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  • LDC0851 差分感应开关

    • ZHCSET4B December   2015  – April 2024 LDC0851

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  • LDC0851 差分感应开关
  1.   1
  2. 1 特性
  3. 2 应用
  4. 3 说明
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Interface Voltage Levels
    7. 5.7 Timing Requirements
    8. 5.8 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Basic Operation Mode
      2. 6.3.2 Threshold Adjust Mode
      3. 6.3.3 Setting the Threshold Adjust Values
      4. 6.3.4 Hysteresis
      5. 6.3.5 Conversion Time
      6. 6.3.6 Power-Up Conditions
    4. 6.4 Device Functional Modes
      1. 6.4.1 Shutdown Mode
      2. 6.4.2 Active Mode
  8. 7 Application and Implementation
    1. 7.1 Application Information
      1. 7.1.1 Sensor Design
        1. 7.1.1.1 Sensor Frequency
        2. 7.1.1.2 Sensor Design Procedure
    2. 7.2 Typical Application
      1. 7.2.1 Event Counting
        1. 7.2.1.1 Design Requirements
        2. 7.2.1.2 Detailed Design Procedure
        3. 7.2.1.3 Application Curves
      2. 7.2.2 Coarse Position Sensing
        1. 7.2.2.1 Design Requirements
        2. 7.2.2.2 Detailed Design Procedure
        3. 7.2.2.3 Application Curves
      3. 7.2.3 Low Power Operation
        1. 7.2.3.1 Design Requirements
        2. 7.2.3.2 Detailed Design Procedure
        3. 7.2.3.3 Application Curves
    3. 7.3 Power Supply Recommendations
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
      2. 7.4.2 Layout Example
        1. 7.4.2.1 Side by Side Coils
        2. 7.4.2.2 Stacked Coils
  9. 8 Device and Documentation Support
    1. 8.1 Device Support
      1. 8.1.1 Development Support
    2. 8.2 Documentation Support
      1. 8.2.1 Related Documentation
    3. 8.3 支持资源
    4. 8.4 Trademarks
    5. 8.5 静电放电警告
    6. 8.6 术语表
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information
  12. 重要声明
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Data Sheet

LDC0851 差分感应开关

本资源的原文使用英文撰写。 为方便起见,TI 提供了译文;由于翻译过程中可能使用了自动化工具,TI 不保证译文的准确性。 为确认准确性,请务必访问 ti.com 参考最新的英文版本(控制文档)。

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1 特性

  • 功能安全型
    • 可提供用于功能安全系统设计的文档
  • 阈值容差:<1% 的线圈直径
  • 开关操作在整个温度范围内保持稳定
  • 平均电源电流:在 10sps 下 <20µA
  • 关断电源电流:140nA
  • 推挽式输出
  • 可通过电阻编程设定阈值
  • 对直流磁场不敏感
  • 非接触式开关操作
  • 采样率高达 4ksps
  • 电源电压:1.8V 至 3.3V
  • 工作温度范围:-40°C 至 125°C

2 应用

  • 事件计数
    • 风扇转速 RPM 检测
    • 增量编码器/旋钮
  • 打开/关闭开关
    • 家庭安防和篡改检测
  • 工业用接近开关

3 说明

LDC0851 是一款近距离感应开关,非常适合存在检测和事件计数等非接触式简单开关应用。

当导电物体进入感应线圈的接近范围内时将触发开关。该器件包含滞后功能,可保证可靠的开关阈值。差分实现方案可防止因温度变化或湿度影响等环境因素而导致误触发。LDC0851 无需 MCU 即可工作,因此可实现简单的解决方案。

电感式传感技术即使在有尘土、油污或潮气的环境中也可实现可靠而准确的感应,因此非常适合严苛或脏污的环境。固态开关消除了磁簧、机械或接触开关常会引发的失败。与同类竞争产品不同的是,LDC0851 无需使用磁体,而且不受直流磁场的影响。

封装信息
器件型号封装(1)封装尺寸(2)
LDC0851DSG(WSON,8)2mm x 2mm
(1) 如需了解所有可用封装,请参阅数据表末尾的可订购产品附录。
(2) 封装尺寸(长 × 宽)为标称值,并包括引脚(如适用)。
GUID-21D45E06-6FC5-437C-BDC1-6E482271AD1A-low.gif简化原理图

4 Pin Configuration and Functions

GUID-179B0463-4136-4C2E-A805-95CA4F9458D9-low.gif Figure 4-1 DSG Package8-Pin WSON with DAPTop View
Table 4-1 Pin Functions
PIN TYPE(1) DESCRIPTION
NAME NO.
LCOM 1 A Common coil input
LSENSE 2 A Sense coil input
LREF 3 A Reference coil input
ADJ 4 A Threshold adjust pin
OUT 5 O Switch output
EN 6 I Enable input
GND 7 G Ground
VDD 8 P Power Supply
DAP DAP G Connect to Ground for improved thermal performance(2)
(1) I = Input, O = Output, P = Power, A = Analog, G = Ground
(2) There is an internal electrical connection between the exposed Die Attach Pad (DAP) and the GND pin of the device. Although the DAP can be left floating, for best performance the DAP should be connected to the same potential as the device's GND pin. Do not use the DAP as the primary ground for the device. The device GND pin must always be connected to ground.

5 Specifications

5.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted) (1)
MINMAXUNIT
VDDSupply Voltage Range3.6V
ViVoltage on LSENSE, LREF, and EN-0.33.6V
Voltage on ADJ and LCOM-0.32V
IACurrent LSENSE, LREF, and VOUT5mA
TJJunction Temperature-55150°C
TstgStorage Temperature-65150°C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

5.2 ESD Ratings

VALUEUNIT
V(ESD)Electrostatic dischargeHuman-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)±1000V
Charged-device model (CDM), per JEDEC specification JESD22-C101(2)±250
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

5.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)
MINNOMMAXUNIT
VDDSupply Voltage1.713.46V
TAOperating Temperature-40125°C

5.4 Thermal Information

over operating free-air temperature range (unless otherwise noted)
THERMAL METRIC(1)LDC0851UNIT
DSG (WSON)
8 PINS
RθJAJunction-to-ambient thermal resistance67.4°C/W
RθJC(top)Junction-to-case (top) thermal resistance89.3°C/W
RθJBJunction-to-board thermal resistance37.3°C/W
ψJTJunction-to-top characterization parameter2.4°C/W
ψJBJunction-to-board characterization parameter37.7°C/W
RθJC(bot)Junction-to-case (bottom) thermal resistance9.2°C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report (SPRA953).

5.5 Electrical Characteristics

Over recommended operating conditions unless otherwise noted. VDD= 3.3 V, EN tied to 3.3 V, TA=25 °C, ADJ tied to GND.(1)
PARAMETERTEST CONDITIONSMIN(2)TYP(3)MAX(2)UNIT
POWER
VDDSupply Voltage1.713.46V
ISTATICStatic Supply Current (4)0.70mA
IDYNDynamic Supply Current (not including sensor current)(4)ƒSENSOR = 15 MHz

CPARASITIC = 22 pF

0.66mA
ISDShutdown Mode Supply Current0.141µA
SENSOR
ISENSOR_MAXMaximum sensor current(4)VDD = 1.71 V4.35mA
VDD = 3.3 V6mA
LSENSOR_MINSensor Minimum Inductance(5)CTOTAL = 33 pF

VDD = 1.71 V

2.5
CTOTAL = 33 pF

VDD = 3.3 V

1.8µH
ƒSENSOR_MAXMax Sensor Resonant Frequency(5)Sensor inductance = 2 µH

CTOTAL = 33 pF

19MHz
CTOTALMinimum total capacitance on LCOM(5)

Includes parasitic pin capacitance and PCB parasitic capacitance

33pF
CINPin parasitic capacitance on LCOM12pF
Pin parasitic capacitance on LREF and LSENSE8pF
DETECTION
dHYSTSwitching distance hysteresis(6)2.5 %
dTOLSwitching threshold tolerance(6)0.1 %
THRESHOLD ADJUST
VADJAdjust input range0VDD/2V
VADJ_TOLAdjust threshold tolerance± 6mV
(1) Electrical Characteristics Table values apply only for factory testing conditions at the temperature indicated. Factory testing conditions result in very limited self-heating of the device such that TJ = TA. No guarantee of parametric performance is indicated in the electrical tables under conditions of internal self-heating where TJ > TA. Absolute Maximum Ratings indicate junction temperature limits beyond which the device may be permanently degraded, either mechanically or electrically.
(2) Limits are ensured by testing, design, or statistical analysis at 25°C. Limits over the operating temperature range are ensured through correlations using statistical quality control (SQC) method.
(3) Typical values represent the most likely parametric norm as determined at the time of characterization. Actual typical values may vary over time and will also depend on the application and configuration. The typical values are not tested and are not guaranteed on shipped production material.
(4) Refer to section Active Mode for a description and calculation of the various supply currents.
(5) See Sensor Design for sensor guidance.
(6) Two matched 10 mm diameter sensors were used with a switching distance of 3 mm. See Hysteresis for more information.

 

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