ZHCS769B December   2011  – December 2016 TMP708

PRODUCTION DATA.  

  1. 特性
  2. 应用
  3. 说明
  4. 修订历史记录
  5. Pin Configuration and Functions
  6. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Temperature Switch
      2. 7.3.2 Hysteresis Input
      3. 7.3.3 Set-Point Resistor (RSET)
    4. 7.4 Device Functional Modes
  8. Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curves
  9. Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
    3. 10.3 Thermal Considerations
  11. 11器件和文档支持
    1. 11.1 接收文档更新通知
    2. 11.2 社区资源
    3. 11.3 商标
    4. 11.4 静电放电警告
    5. 11.5 Glossary
  12. 12机械、封装和可订购信息

Layout

Layout Guidelines

The TMP708 is extremely simple to lay out. Figure 7 shows the recommended board layout.

Layout Example

TMP708 TMP70x_Layout.gif Figure 7. Recommended Layout

Thermal Considerations

The TMP708 quiescent current is typically 40 μA. The device dissipates negligible power when the output drives a high-impedance load. Thus, the die temperature is the same as the package temperature. In order to maintain accurate temperature monitoring, provide a good thermal contact between the TMP708 package and the device being monitored. The rise in die temperature as a result of self-heating is given by Equation 2:

Equation 2. ΔTJ = PDISS × θJA

where

  • PDISS = power dissipated by the device.
  • θJA = package thermal resistance. Typical thermal resistance for SOT-23 package is 217.9°C/W.

To limit the effects of self-heating, keep the output current at a minimum level.