Data Sheet
TCAN1043xx-Q1 具有 CAN FD 和唤醒功能的汽车级低功耗故障保护 CAN 收发器
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1 特性
- AEC Q100：符合汽车应用要求
- 温度等级 1：TA = -55°C 至 125°C
- 器件 HBM 分级等级：±16kV
- 器件 CDM 分级等级：±1500V
- 功能安全型
- 符合 ISO 11898-2 (2016) 的要求
- 所有器件均支持经典 CAN 和 2Mbps CAN FD（灵活数据速率），而“G”选项支持 5Mbps
- 具有较短的对称传播延迟时间和快速循环次数，可增加时序裕量
- 在有负载 CAN 网络中实现更快的数据速率
- VIO 电平转换支持 2.8V 至 5.5V 的电压范围
- 工作模式
- 正常模式
- 具有 INH 输出以及本地和远程唤醒请求功能的待机模式
- 具有 INH 输出以及本地和远程唤醒请求的低功耗睡眠模式
- 未供电时具有无源行为
- 总线和逻辑终端处于高阻态（运行总线或应用上无负载）
- 支持热插拔：在总线和 RXD 输出上可实现上电和断电无干扰运行
- 符合或超出 EMC 标准要求
- 符合 IEC 62228-3 – 2007 标准
- 符合 SAE J2962-2 标准
- 保护特性
- 总线终端的 IEC ESD 保护：±8kV
- 总线故障保护：±58V（非 H 型号）和 ±70V（H 型号）
- 电源终端欠压保护
- 驱动器显性超时 (TXD DTO)：数据速率低至 9.2kbps
- 热关断保护 (TSD)
- 接收器共模输入电压：±30V
- 典型循环延迟：110ns
- 结温范围为 –55°C 至 150°C
- 采用 SOIC (14) 封装和无引线 VSON (14) 封装 (4.5mm x 3mm)，具有改进的自动光学检查 (AOI) 功能
2 应用
- 12V 或 24V 系统应用
- 汽车和运输
3 说明
TCAN1043xx-Q1 满足 ISO 11898–2 (2016) 高速控制器局域网 (CAN) 规范的物理层要求，提供 CAN 总线和 CAN 协议控制器之间的接口。这些器件支持传统 CAN 和 CAN FD 协议，具有最高 2Mbps 的数据速率。器件型号以“G”结尾的器件专为数据速率高达 5Mbps 的 CAN FD 应用而设计。TCAN1043xx-Q1 可以（通过 INH 输出引脚）选择性地启用节点上可能存在的各种电源，从而在整个系统级别减少电池电流消耗。这使得在超低电流睡眠状态中，功率传送到除 TCAN1043xx-Q1 以外的所有系统组件，而 TCAN1043xx-Q1 则仍然处于低功耗状态，并对 CAN 总线进行监控。
在总线上检测到唤醒模式或通过 WAKE 输入请求本地唤醒时，TCAN1043xx-Q1 会通过驱动 INH 高电平的方式发起节点启动。TCAN1043xx-Q1 包括通过 VIO 端子实现的内部逻辑电平转换功能，允许直接连接到 3.3V 或 5V 控制器。该器件包含很多保护和诊断功能，包括 CAN 总线短路检测和电池连接检测。TCAN1043xx-Q1 满足 IEC 62228-3 和 J2962-2 的 ESD 和 EMC 要求，无需额外增加保护组件。
4 Device Comparison Table
| DEVICE NUMBER | BUS FAULT PROTECTION | MAXIMUM DATA RATE |
|---|---|---|
| TCAN1043-Q1 | ±58V | 2Mbps |
| TCAN1043H-Q1 | ±70V | 2Mbps |
| TCAN1043G-Q1 | ±58V | 5Mbps |
| TCAN1043HG-Q1 | ±70V | 5Mbps |
5 Pin Configuration and Functions
Figure 5-1 D Package, 14 Pin (SOIC)
(Top View)
(Top View)
Figure 5-2 DMT Package, 14 Pin (VSON)
(Top View)
(Top View)
Table 5-1 Pin Functions
| PINS | TYPE | DESCRIPTION | |
|---|---|---|---|
| NAME | NO | ||
| TXD | 1 | Digital Input | CAN transmit data input (low for dominant and high for recessive bus states) |
| GND | 2 | GND | Ground connection |
| VCC | 3 | Supply | 5V CAN bus supply voltage |
| RXD | 4 | Digital Output | CAN receive data output (low for dominant and high for recessive bus states), tri-state |
| VIO | 5 | Supply | I/O supply voltage |
| EN | 6 | Digital Input | Enable input for mode control, integrated pull down |
| INH | 7 | High Voltage Output | Can be used to control system voltage regulators |
| nFAULT | 8 | Digital Output | Fault output, inverted logic |
| WAKE | 9 | High Voltage Input | Wake input terminal, high voltage input |
| VSUP | 10 | Supply | Reverse-blocked battery supply input |
| NC | 11 | — | No connect (not internally connected) |
| CANL | 12 | Bus I/O | Low-level CAN bus input/output line |
| CANH | 13 | Bus I/O | High-level CAN bus input/output line |
| nSTB | 14 | Digital Input | Standby input for mode control, integrated pull down |
6 Specifications
6.1 Absolute Maximum Ratings
See (1)(2)
| MIN | MAX | UNIT | |||
|---|---|---|---|---|---|
| VSUP | Battery supply (reverse-blocked) voltage range – standard versions | –0.3 | 58 | V | |
| Battery supply (reverse blocked) voltage range – H versions | –0.3 | 70 | V | ||
| VCC | 5-V bus supply voltage | –0.3 | 7 | V | |
| VIO | I/O level shifting voltage | –0.3 | 7 | V | |
| VBUS | CAN bus I/O voltage range (CANH, CANL) | Devices without the "H" suffix | –58 | 58 | V |
| CAN bus I/O voltage range (CANH, CANL) | Devices with the "H" suffix | –70 | 70 | V | |
| V(DIFF) | Max differential voltage between CANH and CANL | Devices without the "H" suffix | –58 | 58 | V |
| Devices with the "H" suffix | –70 | 70 | V | ||
| V(Logic_Input) | Logic input terminal voltage range | –0.3 | 7 | V | |
| V(Logic_Output) | Logic output terminal voltage range | –0.3 | 7 | V | |
| VINH | INH output pin voltage range | Devices without the "H" suffix | –0.3 | 58 and VO ≤ VSUP + 0.3 | V |
| INH output pin voltage range | H versions | –0.3 | 70 and VO ≤ VSUP + 0.3 | V | |
| V(WAKE) | WAKE input pin voltage range | Devices without the "H" suffix | –0.3 | 58 and VI ≤ VSUP + 0.3 | V |
| WAKE input pin voltage range | H versions | –0.3 | 70 and VI ≤ VSUP + 0.3 | V | |
| IO(LOGIC) | Logic output current | RXD, and nFAULT | 8 | mA | |
| IO(INH) | INH output current | 4 | mA | ||
| IO(WAKE) | Wake current if due to ground shifts V(WAKE) ≤ V(GND) – 0.3 V, thus the current into WAKE must be limited via an external serial resistor | 3 | mA | ||
| TJ | Operating virtual junction temperature range | –55 | 150 | °C | |
(1) Operation outside the Absolute Maximum Ratings may cause permanent device
damage. Absolute Maximum Ratings do not imply
functional operation of the device at these or any
other conditions beyond those listed under
Recommended Operating Conditions. If used outside
the Recommended Operating Conditions but within
the Absolute Maximum Ratings, the device may not
be fully functional, and this may affect device
reliability, functionality, performance, and
shorten the device lifetime.
(2) All voltage values, except differential I/O bus voltages, are with respect to ground terminal.
6.2 ESD Ratings
| VALUE | UNIT | ||||
|---|---|---|---|---|---|
| V(ESD) | Electrostatic discharge | Human body model (HBM), per AEC Q100-002 | VSUP, INH(1) | ±4000 | V |
| All pins, except VSUP, INH(1) | ±6000 | V | |||
| CAN bus terminals (CANH, CANL)(2) | ±16000 | V | |||
| Charged device model (CDM) - SOIC | All terminals(3) | ±1500 | V | ||
| Charged device model (CDM) - DMT | All terminals(3) | ±500 | V | ||
| Corner terminals(3) | ±750 | V | |||
| Machine model (MM) | All terminals(4) | ±200 | V | ||
(1) AEC Q100-002 indicates that HBM stressing shall be in accordance with the ANSI/ESDA/JEDEC JS-001 specification.
(2) Test method based upon AEC-Q100-002, CAN bus terminals stressed with respect to each other and to GND.
(3) Tested in accordance to AEC-Q100-011.
(4) Tested in accordance to JEDEC Standard 22, Test Method A115A.
6.3 ESD Ratings IEC Specification
| VALUE | UNIT | ||||
|---|---|---|---|---|---|
| V(ESD) | System level electrostatic discharge (ESD) | CAN bus terminals (CANH, CANL) to GND | ISO 10605 per SAE J2962-2: Powered Air Discharge(2) | ±15000 | V |
| ISO 10605 per SAE J2962-2: Powered Contact Discharge(2) | ±8000 | V | |||
| IEC 61000-4-2 (150 pF, 330 Ω): Unpowered contact discharge | ±15000 | V | |||
| VSUP and WAKE | IEC 61000-4-2 (150 pF, 330 Ω) Unpowered contact discharge | ±6000 | V | ||
| ISO 7637-2 Transients according to GIFT - ICT CAN EMC test specification(1) | CAN bus terminals (CANH, CANL) to GND, VSUP, WAKE | Pulse 1 | –100 | V | |
| Pulse 2 | +75 | V | |||
| Pulse 3a | –150 | V | |||
| Pulse 3b | +100 | V | |||
| ISO 7637-3 Transients | CAN bus terminals (CANH, CANL) to GND, VSUP, WAKE | Direct coupling capacitor "slow transient pulse" with 100-nF coupling capacitor - powered | ±85 | V | |
(1) ISO 7637 is a system level
transient test. Results given here are specific to the IBEE CAN EMC Test
specification conditions. Different system level configurations leads to
different results.
(2) Verified by external test facility on SOIC package
6.4 Recommended Operating Conditions
| MIN | NOM | MAX | UNIT | |||
|---|---|---|---|---|---|---|
| VSUP | Battery supply (reverse-blocked) voltage range - standard version | 4.5 | 45 | V | ||
| Battery supply (reverse-blocked) voltage range - H version | 4.5 | 60 | V | |||
| VCC | 5 V Supply Voltage | 4.5 | 5.5 | V | ||
| VIO | I/O supply voltage | 2.8 | 5.5 | V | ||
| IOH(LOGIC) | Logic terminal high level output current – RXD and nFAULT | –2 | mA | |||
| IOL(LOGIC) | Logic terminal low level output current – RXD and nFAULT | 2 | mA | |||
| IO(INH) | INH output current | 1 | mA | |||
| TA | Operational free-air temperature | –55 | 125 | °C | ||
6.5 Thermal Information
| THERMAL METRIC(1) | TCAN1043x-Q1 | UNIT | ||
|---|---|---|---|---|
| D (SOIC) | DMT (VSON) | |||
| 14 PINS | 14 PINS | |||
| RθJA | Junction-to-ambient thermal resistance | 78 | 33.1 | °C/W |
| RθJC(top) | Junction-to-case (top) thermal resistance | 33.6 | 30.5 | °C/W |
| RθJB | Junction-to-board thermal resistance | 34.7 | 10.8 | °C/W |
| ΨJT | Junction-to-top characterization parameter | 5.7 | 0.4 | °C/W |
| ΨJB | Junction-to-board characterization parameter | 34.3 | 10.7 | °C/W |
| RθJC(bot) | Junction-to-case (bottom) thermal resistance | n/a | 1.3 | °C/W |
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.
