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  • 适用于电池组集成的 bq27545-G1 单节锂离子电池电量计

    • ZHCSAB6E October   2012  – May 2018 BQ27545-G1

      PRODUCTION DATA.  

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  • 适用于电池组集成的 bq27545-G1 单节锂离子电池电量计
  1. 1 特性
  2. 2 应用
  3. 3 说明
    1.     Device Images
      1.      简化原理图
  4. 4 修订历史记录
  5. 5 Device Comparison Table
  6. 6 Pin Configuration and Functions
    1.     Pin Functions
  7. 7 Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  Recommended Operating Conditions
    4. 7.4  Thermal Information
    5. 7.5  Electrical Characteristics: Supply Current
    6. 7.6  Electrical Characteristics: Digital Input and Output DC
    7. 7.7  Electrical Characteristics: Power-On Reset
    8. 7.8  Electrical Characteristics: 2.5-V LDO Regulator
    9. 7.9  Electrical Characteristics: Internal Clock Oscillators
    10. 7.10 Electrical Characteristics: Integrating ADC (Coulomb Counter) Characteristics
    11. 7.11 Electrical Characteristics: ADC (Temperature and Cell Voltage)
    12. 7.12 Electrical Characteristics: Data Flash Memory
    13. 7.13 HDQ Communication Timing Characteristics
    14. 7.14 I2C-Compatible Interface Timing Characteristics
    15. 7.15 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Fuel Gauging
      2. 8.3.2 Impedance Track Variables
        1. 8.3.2.1  Load Mode
        2. 8.3.2.2  Load Select
        3. 8.3.2.3  Reserve Cap-mAh
        4. 8.3.2.4  Reserve Energy
        5. 8.3.2.5  Design Energy Scale
        6. 8.3.2.6  Dsg Current Threshold
        7. 8.3.2.7  Chg Current Threshold
        8. 8.3.2.8  Quit Current, Dsg Relax Time, Chg Relax Time, and Quit Relax Time
        9. 8.3.2.9  Qmax
        10. 8.3.2.10 Update Status
        11. 8.3.2.11 Avg I Last Run
        12. 8.3.2.12 Avg P Last Run
        13. 8.3.2.13 Delta Voltage
        14. 8.3.2.14 Ra Tables and Ra Filtering Related Parameters
        15. 8.3.2.15 MaxScaleBackGrid
        16. 8.3.2.16 Max DeltaV, Min DeltaV
        17. 8.3.2.17 Qmax Max Delta %
        18. 8.3.2.18 Fast Resistance Scaling
        19. 8.3.2.19 StateOfCharge() Smoothing
        20. 8.3.2.20 DeltaV Max Delta
        21. 8.3.2.21 Lifetime Data Logging Parameters
    4. 8.4 Device Functional Modes
      1. 8.4.1  System Control Function
        1. 8.4.1.1 SHUTDOWN Mode
        2. 8.4.1.2 INTERRUPT Mode
        3. 8.4.1.3 Battery Level Indication
        4. 8.4.1.4 Internal Short Detection
        5. 8.4.1.5 Tab Disconnection Detection
      2. 8.4.2  Temperature Measurement and the TS Input
      3. 8.4.3  Over-Temperature Indication
        1. 8.4.3.1 Over-Temperature: Charge
        2. 8.4.3.2 Over-Temperature: Discharge
      4. 8.4.4  Charging and Charge Termination Indication
        1. 8.4.4.1 Detection Charge Termination
        2. 8.4.4.2 Charge Inhibit
      5. 8.4.5  Power Modes
        1. 8.4.5.1 NORMAL Mode
        2. 8.4.5.2 SLEEP Mode
        3. 8.4.5.3 FULLSLEEP Mode
        4. 8.4.5.4 HIBERNATE Mode
      6. 8.4.6  Power Control
        1. 8.4.6.1 Reset Functions
        2. 8.4.6.2 Wake-Up Comparator
        3. 8.4.6.3 Flash Updates
      7. 8.4.7  Autocalibration
      8. 8.4.8  Communications
        1. 8.4.8.1 Authentication
        2. 8.4.8.2 Key Programming (Data Flash Key)
        3. 8.4.8.3 Key Programming (Secure Memory Key)
        4. 8.4.8.4 Executing An Authentication Query
      9. 8.4.9  HDQ Single-Pin Serial Interface
      10. 8.4.10 HDQ Host Interruption Feature
        1. 8.4.10.1 Low Battery Capacity
        2. 8.4.10.2 Temperature
    5. 8.5 Programming
      1. 8.5.1 I2C Interface
        1. 8.5.1.1 I2C Time-Out
        2. 8.5.1.2 I2C Command Waiting Time
        3. 8.5.1.3 I2C Clock Stretching
      2. 8.5.2 Data Commands
        1. 8.5.2.1 Standard Data Commands
          1. 8.5.2.1.1  Control(): 0x00 and 0x01
            1. 8.5.2.1.1.1  CONTROL_STATUS: 0x0000
            2. 8.5.2.1.1.2  DEVICE_TYPE: 0x0001
            3. 8.5.2.1.1.3  FW_VERSION: 0x0002
            4. 8.5.2.1.1.4  HW_VERSION: 0x0003
            5. 8.5.2.1.1.5  RESET_DATA: 0x0005
            6. 8.5.2.1.1.6  PREV_MACWRITE: 0x0007
            7. 8.5.2.1.1.7  CHEM_ID: 0x0008
            8. 8.5.2.1.1.8  BOARD_OFFSET: 0x0009
            9. 8.5.2.1.1.9  CC_OFFSET: 0x000a
            10. 8.5.2.1.1.10 CC_OFFSET_SAVE: 0x000b
            11. 8.5.2.1.1.11 DF_VERSION: 0x000c
            12. 8.5.2.1.1.12 SET_FULLSLEEP: 0x0010
            13. 8.5.2.1.1.13 SET_HIBERNATE: 0x0011
            14. 8.5.2.1.1.14 CLEAR_HIBERNATE: 0x0012
            15. 8.5.2.1.1.15 SET_SHUTDOWN: 0x0013
            16. 8.5.2.1.1.16 CLEAR_SHUTDOWN: 0x0014
            17. 8.5.2.1.1.17 SET_HDQINTEN: 0x0015
            18. 8.5.2.1.1.18 CLEAR_HDQINTEN: 0x0016
            19. 8.5.2.1.1.19 STATIC_CHEM_DF_CHKSUM: 0x0017
            20. 8.5.2.1.1.20 SEALED: 0x0020
            21. 8.5.2.1.1.21 IT ENABLE: 0x0021
            22. 8.5.2.1.1.22 RESET: 0x0041
            23. 8.5.2.1.1.23 EXIT_CAL: 0x0080
            24. 8.5.2.1.1.24 Enter_cal: 0x0081
            25. 8.5.2.1.1.25 OFFSET_CAL: 0x0082
          2. 8.5.2.1.2  AtRate(): 0x02 and 0x03
          3. 8.5.2.1.3  UnfilteredSOC(): 0x04 And 0x05
          4. 8.5.2.1.4  Temperature(): 0x06 And 0x07
          5. 8.5.2.1.5  Voltage(): 0x08 And 0x09
          6. 8.5.2.1.6  Flags(): 0x0a And 0x0b
          7. 8.5.2.1.7  NominalAvailableCapacity(): 0x0c and 0x0d
          8. 8.5.2.1.8  FullAvailableCapacity(): 0x0e and 0x0f
          9. 8.5.2.1.9  RemainingCapacity(): 0x10 and 0x11
          10. 8.5.2.1.10 FullChargeCapacity(): 0x12 and 0x13
          11. 8.5.2.1.11 AverageCurrent(): 0x14 and 0x15
          12. 8.5.2.1.12 TimeToEmpty(): 0x16 And 0x17
          13. 8.5.2.1.13 FilteredFCC(): 0x18 And 0x19
          14. 8.5.2.1.14 StandbyCurrent(): 0x1a And 0x1b
          15. 8.5.2.1.15 UnfilteredFCC(): 0x1c And 0x1d
          16. 8.5.2.1.16 MaxLoadCurrent(): 0x1e And 0x1f
          17. 8.5.2.1.17 UnfilteredRM(): 0x20 And 0x21
          18. 8.5.2.1.18 FilteredRM(): 0x22 And 0x23
          19. 8.5.2.1.19 AveragePower(): 0x24 And 0x25
          20. 8.5.2.1.20 InternalTemperature(): 0x28 And 0x29
          21. 8.5.2.1.21 CycleCount(): 0x2a And 0x2b
          22. 8.5.2.1.22 StateOfCharge(): 0x2c And 0x2d
          23. 8.5.2.1.23 StateOfHealth(): 0x2e And 0x2f
          24. 8.5.2.1.24 PassedCharge(): 0x34 And 0x35
          25. 8.5.2.1.25 Dod0(): 0x36 And 0x37
          26. 8.5.2.1.26 SelfDischargeCurrent(): 0x38 And 0x39
      3. 8.5.3 Extended Data Commands
        1. 8.5.3.1  PackConfig(): 0x3a and 0x3b
        2. 8.5.3.2  DesignCapacity(): 0x3c And 0x3d
        3. 8.5.3.3  DataFlashClass(): 0x3e
        4. 8.5.3.4  DataFlashBlock(): 0x3f
        5. 8.5.3.5  BlockData(): 0x40 Through 0x5f
        6. 8.5.3.6  BlockDataChecksum(): 0x60
        7. 8.5.3.7  BlockDataControl(): 0x61
        8. 8.5.3.8  DeviceNameLength(): 0x62
        9. 8.5.3.9  DeviceName(): 0x63 Through 0x6c
        10. 8.5.3.10 Reserved: 0x6a Through 0x7f
      4. 8.5.4 Data Flash Interface
        1. 8.5.4.1 Accessing the Data Flash
        2. 8.5.4.2 Manufacturer Information Blocks
      5. 8.5.5 Access Modes
      6. 8.5.6 Sealing and Unsealing Data Flash
      7. 8.5.7 Data Flash Summary
    6. 8.6 Register Maps
      1. 8.6.1 Pack Configuration Register
        1. Table 1. Pack Configuration Bit Definition
      2. 8.6.2 Pack Configuration B Register
        1. Table 2. Pack Configuration B Bit Definition
      3. 8.6.3 Pack Configuration C Register
        1. Table 3. Pack Configuration C Bit Definition
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 BAT Voltage Sense Input
        2. 9.2.2.2 SRP and SRN Current Sense Inputs
        3. 9.2.2.3 Sense Resistor Selection
        4. 9.2.2.4 TS Temperature Sense Input
        5. 9.2.2.5 Thermistor Selection
        6. 9.2.2.6 REGIN Power Supply Input Filtering
        7. 9.2.2.7 VCC LDO Output Filtering
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
    1. 10.1 Power Supply Decoupling
  11. 11Layout
    1. 11.1 Layout Guidelines
      1. 11.1.1 Sense Resistor Connections
      2. 11.1.2 Thermistor Connections
      3. 11.1.3 High-Current and Low-Current Path Separation
    2. 11.2 Layout Example
  12. 12器件和文档支持
    1. 12.1 文档支持
      1. 12.1.1 相关文档
    2. 12.2 社区资源
    3. 12.3 商标
    4. 12.4 静电放电警告
    5. 12.5 术语表
  13. 13机械、封装和可订购信息
  14. 重要声明
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DATA SHEET

适用于电池组集成的 bq27545-G1 单节锂离子电池电量计

本资源的原文使用英文撰写。 为方便起见，TI 提供了译文；由于翻译过程中可能使用了自动化工具，TI 不保证译文的准确性。 为确认准确性，请务必访问 ti.com 参考最新的英文版本（控制文档）。

1 特性

  • 电池电量计可适用于容量高达 14,500mAh 的 1 节 (1sXp) 锂离子 应用 支持高达 14500mAh 的容量
  • 微控制器外设提供：
    • 用于电池温度报告的内部或者外部温度传感器
    • 安全哈希算法 (SHA)-1 / 哈希消息认证码 (HMAC) 认证
    • 使用寿命的数据记录
    • 64 字节非易失性暂用闪存
  • 基于已获专利的 Impedance Track™技术的电池电量计量
    • 用于电池续航能力精确预测的电池放电模拟曲线
    • 针对电池老化、电池自放电以及温度和速率低效情况进行自动调节
    • 低值感应电阻器（5mΩ 至 20mΩ）
  • 先进的电量计量 特性
    • 内部短路检测
    • 电池端子断开侦测
  • 高速 1 线 (HDQ) 和 I2C™接口格式，用于与主机系统通信
  • 小型 15 焊球 Nano-Free™芯片尺寸球状引脚栅格阵列 (DSBGA) 封装

2 应用

  • 智能手机
  • 平板电脑
  • 数码相机与视频摄像机
  • 手持式终端
  • MP3 或多媒体播放器

3 说明

bq27545-G1 锂离子电池电量计是一款微控制器外设，此外设能够提供针对单节锂离子电池组的电量计量。此器件只需开发较少的系统微控制器固件即可实现精确的电池电量计量。bq27545-G1 安装于电池组内或者带有一个嵌入式电池（不可拆卸）的系统主板上。

bq27545-G1 使用已经获得专利的 Impedance Track™ 算法来进行电量计量，并提供诸如剩余电量 (mAh)、充电状态 (%)、续航时间（最小值）、电池电压 (mV) 和温度 (°C) 等信息。该器件还提供针对内部短路或电池端子断开事件的检测功能。

bq27545-G1 还 具有 针对安全电池组认证（使用 SHA-1/HMAC 认证算法）的集成支持功能。

该器件还采用 15 焊球 Nano-Free™ DSBGA 封装 (2.61 mm × 1.96 mm)，非常适合空间受限的 至关重要。

器件信息(1)

器件型号 封装 封装尺寸（标称值）
bq27545-G1 YZF (15) 2.61 mm × 1.96 mm
  1. 如需了解所有可用封装，请参阅产品说明书末尾的可订购产品附录。

Device Images

简化原理图

bq27545-G1 Simp_Sch.gif

4 修订历史记录

Changes from D Revision (November 2015) to E Revision

  • Changed 简化原理图Go
  • Changed the description for the SRP pinGo

Changes from C Revision (September 2015) to D Revision

  • Changed “典型应用图表”更改为“简化原理图”Go
  • Changed 封装尺寸Go
  • Changed "Device Options" to "Device Comparison Table" Go
  • Changed the descriptions for the SRP and SRN pinsGo
  • Changed Electrical Characteristics: Power-On ResetGo
  • Changed all instances of "relaxation mode" to "RELAX mode" Go
  • Added "FULLSLEEP mode" to the introduction in Power ModesGo

Changes from B Revision (October 2012) to C Revision

  • Changed 将 32Ahr 更改为 14,500mAhGo
  • Added ESD 额定值 表、特性 说明 部分，器件功能模式，应用和实施 部分，电源建议部分，布局 部分，器件和文档支持 部分以及机械、封装和可订购信息 部分Go

5 Device Comparison Table

PART
NUMBER(1) 		FIRMWARE
VERSION		 PACKAGE(2) TA COMMUNICATION FORMAT
BQ27545-G1 2.24 CSP–15 –40°C to 85°C I2C, HDQ(1)
(1) bq27545-G1 is shipped in I2C mode.
(2) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI website at www.ti.com.

6 Pin Configuration and Functions

Pin Functions

PIN TYPE(1) DESCRIPTION
NAME NO.
SRP A1 IA Analog input pin connected to the internal coulomb counter where SRP is nearest the CELL– connection. Connect to a 5-mΩ to 20-mΩ sense resistor.
SRN B1 IA Analog input pin connected to the internal coulomb counter where SRN is nearest the PACK– connection. Connect to the 5-mΩ to 20-mΩ sense resistor.
VSS C1, C2 P Device ground
SE C3 O Shutdown Enable output. Push-pull output.
VCC D1 P Regulator output and processor power. Decouple with 1-µF ceramic capacitor to VSS.
REGIN E1 P Regulator input. Decouple with 0.1-µF ceramic capacitor to VSS.
HDQ A2 I/O HDQ serial communications line (Slave). Open drain.
TS B2 IA Pack thermistor voltage sense (use 103AT-type thermistor). ADC input.
CE D2 I Chip Enable. Internal LDO is disconnected from REGIN when driven low.
BAT E2 IA Cell-voltage measurement input. ADC input. Recommend 4.8-V maximum for conversion accuracy.
SCL A3 I Slave I2C serial communications clock input line for communication with system (Master). Use with 10-kΩ pullup resistor (typical).
SDA B3 I/O Slave I2C serial communications data line for communication with system (Master). Open-drain I/O. Use with 10-kΩ pullup resistor (typical).
NC/GPIO D3, E3 NC Do not connect for proper operation; reserved for future GPIO.
(1) IA = Analog input, I/O = Digital input/output, P = Power connection, NC = No connect

7 Specifications

7.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1)
MIN MAX UNIT
VI Regulator input, REGIN –0.3 5.5 V
VCC Supply voltage –0.3 2.75 V
VIOD Open-drain I/O pins (SDA, SCL, HDQ) –0.3 5.5 V
VBAT BAT input, (pin E2) –0.3 5.5 V
VI Input voltage range to all others (pins GPIO, SRP, SRN, TS) –0.3 VCC + 0.3 V
TA Operating free-air temperature –40 85 °C
TF Functional temperature –40 100 °C
Tstg Storage temperature –65 150 °C
(1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

7.2 ESD Ratings

VALUE UNIT
V(ESD) Electrostatic discharge Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) BAT pin ±1500 V
all pins ±2000
Charged-device model (CDM), per JEDEC specification JESD22-C101(2) ±500
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

7.3 Recommended Operating Conditions

TA = –40°C to 85°C; typical values at TA = 25°C and VREGIN = VBAT = 3.6 V (unless otherwise noted)
MIN NOM MAX UNIT
VI Supply voltage, REGIN No operating restrictions 2.8 4.5 V
No FLASH writes 2.45 2.8
CREGIN External input capacitor for internal LDO between REGIN and VSS Nominal capacitor values specified. Recommend a 5% ceramic X5R type capacitor located close to the device. 0.1 µF
CLDO25 External output capacitor for internal LDO between VCC an VSS 0.47 1 µF
tPUCD Power-up communication delay 250 ms

7.4 Thermal Information

THERMAL METRIC(1) bq27545-G1 UNIT
YZF (DSBGA)
15 PINS
RθJA Junction-to-ambient thermal resistance 70 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 17 °C/W
RθJB Junction-to-board thermal resistance 20 °C/W
ψJT Junction-to-top characterization parameter 1 °C/W
ψJB Junction-to-board characterization parameter 18 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance N/A °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953.

7.5 Electrical Characteristics: Supply Current

TA = 25°C and VREGIN = VBAT = 3.6 V (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
ICC Normal operating mode current (1) Fuel gauge in NORMAL mode
ILOAD > Sleep Current 		118 μA
I(SLP) Low-power operating mode current(1) Fuel gauge in SLEEP mode
ILOAD < Sleep Current 		62 μA
I(FULLSLP) Low-power operating mode current(1) Fuel gauge in FULLSLEEP mode
ILOAD < Sleep Current 		23 μA
I(HIB) HIBERNATE operating mode current (1) Fuel gauge in HIBERNATE mode
ILOAD < Hibernate Current 		8 μA
(1) Specified by design. Not tested in production.

7.6 Electrical Characteristics: Digital Input and Output DC

TA = -40°C to 85°C; typical values at TA = 25°C and VREGIN = VBAT = 3.6 V (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
VOL Output voltage low (HDQ, SDA, SCL, SE) IOL = 3 mA 0.4 V
VOH(PP) Output high voltage (SE) IOH = –1 mA VCC–0.5 V
VOH(OD) Output high voltage (HDQ, SDA, SCL) External pullup resistor connected to VCC VCC–0.5 V
VIL Input voltage low (HDQ, SDA, SCL) –0.3 0.6 V
VIH Input voltage high (HDQ, SDA, SCL) 1.2 5.5 V
VIL(CE) CE Low-level input voltage VREGIN = 2.8 V to 4.5 V 2.65 0.8 V
VIH(CE) CE High-level input voltage VREGIN–0.5 0.8
Ilkg Input leakage current (I/O pins) 0.3 μA

7.7 Electrical Characteristics: Power-On Reset

TA = –40°C to 85°C, C(REG) = 0.47 μF, 2.45 V < V(REGIN) = VBAT < 5.5 V; typical values at TA = 25°C and V(REGIN) = VBAT = 3.6 V (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
VIT+ Positive-going battery voltage input at VCC 2.05 2.15 2.2 V
VHYS Power-on reset hysteresis 115 mV

7.8 Electrical Characteristics: 2.5-V LDO Regulator

TA = –40°C to 85°C, C(REG) = 0.47 μF, 2.45 V < V(REGIN) = VBAT < 5.5 V; typical values at TA = 25°C and V(REGIN) = VBAT = 3.6 V (unless otherwise noted)
PARAMETER TEST CONDITION MIN TYP MAX UNIT
VCC Regulator output voltage, VCC 2.8 V ≤ V(REGIN) ≤ 4.5 V,
IOUT ≤ 16 mA		 2.3 2.5 2.6 V
2.45 V ≤ V(REGIN) < 2.8 V (low battery), IOUT ≤ 3 mA 2.3 V

7.9 Electrical Characteristics: Internal Clock Oscillators

TA = –40°C to 85°C, 2.4 V < VCC < 2.6 V; typical values at TA = 25°C and VCC = 2.5 V (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
f(OSC) Operating frequency 2.097 MHz
f(LOSC) Operating frequency 32.768 kHz

 
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