ZHCSH28C September   2017  – May 2025 TPA3221

PRODUCTION DATA  

  1.   1
  2. 1 特性
  3. 2 应用
  4. 3 说明
  5. 4 Device Comparison Table
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Audio Characteristics (BTL)
    7. 6.7 Audio Characteristics (PBTL)
    8.     Typical Characteristics, BTL Configuration, AD-mode
    9.     Typical Characteristics, PBTL Configuration, AD-mode
  8. 7 Parameter Measurement Information
  9. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagrams
    3. 8.3 Feature Description
      1. 8.3.1 Internal LDO
        1. 8.3.1.1 Input Configuration, Gain Setting And Controller/Peripheral Operation
      2. 8.3.2 Gain Setting And Controller / Peripheral Operation
      3. 8.3.3 AD-Mode and HEAD-Mode PWM Modulation
      4. 8.3.4 Oscillator
      5. 8.3.5 Input Impedance
      6. 8.3.6 Error Reporting
    4. 8.4 Device Functional Modes
      1. 8.4.1 Powering Up
        1. 8.4.1.1 Startup Ramp Time
      2. 8.4.2 Powering Down
        1. 8.4.2.1 Power Down Ramp Time
      3. 8.4.3 Device Reset
      4. 8.4.4 Device Soft Mute
      5. 8.4.5 Device Protection System
        1. 8.4.5.1 Overload and Short Circuit Current Protection
        2. 8.4.5.2 Signal Clipping and Pulse Injector
        3. 8.4.5.3 DC Speaker Protection
        4. 8.4.5.4 Pin-to-Pin Short Circuit Protection (PPSC)
        5. 8.4.5.5 Overtemperature Protection OTW and OTE
        6. 8.4.5.6 Undervoltage Protection (UVP) and Power-on Reset (POR)
        7. 8.4.5.7 Fault Handling
  10. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Applications
      1. 9.2.1 Stereo BTL Application
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedures
          1. 9.2.1.2.1 Decoupling Capacitor Recommendations
          2. 9.2.1.2.2 PVDD Capacitor Recommendation
          3. 9.2.1.2.3 BST capacitors
          4. 9.2.1.2.4 PCB Material Recommendation
      2. 9.2.2 Typical Application, Differential (2N), AD-Mode PBTL (Outputs Paralleled before LC filter)
        1. 9.2.2.1 Design Requirements
      3. 9.2.3 Typical Application, Differential (2N), AD-Mode PBTL (Outputs Paralleled after LC filter)
        1. 9.2.3.1 Design Requirements
    3. 9.3 Power Supply Recommendations
      1. 9.3.1 Power Supplies
        1. 9.3.1.1 VDD Supply
        2. 9.3.1.2 AVDD and GVDD Supplies
        3. 9.3.1.3 PVDD Supply
        4. 9.3.1.4 BST Supply
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
      2. 9.4.2 Layout Examples
        1. 9.4.2.1 BTL Application Printed Circuit Board Layout Example
        2. 9.4.2.2 PBTL (Outputs Paralleled before LC filter) Application Printed Circuit Board Layout Example
        3. 9.4.2.3 PBTL (Outputs Paralleled after LC filter) Application Printed Circuit Board Layout Example
  11. 10Device and Documentation Support
    1. 10.1 Documentation Support
    2. 10.2 Receiving Notification of Documentation Updates
    3. 10.3 Community Resources
    4. 10.4 Trademarks
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information

8.3.6 Error Reporting

The FAULT, and OTW_CLIP, pins are active-low, open-drain outputs. The FAULT function is for protection-mode signaling to a system-control device. Any fault resulting in device shutdown is signaled by the FAULT pin going low. Also, OTW_CLIP goes low when the device junction temperature exceeds 125°C (see Table 8-3).

Table 8-3 Error Reporting
FAULTOTW_CLIP DESCRIPTION
00Overtemperature (OTE), overload (OLP), or undervoltage (UVP). Junction temperature higher than 125°C (overtemperature warning).
01Overload (OLP) or undervoltage (UVP). Junction temperature lower than 125°C
10Junction temperature higher than 125°C (overtemperature warning)
11Junction temperature lower than 125°C and no OLP or UVP faults (normal operation)

Note that asserting RESET low forces the FAULT signal high, independent of faults being present. TI recommends monitoring the OTW_CLIP signal using the system microcontroller and responding to an overtemperature warning signal by turning down the volume to prevent further heating of the device resulting in device shutdown (OTE).

To reduce external component count, an internal pullup resistor to 3.3 V is provided on both FAULT and OTW_CLIP outputs.