 0 V (GND) and must follow the recommendations in the Recommended Operating Conditions table. This pin can be left disconnected if not used.
INB– M5 I Channel B analog input negative connection. INA± is recommended for use in single channel mode for optimal performance. See INA+ (pin A4) for detailed description. This input is terminated to ground through a 50-Ω termination resistor. This pin can be left disconnected if not used.
NCOA0 C7 I LSB of NCO selection control for DDC A. NCOA0 and NCOA1 select which NCO, of a possible four NCOs, is used for digital mixing when using a complex output JMODE. The remaining unselected NCOs continue to run to maintain phase coherency and can be swapped in by changing the values of NCOA0 and NCOA1 (when CMODE = 1). This pin is an asynchronous input. See the NCO Fast Frequency Hopping (FFH) and NCO Selection sections for more information. Tie this pin to GND if not used.
NCOA1 D7 I MSB of NCO selection control for DDC A. Tie this pin to GND if not used.
NCOB0 K7 I LSB of NCO selection control for DDC B. NCOB0 and NCOB1 select which NCO, of a possible four NCOs, is used for digital mixing when using a complex output JMODE. The remaining unselected NCOs continue to run to maintain phase coherency and can be swapped in by changing the values of NCOB0 and NCOB1 (when CMODE = 1). This pin is an asynchronous input. See the NCO Fast Frequency Hopping (FFH) and NCO Selection sections for more information. Tie this pin to GND if not used.
NCOB1 J7 I MSB of NCO selection control for DDC B. Tie this pin to GND if not used.
ORA0 C8 O Fast overrange detection status for channel A for the OVR_T0 threshold. When the analog input exceeds the threshold programmed into OVR_T0, this status indicator goes high. The minimum pulse duration is set by OVR_N. See the ADC Overrange Detection section for more information. This pin can be left disconnected if not used.
ORA1 D8 O Fast overrange detection status for channel A for the OVR_T1 threshold. When the analog input exceeds the threshold programmed into OVR_T1, this status indicator goes high. The minimum pulse duration is set by OVR_N. See the ADC Overrange Detection section for more information. This pin can be left disconnected if not used.
ORB0 K8 O Fast overrange detection status for channel B for the OVR_T0 threshold. When the analog input exceeds the threshold programmed into OVR_T0, this status indicator goes high. The minimum pulse duration is set by OVR_N. See the ADC Overrange Detection section for more information. This pin can be left disconnected if not used.
ORB1 J8 O Fast overrange detection status for channel B for the OVR_T1 threshold. When the analog input exceeds the threshold programmed into OVR_T1, this status indicator goes high. The minimum pulse duration is set by OVR_N. See the ADC Overrange Detection section for more information. This pin can be left disconnected if not used.
PD K6 I This pin disables all analog circuits and serializer outputs when set high for temperature diode calibration only. Do not use this pin to power down the device for power savings. Tie this pin to GND during normal operation. For information regarding reliable serializer operation, see the Power-Down Modes section.
SCLK F8 I Serial interface clock. This pin functions as the serial-interface clock input that clocks the serial programming data in and out. The Using the Serial Interface section describes the serial interface in more detail. Supports 1.1-V to 1.9-V CMOS levels.
SCS E8 I Serial interface chip select active low input. The Using the Serial Interface section describes the serial interface in more detail. Supports 1.1-V to 1.9-V CMOS levels. This pin has a 82-kΩ pullup resistor to VD11.
SDI G8 I Serial interface data input. The Using the Serial Interface section describes the serial interface in more detail. Supports 1.1-V to 1.9-V CMOS levels.
SDO H8 O Serial interface data output. The Using the Serial Interface section describes the serial interface in more detail. This pin is high impedance during normal device operation. This pin outputs 1.9-V CMOS levels during serial interface read operations. This pin can be left disconnected if not used.
SYNCSE C2 I Single-ended JESD204B SYNC signal. This input is an active low input that is used to initialize the JESD204C serial link in 8B/10B modes when SYNC_SEL is set to 0. When toggled low this input initiates code group synchronization (see the Code Group Synchronization (CGS) section). After code group synchronization, this input must be toggled high to start the initial lane alignment sequence (see the Initial Lane Alignment Sequence (ILAS) section). A differential SYNC signal can be used instead by setting SYNC_SEL to 1 and using TMSTP± as a differential SYNC input. Tie this pin to GND if differential SYNC (TMSTP±) is used as the JESD204B SYNC signal.
SYSREF+ K1 I The SYSREF positive input is used to achieve synchronization and deterministic latency across the JESD204B interface. This differential input (SYSREF+ to SYSREF–) has an internal untrimmed 100-Ω differential termination and can be AC-coupled when SYSREF_LVPECL_EN is set to 0. This input is self-biased when SYSREF_LVPECL_EN is set to 0. The termination changes to 50 Ω to ground on each input pin (SYSREF+ and SYSREF–) and can be DC-coupled when SYSREF_LVPECL_EN is set to 1. This input is not self-biased when SYSREF_LVPECL_EN is set to 1 and must be biased externally to the input common-mode voltage range provided in the Recommended Operating Conditions table.
SYSREF– L1 I SYSREF negative input
TDIODE+ K2 I Temperature diode positive (anode) connection. An external temperature sensor can be connected to TDIODE+ and TDIODE– to monitor the junction temperature of the device. This pin can be left disconnected if not used.
TDIODE– K3 I Temperature diode negative (cathode) connection. This pin can be left disconnected if not used.
TMSTP+ B1 I Timestamp input positive connection or differential JESD204B SYNC positive connection. This input is a timestamp input, used to mark a specific sample, when TIMESTAMP_EN is set to 1. This differential input is used as the JESD204B SYNC signal input when SYNC_SEL is set 1. This input can be used as both a timestamp and differential SYNC input at the same time, allowing feedback of the SYNC signal using the timestamp mechanism. TMSTP± uses active low signaling when used as a JESD204B SYNC. For additional usage information, see theTimestamp section.
TMSTP_RECV_EN must be set to 1 to use this input. This differential input (TMSTP+ to TMSTP–) has an internal untrimmed 100-Ω differential termination and can be AC-coupled when TMSTP_LVPECL_EN is set to 0. The termination changes to 50 Ω to ground on each input pin (TMSTP+ and TMSTP–) and can be DC coupled when TMSTP_LVPECL_EN is set to 1. This pin is not self-biased and therefore must be externally biased for both AC- and DC-coupled configurations. The common-mode voltage must be within the range provided in the Recommended Operating Conditions table when both AC and DC coupled. This pin can be left disconnected and disabled (TMSTP_RECV_EN = 0) if SYNCSE is used for JESD204B SYNC and timestamp is not required.
TMSTP– C1 I Timestamp input positive connection or differential JESD204B SYNC negative connection. This pin can be left disconnected and disabled (TMSTP_RECV_EN = 0) if SYNCSE is used for JESD204B SYNC and timestamp is not required.
VA11 C5, D2, D3, D5, E5, F5, G5, H5, J2, J3, J5, K5 I 1.1-V analog supply
VA19 C4, D4, E2, E3, E4, F4, G4, H2, H3, H4, J4, K4 I 1.9-V analog supply
VD11 C9, C10, E9, E10, G7, H7, H9, H10, K9, K10 I 1.1-V digital supply

6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1)
MIN MAX UNIT
Supply voltage range VA19(2) –0.3 2.35 V
VA11(2) –0.3 1.32
VD11(3) –0.3 1.32
Voltage between VD11 and VA11 –1.32 1.32
Voltage between AGND and DGND –0.1 0.1 V
Pin voltage range DA[7:0]+, DA[7:0]–, DB[7:0]+, DB[7:0]–, TMSTP+, TMSTP–(3) –0.5 min(1.32, VD11+0.5) V
CLK+, CLK–, SYSREF+, SYSREF–(2) –0.5 min(1.32, VA11+0.5)
BG, TDIODE+, TDIODE–(2) –0.5 min(2.35, VA19+0.5)
INA+, INA–, INB+, INB–(2) –1 1
CALSTAT, CALTRIG, NCOA0, NCOA1, NCOB0, NCOB1, ORA0, ORA1, ORB0, ORB1, PD, SCLK, SCS, SDI, SDO, SYNCSE(2) –0.5 VA19+0.5
Peak input current (any input except INA+, INA–, INB+, INB–) –25 25 mA
Peak input current (INA+, INA–, INB+, INB–) –50 50 mA
Peak RF input power (INA+, INA–, INB+, INB–) Single-ended with ZS-SE = 50 Ω or differential with ZS-DIFF = 100 Ω 16.4 dBm
Peak total input current (sum of absolute value of all currents forced in or out, not including power-supply current) 100 mA
Operating free-air temperature, TA –40 85 °C
Operating junction temperature, TJ 150 °C
Storage temperature, Tstg –65 150 °C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) Measured to AGND.
(3) Measured to DGND.

6.2 ESD Ratings

VALUE UNIT
V(ESD) Electrostatic discharge Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±2500 V
Charged-device model (CDM), per JEDEC specification JESD22-C101(2) ±1000
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)
MIN NOM MAX UNIT
VDD Supply voltage range VA19, analog 1.9-V supply(2) 1.8 1.9 2.0 V
VA11, analog 1.1-V supply(2) 1.05 1.1 1.15
VD11, digital 1.1-V supply(3) 1.05 1.1 1.15
VCMI Input common-mode voltage INA+, INA–, INB+, INB–(2) –50 0 100 mV
CLK+, CLK–, SYSREF+, SYSREF–(2)(4) 0 0.3 0.55 V
TMSTP+, TMSTP–(2)(5) 0 0.3 0.55
VID Input voltage, peak-to-peak differential CLK+ to CLK–, SYSREF+ to SYSREF–, TMSTP+ to TMSTP– 0.4 1.0 2.0 VPP-DIFF
INA+ to INA–, INB+ to INB– 1.0(6)
VIH High-level input voltage CALTRIG, NCOA0, NCOA1, NCOB0, NCOB1, PD, SCLK, SCS, SDI, SYNCSE(2) 0.7 V
VIL Low-level input voltage CALTRIG, NCOA0, NCOA1, NCOB0, NCOB1, PD, SCLK, SCS, SDI, SYNCSE(2) 0.45 V
IC_TD Temperature diode input current TDIODE+ to TDIODE– 100 µA
CL BG maximum load capacitance 50 pF
IO BG maximum output current 100 µA
DC Input clock duty cycle 30% 50% 70%
TA Operating free-air temperature –40 85 °C
TJ Operating junction temperature 105(1)(7) °C
Tstg Storage temperature –65 150 °C
(1) Prolonged use above this junction temperature may increase the device failure-in-time (FIT) rate.
(2) Measured to AGND.
(3) Measured to DGND.
(4) TI strongly recommends that CLK± be AC-coupled with DEVCLK_LVPECL_EN set to 0 to allow CLK± to self-bias to the optimal input common-mode voltage for best performance. TI recommends AC-coupling for SYSREF± unless DC-coupling is required, in which case, the LVPECL input mode must be used (SYSREF_LVPECL_EN = 1).
(5) TMSTP± does not have internal biasing that requires TMSTP± to be biased externally whether AC-coupled with TMSTP_LVPECL_EN = 0 or DC-coupled with TMSTP_LVPECL_EN = 1.
(6) The ADC output code saturates when VID for INA± or INB± exceeds the programmed full-scale voltage (VFS) set by FS_RANGE_A for INA± or FS_RANGE_B for INB±.
(7) Tested up to 1000 hours continuous operation at Tj = 125°C. See the Absolute Maximum Ratings table for the absolute maximum operational temperature.

6.4 Thermal Information

THERMAL METRIC(1) ADC12DJ2700 UNIT
AAV (FCBGA)
144 PINS
RθJA Junction-to-ambient thermal resistance 25.3 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 1.1 °C/W
RθJB Junction-to-board thermal resistance 8.2 °C/W
ψJT Junction-to-top characterization parameter 0.1 °C/W
ψJB Junction-to-board characterization parameter 8.2 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance n/a °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.

6.5 Electrical Characteristics: DC Specifications

typical values at TA = 25°C, VA19 = 1.9 V, VA11 = 1.1 V, VD11 = 1.1 V, default full-scale voltage (FS_RANGE_A = FS_RANGE_B = 0xA000), input signal applied to INA± in single-channel modes, fIN = 248 MHz, AIN = –1 dBFS, fCLK = maximum rated clock frequency, filtered 1-VPP sine-wave clock, JMODE = 1, and background calibration (unless otherwise noted); minimum and maximum values are at nominal supply voltages and over the operating free-air temperature range provided in the Recommended Operating Conditions table
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
DC ACCURACY
Resolution Resolution with no missing codes 12 Bits
DNL Differential nonlinearity Maximum positive excursion from ideal step size 0.7 LSB
Maximum negative excursion from ideal step size –0.3
INL Integral nonlinearity ±2.0 LSB
ANALOG INPUTS (INA+, INA–, INB+, INB–)
VOFF Offset error Default full-scale voltage, OS_CAL disabled ±0.6 mV
VOFF_ADJ Input offset voltage adjustment range Available offset correction range (see OS_CAL or OADJ_x_INx) ±55 mV
VOFF_DRIFT Offset drift Foreground calibration at nominal temperature only 23 µV/°C
Foreground calibration at each temperature 0
VIN_FSR Analog differential input full-scale range Default full-scale voltage (FS_RANGE_A = FS_RANGE_B = 0xA000) 750 800 850 mVPP
Maximum full-scale voltage (FS_RANGE_A = FS_RANGE_B = 0xFFFF) 1000 1040
Minimum full-scale voltage (FS_RANGE_A = FS_RANGE_B = 0x2000) 480 500
VIN_FSR_DRIFT Analog differential input full-scale range drift Default FS_RANGE_A and FS_RANGE_B setting, foreground calibration at nominal temperature only, inputs driven by a 50-Ω source, includes effect of RIN drift –0.01 %/°C
Default FS_RANGE_A and FS_RANGE_B setting, foreground calibration at each temperature, inputs driven by a 50-Ω source, includes effect of RIN drift 0.03
VIN_FSR_MATCH Analog differential input full-scale range matching Matching between INA+, INA– and INB+, INB–, default setting, dual-channel mode 0.625%
RIN Single-ended input resistance to AGND Each input pin is terminated to AGND, measured at TA = 25°C 48 50 52 Ω
RIN_TEMPCO Input termination linear temperature coefficient 17.6 mΩ/°C
CIN Single-ended input capacitance Single-channel mode at DC 0.4 pF
Dual-channel mode at DC 0.4
TEMPERATURE DIODE CHARACTERISTICS (TDIODE+, TDIODE–)
ΔVBE Temperature diode voltage slope Forced forward current of 100 µA. Offset voltage (approximately 0.792 V at 0°C) varies with process and must be measured for each part. Offset measurement must be done with the device unpowered or with the PD pin asserted to minimize device self-heating. The PD pin must be asserted only long enough to take the offset measurement. –1.6 mV/°C
BAND-GAP VOLTAGE OUTPUT (BG)
VBG Reference output voltage IL ≤ 100 µA 1.1 V
VBG_DRIFT Reference output temperature drift IL ≤ 100 µA –64 µV/°C
CLOCK INPUTS (CLK+, CLK–, SYSREF+, SYSREF–, TMSTP+, TMSTP–)
ZT Internal termination Differential termination with DEVCLK_LVPECL_EN = 0, SYSREF_LVPECL_EN = 0, and TMSTP_LVPECL_EN = 0 110 Ω
Single-ended termination to GND (per pin) with DEVCLK_LVPECL_EN = 0, SYSREF_LVPECL_EN = 0, and TMSTP_LVPECL_EN = 0 55
VCM Input common-mode voltage, self-biased Self-biasing common-mode voltage for CLK± when AC-coupled (DEVCLK_LVPECL_EN must be set to 0) 0.26 V
Self-biasing common-mode voltage for SYSREF± when AC-coupled (SYSREF_LVPECL_EN must be set to 0) and with receiver enabled (SYSREF_RECV_EN = 1) 0.29
Self-biasing common-mode voltage for SYSREF± when AC-coupled (SYSREF_LVPECL_EN must be set to 0) and with receiver disabled (SYSREF_RECV_EN = 0) VA11
CL_DIFF Differential input capacitance Between positive and negative differential input pins 0.1 pF
CL_SE Single-ended input capacitance Each input to ground 0.5 pF
SERDES OUTPUTS (DA[7:0]+, DA[7:0]–, DB[7:0]+, DB[7:0]–)
VOD Differential output voltage, peak-to-peak 100-Ω load 550 600 650 mVPP-DIFF
VCM Output common-mode voltage AC coupled VD11 / 2 V
ZDIFF Differential output impedance 100 Ω
CMOS INTERFACE: SCLK, SDI, SDO, SCS, PD, NCOA0, NCOA1, NCOB0, NCOB1, CALSTAT, CALTRIG, ORA0, ORA1, ORB0, ORB1, SYNCSE
IIH High-level input current –40 40 µA
IIL Low-level input current –40 40 µA
CI Input capacitance 2 pF
VOH High-level output voltage ILOAD = –400 µA 1.65 V
VOL Low-level output voltage ILOAD = 400 µA 150 mV

 
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