• Menu
  • Product
  • Email
  • PDF
  • Order now

  • TLIN1029-Q1具有显性状态超时、 LIN 收发器

    • ZHCSH94F October   2017  – May 2022 TLIN1029-Q1

      PRODUCTION DATA  

  • CONTENTS
  • SEARCH
  • TLIN1029-Q1具有显性状态超时、 LIN 收发器
  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 Revision History
  5. 5 说明（续）
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 ESD Ratings - IEC
    4. 7.4 Thermal Information
    5. 7.5 Recommended Operating Conditions
    6. 7.6 Electrical Characteristics
    7. 7.7 Switching Characteristics
    8. 7.8 Timing Requirements
    9. 7.9 Typical Characteristics
  8. 8 Parameter Measurement Information
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1  LIN (Local Interconnect Network) Bus
        1. 9.3.1.1 LIN Transmitter Characteristics
        2. 9.3.1.2 LIN Receiver Characteristics
          1. 9.3.1.2.1 Termination
      2. 9.3.2  TXD (Transmit Input and Output)
      3. 9.3.3  RXD (Receive Output)
      4. 9.3.4  VSUP (Supply Voltage)
      5. 9.3.5  GND (Ground)
      6. 9.3.6  EN (Enable Input)
      7. 9.3.7  Protection Features
      8. 9.3.8  TXD Dominant Time Out (DTO)
      9. 9.3.9  Bus Stuck Dominant System Fault: False Wake-Up Lockout
      10. 9.3.10 Thermal Shutdown
      11. 9.3.11 Under Voltage on VSUP
      12. 9.3.12 Unpowered Device and LIN Bus
    4. 9.4 Device Functional Modes
      1. 9.4.1 Normal Mode
      2. 9.4.2 Sleep Mode
      3. 9.4.3 Standby Mode
      4. 9.4.4 Wake-Up Events
        1. 9.4.4.1 Wake-Up Request (RXD)
        2. 9.4.4.2 Mode Transitions
  10. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Application
      1. 10.2.1 Design Requirements
      2. 10.2.2 Detailed Design Procedures
        1. 10.2.2.1 Normal Mode Application Note
        2. 10.2.2.2 Standby Mode Application Note
          1. 10.2.2.2.1 TXD Dominant State Timeout Application Note
      3. 10.2.3 Application Curves
  11. 11Power Supply Recommendations
  12. 12Layout
    1. 12.1 Layout Guidelines
    2. 12.2 Layout Example
  13. 13Device and Documentation Support
    1. 13.1 Documentation Support
      1. 13.1.1 Related Documentation
    2. 13.2 Receiving Notification of Documentation Updates
    3. 13.3 支持资源
    4. 13.4 Trademarks
    5. 13.5 Electrostatic Discharge Caution
    6. 13.6 术语表
  14. 14Mechanical, Packaging, and Orderable Information
  15. 重要声明
search No matches found.
  • Full reading width
    • Full reading width
    • Comfortable reading width
    • Expanded reading width
  • Card for each section
  • Card with all content

 

DATA SHEET

TLIN1029-Q1具有显性状态超时、 LIN 收发器

本资源的原文使用英文撰写。 为方便起见，TI 提供了译文；由于翻译过程中可能使用了自动化工具，TI 不保证译文的准确性。 为确认准确性，请务必访问 ti.com 参考最新的英文版本（控制文档）。

1 特性

  • 符合面向汽车应用的 AEC-Q100 标准
    • 温度等级 1：–40°C 至 125°C TA
    • 器件 HBM 认证等级：±8kV
    • 器件 CDM 认证等级：±1.5kV
  • 符合 LIN 2.0、LIN 2.1、LIN 2.2、LIN 2.2A 和 ISO/DIS 17987-4.2 标准（请参阅 SLLA490）
  • 符合适用于 LIN 的 SAE J2602 推荐实践的要求（请参阅 SLLA490）
  • 支持 ISO 9141 (K-Line)
  • 支持 12V 应用
  • LIN 传输数据速率高达 20 kbps
  • 宽工作范围
    • 4V 至 36V 电源电压
    • ±45V LIN 总线故障保护
  • 休眠模式：超低电流消耗支持以下类型的唤醒事件：
    • LIN 总线
    • 通过 EN 引脚进行的本地唤醒
  • 上电和断电无干扰运行
  • 保护特性：
    • VSUP 欠压保护
    • TXD 显性超时 (DTO) 保护
    • 热关断保护
    • 系统级未供电节点或接地断开失效防护。
  • 采用 SOIC (8) 和无引线 VSON (8) 封装，提高了自动光学检测 (AOI) 能力

2 应用

  • 车身电子装置和照明
  • 信息娱乐系统与仪表组
  • 混合动力电动汽车和动力总成系统
  • 被动安全
  • 电器

3 说明

TLIN1029-Q1 是一款本地互连网络 (LIN) 物理层收发器，集成了唤醒和保护功能，兼容 LIN 2.0、LIN 2.1、LIN 2.2、LIN 2.2 A 和 ISO/DIS 17987–4.2 标准。LIN 是一种单线双向总线，通常用于数据传输速率高达 20 kbps 的车载网络。TLIN1029-Q1 旨在为 12V 应用提供支持，具有更宽的工作电压范围和额外的总线故障保护。

LIN 接收器支持高达 100 kbps 的数据传输速率，从而更快速地执行内联编程。TLIN1029-Q1 使用一个可降低电磁辐射 (EME) 的限流波形整形驱动器将 TXD 输入上的数据流转化为 LIN 总线信号。接收器将数据流转化为逻辑电平信号，此信号通过开漏 RXD 引脚发送到微处理器。休眠模式可实现超低电流消耗，该模式允许通过 LIN 总线或 EN 引脚实现唤醒。

器件信息
器件型号封装(1)封装尺寸（标称值）
TLIN1029-Q1SOIC (D) (8)4.90mm x 3.91mm
VSON (DRB) (8)3.00mm x 3.00mm
(1) 如需了解所有可用封装，请参阅数据表末尾的可订购产品附录。
简化版原理图，指挥官模式
GUID-717EA525-6C58-43F2-90EE-972E7D3B9095-low.gif简化版原理图，响应者模式

4 Revision History

Changes from Revision E (May 2020) to Revision F (May 2022)

  • 将提到的所有旧术语实例更改为“指挥官”和“响应者”。Go

Changes from Revision D (March 2020) to Revision E (May 2020)

  • 添加了：（参阅 SLLA490），位于特性 列表Go
  • Added : See errata TLIN1029-Q1 and TLIN2029-Q1 Duty Cycle Over VSUP Go

Changes from Revision C (July 2019) to Revision D (March 2020)

  • 将 200pF 电容器更改为：220pF，在简化原理图，指挥官模式 中Go
  • 将 200pF 电容器更改为：220pF，在简化原理图，响应者模式 中Go
  • Changed VLIN from MIN = –58, MAX = 58 To: MIN = –60, MAX = 60 in the Absolute Maximum RatingsGo
  • Changed CLINPIN from MAX = 45 pF To: MAX = 25 pF and added VSUP = 14 V for Test Condition in Electrical Characteristics Go
  • Changed text From: "... a 200 pF capacitor" To: "... a 220 pF capacitor" For Pin 6 (LIN) in the Layout Guidelines Go

Changes from Revision B (February 2018) to Revision C (July 2019)

  • 将 SOIC 封装尺寸从：4.90mm x 6.00mm 更改为4.90mm x 3.91mm，在器件信息 中Go
  • 将 220pF 电容器更改为：200pF，在简化原理图，指挥官模式 中Go
  • 将 220pF 电容器更改为：200pF，在简化原理图，响应者模式 中Go
  • Changed VLOGIC absolute maximum rating MAX from 5.5 V to 6 VGo
  • Changed the title of Figure 10-2 To: Recessive to Dominant PropagationGo
  • Changed the title of Figure 10-3 To: Dominant to Recessive PropagationGo
  • Changed text From: "... a 220 pF capacitor" To: "... a 200 pF capacitor" For Pin 6 (LIN) in the Layout Guidelines Go

Changes from Revision A (December 2017) to Revision B (February 2018)

  • 在整个数据表中将“特性”和“说明”中的“投诉 LIN 2.0...”更改为“符合 LIN 2.0...”Go
  • Changed From: "complaint to LIN 2.0..." To: "compliant to LIN 2.0..." in the Overview sectionGo

Changes from Revision * (October 2017) to Revision A (December 2017)

  • 将器件状态从预告信息 更改为量产数据 Go

5 说明（续）

集成电阻器、静电放电 (ESD) 和故障保护功能支持设计人员在其应用中节省布板空间。

6 Pin Configuration and Functions

Figure 6-1 D Package, 8-Pin (SOIC)
(Top View)
GUID-AAB08BF6-939D-4E12-BE14-C11EF9CF323F-low.gifFigure 6-2 DRB Package, 8-Pin (VSON)
Top View
Table 6-1 Pin Functions
PINTypeDESCRIPTION
NameNo.
RXD1DORXD output (open-drain) interface reporting state of LIN bus voltage
EN2DIEnable input - High puts the device in normal operation mode and low puts the device in sleep mode
NC3–Not connected
TXD4DITXD input interface to control state of LIN output - Internally pulled to ground
GND5GNDGround
LIN6HV I/OLIN bus single-wire transmitter and receiver
VSUP7HV SupplyDevice supply voltage (connected to battery in series with external reverse blocking diode)
NC8–Not connected
Thermal Pad-No electrical connection. Can be connected to the PCB to improve thermal coupling (DRB package only)

7 Specifications

7.1 Absolute Maximum Ratings

parameters valid across -40℃ ≤ TA ≤ 125℃ (unless otherwise noted)(1)
Symbol Parameter MIN MAX UNIT
VSUP Supply voltage range (ISO/DIS 17987 Param 10) –0.3 45 V
VLIN LIN bus input voltage (ISO/DIS 17987 Param 82) –45 45 V
VLOGIC Logic pin voltage (RXD, TXD, EN) –0.3 6 V
TA Ambient temperature range –40 125 °C
TJ Junction temperature range –55 150 °C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

7.2 ESD Ratings

ESD Ratings VALUE UNIT
V(ESD) Electrostatic discharge Human body model (HBM) TXD, RXD, EN Pins, per AEC Q100-002(1) ±4000 V
Human body model (HBM) LIN and VSUP Pin, per AEC Q100-002(2) ±8000
Charged device model (CDM), per AEC Q100-011 All terminals ±1500
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) LIN bus is stressed with respect to GND.

 
Texas Instruments

© Copyright 1995-2025 Texas Instruments Incorporated. All rights reserved.
Submit documentation feedback | IMPORTANT NOTICE | Trademarks | Privacy policy | Cookie policy | Terms of use | Terms of sale