采用 MaxLife技术以与 bq2416x 充电器控制器搭配使用的 bq27530-G1 电池管理单元 Impedance Track™ 电池电量监测计
1 特性
- 适用于 1 节锂离子电池应用的电池电量监测计和充电器 控制器
- 驻留在系统主板上
- 基于已获专利的 Impedance Track™技术的电池电量监测计
- 可为准确续航时间预测建模电池放电曲线
- 可针对电池老化、电池自放电以及温度/速率低效情况进行自动调节
- 低值感应电阻器（5mΩ 至 20mΩ）
- 具有可定制充电曲线的电池充电器控制器
- 基于温度的可配置充电电压和电流
- 可选运行状况 (SOH) 和多级充电曲线
- 无主机自主电池管理系统
- 减少了软件开销，提升了各平台间的可移植性同时缩短了 OEM 设计周期
- 提高了安全性
- 改善了运行时间
- 借助 Impedance Track 技术延长电池运行时间
- 能够对充电器终端进行更严格的精度控制
- 改进的再充电阈值
- 智能充电 - 定制的自适应充电曲线
- 基于 SOH 的充电器控制
- 温度水平充电 (TLC)
- 针对 bq2416x 单节开关模式电池充电器的电池充电器控制
- 独立充电解决方案
- 400kHz I2C™用于与系统微处理器端口相连接的接口
- 采用 15 引脚 NanoFree™封装
2 应用
- 智能手机、功能型手机和平板电脑
- 数码相机与视频摄像机
- 手持式终端
- MP3 或多媒体播放器
3 说明
德州仪器 (TI) 的 bq27530-G1 系统侧锂离子电池管理单元是一款微控制器外设，可提供针对单节锂离子电池组的 Impedance Track™ 电量监测和充电控制。此器件只需很少的系统微控制器固件开发。与 bq2416x 单节开关模式充电器搭配使用，bq27530-G1 可管理一个嵌入式电池（不可拆卸）或一个可拆卸电池组。
bq27530-G1 使用获得专利的 Impedance Track™ 算法来进行电量监测，可提供剩余电池电量 (mAh)、充电状态 (%)、续航时间（分钟）、电池电压 (mV)、温度 (°C) 和运行状况 (%) 等信息。
器件信息(1)
| 器件型号 | 封装 | 封装尺寸（标称值） |
|---|---|---|
| bq27530-G1 | DSBGA (15) | 2.61mm x 1.96mm |
- 如需了解所有可用封装，请参阅数据表末尾的可订购产品附录。
简化电路原理图
4 修订历史记录
Changes from B Revision (January 2016) to C Revision
Changes from A Revision (May 2015) to B Revision
- Changed ESD Ratings Go
Changes from * Revision (December 2012) to A Revision
5 Pin Configuration and Functions
Pin Functions
| PIN | TYPE(1) | DESCRIPTION | |
|---|---|---|---|
| NAME | NO. | ||
| SRP | A1 | IA | Analog input pin connected to the internal coulomb counter where SRP is nearest the PACK– connection. Connect to 5-mΩ to 20-mΩ sense resistor. |
| SRN | B1 | IA | Analog input pin connected to the internal coulomb counter where SRN is nearest the Vss connection. Connect to 5-mΩ to 20-mΩ sense resistor. |
| VSS | C1, C2 | P | Device ground |
| VCC | D1 | P | Regulator output and bq27530-G1 power. Decouple with 1μF ceramic capacitor to Vss. |
| REGIN | E1 | P | Regulator input. Decouple with 0.1-μF ceramic capacitor to Vss. |
| SOC_INT | A2 | I/O | SOC state interrupts output. Open drain output. |
| BSCL | B2 | O | Battery Charger clock output line for chipset communication. Push-pull output. Note: CE has an internal ESD protection diode connected to REGIN. Recommend maintaining VCE ≤ VREGIN under all conditions. |
| CE | D2 | I | Chip Enable. Internal LDO is disconnected from REGIN when driven low. |
| BAT | E2 | I | Cell-voltage measurement input. ADC input. Recommend 4.8V maximum for conversion accuracy. |
| SCL | A3 | I | Slave I2C serial communications clock input line for communication with system (Master). Open-drain I/O. Use with 10kΩ pull-up resistor (typical). |
| SDA | B3 | I/O | Slave I2C serial communications data line for communication with system (Master). Open-drain I/O. Use with 10kΩ pull-up resistor (typical). |
| BSDA | C3 | I/O | Battery Charger data line for chipset communication. Push-pull output. |
| TS | D3 | IA | Pack thermistor voltage sense (use 103AT-type thermistor). ADC input. |
| BI/TOUT | E3 | I/O | Battery-insertion detection input. Power pin for pack thermistor network. Thermistor-multiplexer control pin. Use with pull-up resistor >1MΩ (1.8 MΩ typical). |
6 Specifications
6.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)(1)| MIN | MAX | UNIT | ||
|---|---|---|---|---|
| VREGIN | Regulator input range | –0.3 to 5.5 | 5.5 | V |
| –0.3 | 6 (2) | V | ||
| VCE | CE input pin | –0.3 | VREGIN + 0.3 | V |
| VCC | Supply voltage range | –0.3 | 2.75 | V |
| VIOD | Open-drain I/O pins (SDA, SCL, SOC_INT) | –0.3 | 5.5 | V |
| VBAT | BAT input pin | –0.3 | 5.5 | V |
| –0.3 | 6 (2) | V | ||
| VI | Input voltage range to all other pins (BI/TOUT, TS, SRP, SRN, BSDA, BSCL) |
–0.3 | VCC + 0.3 | V |
| TA | Operating free-air temperature range | –40 | 85 | °C |
| Tstg | Storage temperature range | –65 | 150 | °C |
6.2 ESD Ratings
| VALUE | UNIT | |||
|---|---|---|---|---|
| V(ESD) | Electrostatic discharge | Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001, BAT pin(1) | ±1500 | V |
| Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001, All other pins(1) | ±2000 | |||
| Charged device model(CDM), per JEDEC specification JESD22-C101(2) | ±250 | |||
6.3 Thermal Information
| THERMAL METRIC(1) | bq27530-G1 | UNIT | |
|---|---|---|---|
| YZF (DSBGA) | |||
| 15 PINS | |||
| RθJA | Junction-to-ambient thermal resistance | 70 | °C/W |
| RθJC(top) | Junction-to-case (top) thermal resistance | 17 | °C/W |
| RθJB | Junction-to-board thermal resistance | 20 | °C/W |
| ψJT | Junction-to-top characterization parameter | 1 | °C/W |
| ψJB | Junction-to-board characterization parameter | 18 | °C/W |
| RθJC(bot) | Junction-to-case (bottom) thermal resistance | n/a | °C/W |
6.4 Recommended Operating Conditions
TA = –40°C to 85°C, VREGIN = VBAT = 3.6 V (unless otherwise noted)| PARAMETER | TEST CONDITIONS | MIN | NOM | MAX | UNIT | |
|---|---|---|---|---|---|---|
| VREGIN | Supply voltage | No operating restrictions | 2.8 | 4.5 | V | |
| No flash writes | 2.45 | 2.8 | ||||
| CREGIN | External input capacitor for internal LDO between REGIN and VSS | Nominal capacitor values specified. Recommend a 5% ceramic X5R type capacitor located close to the device. | 0.1 | μF | ||
| CLDO25 | External output capacitor for internal LDO between VCC and VSS | 0.47 | 1 | μF | ||
| tPUCD | Power-up communication delay | 250 | ms | |||
6.5 Supply Current
TA = 25°C and VREGIN = VBAT = 3.6 V (unless otherwise noted)| PARAMETER | TEST CONDITIONS | MIN | TYP | MAX | UNIT | |
|---|---|---|---|---|---|---|
| ICC (1) | Normal operating-mode current | Fuel gauge in NORMAL mode ILOAD > Sleep current |
118 | μA | ||
| ISLP+ (1) | Sleep+ operating mode current | Fuel gauge in SLEEP+ mode ILOAD < Sleep current |
62 | μA | ||
| ISLP (1) | Low-power storage-mode current | Fuel gauge in SLEEP mode ILOAD < Sleep current |
23 | μA | ||
| IHIB (1) | Hibernate operating-mode current | Fuel gauge in HIBERNATE mode ILOAD < Hibernate current |
8 | μA | ||
6.6 Digital Input and Output DC Characteristics
TA = –40°C to 85°C, typical values at TA = 25°C and VREGIN = 3.6 V (unless otherwise noted)| PARAMETER | TEST CONDITIONS | MIN | TYP | MAX | UNIT | |
|---|---|---|---|---|---|---|
| VOL | Output voltage, low (SCL, SDA, SOC_INT, BSDA, BSCL) | IOL = 3 mA | 0.4 | V | ||
| VOH(PP) | Output voltage, high (BSDA, BSCL) | IOH = –1 mA | VCC – 0.5 | V | ||
| VOH(OD) | Output voltage, high (SDA, SCL, SOC_INT) | External pullup resistor connected to VCC | VCC – 0.5 | |||
| VIL | Input voltage, low (SDA, SCL) | –0.3 | 0.6 | V | ||
| Input voltage, low (BI/TOUT) | BAT INSERT CHECK MODE active | –0.3 | 0.6 | |||
| VIH | Input voltage, high (SDA, SCL) | 1.2 | V | |||
| Input voltage, high (BI/TOUT) | BAT INSERT CHECK MODE active | 1.2 | VCC + 0.3 | |||
| VIL(CE) | Input voltage, low (CE) | VREGIN = 2.8 to 4.5V | 0.8 | V | ||
| VIH(CE) | Input voltage, high (CE) | 2.65 | ||||
| Ilkg (1) | Input leakage current (I/O pins) | 0.3 | μA | |||
6.7 Power-on Reset
TA = –40°C to 85°C, typical values at TA = 25°C and VREGIN = 3.6 V (unless otherwise noted)| PARAMETER | TEST CONDITIONS | MIN | TYP | MAX | UNIT | |
|---|---|---|---|---|---|---|
| VIT+ | Positive-going battery voltage input at VCC | 2.05 | 2.15 | 2.20 | V | |
| VHYS | Power-on reset hysteresis | 115 | mV | |||
6.8 2.5-V LDO Regulator
TA = –40°C to 85°C, CLDO25 = 1 μF, VREGIN = 3.6 V (unless otherwise noted)| PARAMETER | TEST CONDITIONS | MIN | TYP | MAX | UNIT | |
|---|---|---|---|---|---|---|
| VIREG25 | Regulator output voltage VCC | 2.8 V ≤ VREGIN ≤ 4.5 V, IOUT ≤ 16 mA(1) | 2.3 | 2.5 | 2.6 | V |
| 2.45 V ≤ VREGIN < 2.8 V (low battery), IOUT ≤ 3mA | 2.3 | V | ||||
6.9 Internal Clock Oscillators
TA = –40°C to 85°C, 2.4 V < VCC < 2.6 V; typical values at TA = 25°C and VCC = 2.5 V (unless otherwise noted)| PARAMETER | TEST CONDITIONS | MIN | TYP | MAX | UNIT | |
|---|---|---|---|---|---|---|
| fOSC | High frequency oscillator | 8.389 | MHz | |||
| fLOSC | Low frequency oscillator | 32.768 | kHz | |||
6.10 ADC (Temperature and Cell Measurement) Characteristics
TA = –40°C to 85°C, 2.4 V < VCC < 2.6 V; typical values at TA = 25°C and VCC = 2.5 V (unless otherwise noted)| PARAMETER | TEST CONDITIONS | MIN | TYP | MAX | UNIT | |
|---|---|---|---|---|---|---|
| VADC1 | Input voltage range (TS) | VSS – 0.125 | 2 | V | ||
| VADC2 | Input voltage range (BAT) | VSS – 0.125 | 5 | V | ||
| VIN(ADC) | Input voltage range | 0.05 | 1 | V | ||
| GTEMP | Internal temperature sensor voltage gain | –2 | mV/°C | |||
| tADC_CONV | Conversion time | 125 | ms | |||
| Resolution | 14 | 15 | bits | |||
| VOS(ADC) | Input offset | 1 | mV | |||
| ZADC1 (1) | Effective input resistance (TS) | 8 | MΩ | |||
| ZADC2 (1) | Effective input resistance (BAT) | bq27530-G1 not measuring cell voltage | 8 | MΩ | ||
| bq27530-G1 measuring cell voltage | 100 | kΩ | ||||
| Ilkg(ADC) (1) | Input leakage current | 0.3 | μA | |||
6.11 Integrating ADC (Coulomb Counter) Characteristics
TA = –40°C to 85°C, 2.4 V < VCC < 2.6 V; typical values at TA = 25°C and VCC = 2.5 V (unless otherwise noted)| PARAMETER | TEST CONDITIONS | MIN | TYP | MAX | UNIT | |
|---|---|---|---|---|---|---|
| VSR | Input voltage range, V(SRP) and V(SRN) |
VSR = V(SRP) – V(SRN) | –0.125 | 0.125 | V | |
| tSR_CONV | Conversion time | Single conversion | 1 | s | ||
| Resolution | 14 | 15 | bits | |||
| VOS(SR) | Input offset | 10 | μV | |||
| INL | Integral nonlinearity error | ±0.007% | ±0.034% | FSR | ||
| ZIN(SR) (1) | Effective input resistance | 2.5 | MΩ | |||
| Ilkg(SR)(1) | Input leakage current | 0.3 | μA | |||
6.12 Data Flash Memory Characteristics
TA = –40°C to 85°C, 2.4 V < VCC < 2.6 V; typical values at TA = 25°C and VCC = 2.5 V (unless otherwise noted)| PARAMETER | TEST CONDITIONS | MIN | TYP | MAX | UNIT | |
|---|---|---|---|---|---|---|
| tDR (1) | Data retention | 10 | Years | |||
| Flash-programming write cycles(1) | 20,000 | Cycles | ||||
| tWORDPROG (1) | Word programming time | 2 | ms | |||
| ICCPROG (1) | Flash-write supply current | 5 | 10 | mA | ||
| tDFERASE (1) | Data flash master erase time | 200 | ms | |||
| tIFERASE (1) | Instruction flash master erase time | 200 | ms | |||
| tPGERASE (1) | Flash page erase time | 20 | ms | |||
6.13 I2C-Compatible Interface Communication Timing Characteristics
TA = –40°C to 85°C, 2.4 V < VCC < 2.6 V; typical values at TA = 25°C and VCC = 2.5 V (unless otherwise noted)| MIN | NOM | MAX | UNIT | ||
|---|---|---|---|---|---|
| tr | SCL/SDA rise time | 300 | ns | ||
| tf | SCL/SDA fall time | 300 | ns | ||
| tw(H) | SCL pulse duration (high) | 600 | ns | ||
| tw(L) | SCL pulse duration (low) | 1.3 | μs | ||
| tsu(STA) | Setup for repeated start | 600 | ns | ||
| td(STA) | Start to first falling edge of SCL | 600 | ns | ||
| tsu(DAT) | Data setup time | 100 | ns | ||
| th(DAT) | Data hold time | 0 | ns | ||
| tsu(STOP) | Setup time for stop | 600 | ns | ||
| t(BUF) | Bus free time between stop and start | 66 | μs | ||
| fSCL | Clock frequency (1) | 400 | kHz | ||
Figure 1. I2C-compatible Interface Timing Diagrams
6.14 Typical Characteristics
7 Detailed Description
7.1 Overview
Battery fuel gauging with the bq27530-G1 requires only PACK+ (P+), PACK– (P–), and Thermistor (T) connections to a removable battery pack or embedded battery circuit. The CSP option is a 15-ball package in the dimensions of 2.61 mm × 1.96 mm with 0.5 mm lead pitch. It is ideal for space constrained applications.
The bq27530-G1 accurately predicts the battery capacity and other operational characteristics of a single Li-based rechargeable cell. It can be interrogated by a system processor to provide cell information, such as time-to-empty (TTE), and state-of-charge (SOC) as well as SOC interrupt signal to the host.
The bq27530-G1 can control a bq2416x Charger IC without the intervention from an application system processor. Using the bq27530-G1 and bq2416x chipset, batteries can be charged with the typical constant-current, constant voltage (CCCV) profile or charged using a Multi-Level Charging (MLC) algorithm.
The fuel gauge can also be configured to suggest charge voltage and current values to the system so that the host can control a charger that is not part of the bq2416x charger family.
NOTE
FORMATTING CONVENTIONS IN THIS DOCUMENT:
Commands: italics with parentheses and no breaking spaces, e.g., RemainingCapacity()
Data flash: italics, bold, and breaking spaces, e.g., Design Capacity
Register bits and flags: brackets and italics, e.g., [TDA]
Data flash bits: brackets, italics and bold, e.g., [LED1]
Modes and states: ALL CAPITALS, e.g., UNSEALED mode.
7.2 Functional Block Diagram
7.3 Feature Description
Information is accessed through a series of commands, called Standard Commands. Further capabilities are provided by the additional Extended Commands set. Both sets of commands, indicated by the general format Command(), are used to read and write information contained within the control and status registers, as well as its data flash locations. Commands are sent from system to gauge using the I2C serial communications engine, and can be executed during application development, pack manufacture, or end-equipment operation.
Cell information is stored in non-volatile flash memory. Many of these data flash locations are accessible during application development. They cannot, generally, be accessed directly during end-equipment operation. Access to these locations is achieved by either use of the companion evaluation software, through individual commands, or through a sequence of data-flash-access commands. To access a desired data flash location, the correct data flash subclass and offset must be known.
The key to the high-accuracy gas gauging prediction is the TI proprietary Impedance Track™ algorithm. This algorithm uses cell measurements, characteristics, and properties to create SOC predictions that can achieve less than 1% error across a wide variety of operating conditions and over the lifetime of the battery.
The fuel gauge measures the charging and discharging of the battery by monitoring the voltage across a small-value series sense resistor (5 to 20 mΩ, typical) located between the system VSS and the battery PACK– terminal. When a cell is attached to the fuel gauge, cell impedance is computed, based on cell current, cell open-circuit voltage (OCV), and cell voltage under loading conditions.
The external temperature sensing is optimized with the use of a high-accuracy negative temperature coefficient (NTC) thermistor with R25 = 10.0 kΩ ±1%, B25/85 = 3435 K ± 1% (such as Semitec NTC 103AT). The fuel gauge can also be configured to use its internal temperature sensor. When an external thermistor is used, a 18.2-kΩ pullup resistor between the BI/TOUT and TS pins is also required. The fuel gauge uses temperature to monitor the battery-pack environment, which is used for fuel gauging and cell protection functionality.
To minimize power consumption, the fuel gauge has different power modes: NORMAL, SLEEP, SLEEP+, HIBERNATE, and BAT INSERT CHECK. The fuel gauge passes automatically between these modes, depending upon the occurrence of specific events, though a system processor can initiate some of these modes directly.
7.3.1 Functional Description
The fuel gauge measures the cell voltage, temperature, and current to determine battery SOC. The fuel gauge monitors the charging and discharging of the battery by sensing the voltage across a small-value resistor (5 mΩ to 20 mΩ, typical) between the SRP and SRN pins and in series with the cell. By integrating charge passing through the battery, the battery SOC is adjusted during battery charge or discharge.
The total battery capacity is found by comparing states of charge before and after applying the load with the amount of charge passed. When an application load is applied, the impedance of the cell is measured by comparing the OCV obtained from a predefined function for present SOC with the measured voltage under load. Measurements of OCV and charge integration determine chemical SOC and chemical capacity (Qmax). The initial Qmax values are taken from a cell manufacturers' data sheet multiplied by the number of parallel cells. It is also used for the value in Design Capacity. The fuel gauge acquires and updates the battery-impedance profile during normal battery usage. It uses this profile, along with SOC and the Qmax value, to determine FullChargeCapacity() and StateOfCharge(), specifically for the present load and temperature. FullChargeCapacity() is reported as capacity available from a fully-charged battery under the present load and temperature until Voltage() reaches the Terminate Voltage. NominalAvailableCapacity() and FullAvailableCapacity() are the uncompensated (no or light load) versions of RemainingCapacity() and FullChargeCapacity(), respectively.
The fuel gauge has two flags accessed by the Flags() function that warn when the battery SOC has fallen to critical levels. When RemainingCapacity() falls below the first capacity threshold as specified in SOC1 Set Threshold, the [SOC1] (State of Charge Initial) flag is set. The flag is cleared once RemainingCapacity() rises above SOC1 Clear Threshold.
When the voltage is discharged to Terminate Voltage, the SOC will be set to 0.
7.4 Device Functional Modes
7.4.1 Power Modes
The fuel gauge has different power modes:
- BAT INSERT CHECK: The BAT INSERT CHECK mode is a powered-up, but low-power halted, state where the fuel gauge resides when no battery is inserted into the system.
- NORMAL: In NORMAL mode, the fuel gauge is fully powered and can execute any allowable task.
- SLEEP: In SLEEP mode, the fuel gauge turns off the high-frequency oscillator and exists in a reduced- power state, periodically taking measurements and performing calculations.
- SLEEP+: In SLEEP+ mode, both low-frequency and high-frequency oscillators are active. Although the SLEEP+ mode has higher current consumption than the SLEEP mode, it is also a reduced power mode.
- HIBERNATE: In HIBERNATE mode, the fuel gauge is in a low power state, but can be woken up by communication or certain I/O activity.
The relationship between these modes is shown in Figure 6.
7.4.1.1 BAT INSERT CHECK Mode
This mode is a halted-CPU state that occurs when an adapter, or other power source, is present to power the fuel gauge (and system), yet no battery has been detected. When battery insertion is detected, a series of initialization activities begin, which include: OCV measurement, setting the Flags() [BAT_DET] bit, and selecting the appropriate battery profiles.
Some commands, issued by a system processor, can be processed while the fuel gauge is halted in this mode. The gauge wakes up to process the command, then returns to the halted state awaiting battery insertion.
7.4.1.2 NORMAL Mode
The fuel gauge is in NORMAL mode when not in any other power mode. During this mode, AverageCurrent(), Voltage(), and Temperature() measurements are taken, and the interface data set is updated. Decisions to change states are also made. This mode is exited by activating a different power mode.
Because the gauge consumes the most power in NORMAL mode, the Impedance Track algorithm minimizes the time the fuel gauge remains in this mode.
7.4.1.3 SLEEP Mode
SLEEP mode is entered automatically if the feature is enabled (Op Config [SLEEP] = 1) and AverageCurrent() is below the programmable level Sleep Current . Once entry into SLEEP mode has been qualified, but prior to entering it, the fuel gauge performs a coulomb counter autocalibration to minimize offset.
During SLEEP mode, the fuel gauge periodically takes data measurements and updates its data set. However, a majority of its time is spent in an idle condition.
The fuel gauge exits SLEEP mode if any entry condition is broken, specifically when:
- AverageCurrent() rises above Sleep Current , or
- A current in excess of IWAKE through RSENSE is detected.
In the event that a battery is removed from the system while a charger is present (and powering the gauge), Impedance Track updates are not necessary. Hence, the fuel gauge enters a state that checks for battery insertion and does not continue executing the Impedance Track algorithm.
Figure 6. Power Mode Diagram—System Sleep
Figure 7. Power Mode Diagram—System Shutdown
7.4.2 SLEEP+ Mode
Compared to the SLEEP mode, SLEEP+ mode has the high-frequency oscillator in operation. The communication delay could be eliminated. The SLEEP+ mode is entered automatically if the feature is enabled (CONTROL_STATUS [SNOOZE] = 1) and AverageCurrent() is below the programmable level Sleep Current.
During SLEEP+ mode, the fuel gauge periodically takes data measurements and updates its data set. However, a majority of its time is spent in an idle condition.
The fuel gauge exits SLEEP+ mode if any entry condition is broken, specifically when:
- Any communication activity with the gauge, or
- AverageCurrent() rises above Sleep Current, or
- A current in excess of IWAKE through RSENSE is detected.
7.4.3 HIBERNATE Mode
HIBERNATE mode should be used when the system equipment needs to enter a low-power state, and minimal gauge power consumption is required. This mode is ideal when system equipment is set to its own HIBERNATE, SHUTDOWN, or OFF mode.
Before the fuel gauge can enter HIBERNATE mode, the system must set the CONTROL_STATUS [HIBERNATE] bit. The gauge waits to enter HIBERNATE mode until it has taken a valid OCV measurement and the magnitude of the average cell current has fallen below Hibernate Current. The gauge can also enter HIBERNATE mode if the cell voltage falls below Hibernate Voltage and a valid OCV measurement has been taken. The gauge remains in HIBERNATE mode until the system issues a direct I2C command to the gauge or a POR occurs. Any I2C communication that is not directed to the gauge does not wake the gauge.
It is the responsibility of the system to wake the fuel gauge after it has gone into HIBERNATE mode. After waking, the gauge can proceed with the initialization of the battery information (OCV, profile selection, and so forth).
7.5 Programming
7.5.1 Standard Data Commands
The bq27530-G1 uses a series of 2-byte standard commands to enable system reading and writing of battery information. Each standard command has an associated command-code pair, as indicated in Table 1. Because each command consists of two bytes of data, two consecutive I2C transmissions must be executed both to initiate the command function, and to read or write the corresponding two bytes of data.
Table 1. Standard Commands
| NAME | COMMAND CODE | UNITS | SEALED ACCESS | UNSEALED ACCESS | |
|---|---|---|---|---|---|
| Control() | 0x00/0x01 | N/A | R/W | R/W | |
| AtRate() | 0x02/0x03 | mA | R/W | R/W | |
| AtRateTimeToEmpty() | 0x04/0x05 | Minutes | R | R/W | |
| Temperature() | 0x06/0x07 | 0.1 K | R/W | R/W | |
| Voltage() | 0x08/0x09 | mV | R | R/W | |
| Flags() | 0x0a/0x0b | N/A | R | R/W | |
| NominalAvailableCapacity() | 0x0c/0x0d | mAh | R | R/W | |
| FullAvailableCapacity() | 0x0e/0x0f | mAh | R | R/W | |
| RemainingCapacity() | 0x10/0x11 | mAh | R | R/W | |
| FullChargeCapacity() | 0x12/0x13 | mAh | R | R/W | |
| AverageCurrent() | 0x14/0x15 | mA | R | R/W | |
| TimeToEmpty() | 0x16/0x17 | Minutes | R | R/W | |
| RemainingCapacityUnfiltered() | 0x18/0x19 | mAh | R | R/W | |
| StandbyCurrent() | 0x1a/0x1b | mA | R | R/W | |
| RemainingCapacityFiltered() | 0x1c/0x1d | mAh | R | R/W | |
| ProgChargingCurrent() | 0x1e/0x1f | mA | R(1) | R(1) | |
| ProgChargingVoltage() | 0x20/0x21 | mV | R(1) | R(1) | |
| FullChargeCapacityUnfiltered() | 0x22/0x23 | mAh | R | R/W | |
| AveragePower() | 0x24/0x25 | mW | R | R/W | |
| FullChargeCapacityFiltered() | 0x26/0x27 | mAh | R | R/W | |
| StateOfHealth() | 0x28/0x29 | %/num | R | R/W | |
| CycleCount() | 0x2a/0x2b | Counters | R | R/W | |
| StateOfCharge() | 0x2c/0x2d | % | R | R/W | |
| TrueSOC() | 0x2e/0x2f | % | R | R/W | |
| InstantaneousCurrentReading() | 0x30/0x31 | mA | R | R/W | |
| InternalTemperature() | 0x32/0x33 | 0.1 K | R | R/W | |
| ChargingLevel() | 0x34/0x35 | HEX | R | R | |
| LevelTaperCurrent() | 0x6e/0x6f | mA | R | R | |
| CalcChargingCurrent() | 0x70/0x71 | mA | R | R | |
| CalcChargingVoltage() | 0x72/0x73 | V | R | R | |
7.5.2 Control(): 0x00/0x01
Issuing a Control() command requires a subsequent 2-byte subcommand. These additional bytes specify the particular control function desired. The Control() command allows the system to control specific features of the bq27530-G1 during normal operation and additional features when the device is in different access modes, as described in Table 2.
Table 2. Control( ) Subcommands
| CNTL FUNCTION | CNTL DATA |
SEALED ACCESS |
DESCRIPTION |
|---|---|---|---|
| CONTROL_STATUS | 0x0000 | Yes | Reports the status of hibernate, IT, and so on |
| DEVICE_TYPE | 0x0001 | Yes | Reports the device type (for example: bq27530) |
| FW_VERSION | 0x0002 | Yes | Reports the firmware version on the device type |
| HW_VERSION | 0x0003 | Yes | Reports the hardware version of the device type |
| PREV_MACWRITE | 0x0007 | Yes | Returns previous MAC subcommand code |
| CHEM_ID | 0x0008 | Yes | Reports the chemical identifier of the Impedance Track™ configuration |
| BOARD_OFFSET | 0x0009 | No | Forces the device to measure and store the board offset |
| CC_OFFSET | 0x000a | No | Forces the device to measure the internal CC offset |
| CC_OFFSET_SAVE | 0x000b | No | Forces the device to store the internal CC offset |
| OCV_CMD | 0x000c | Yes | Request the gauge to take a OCV measurement |
| BAT_INSERT | 0x000d | Yes | Forces the BAT_DET bit set when the [BIE] bit is 0 |
| BAT_REMOVE | 0x000e | Yes | Forces the BAT_DET bit clear when the [BIE] bit is 0 |
| SET_HIBERNATE | 0x0011 | Yes | Forces CONTROL_STATUS [HIBERNATE] to 1 |
| CLEAR_HIBERNATE | 0x0012 | Yes | Forces CONTROL_STATUS [HIBERNATE] to 0 |
| SET_SLEEP+ | 0x0013 | Yes | Forces CONTROL_STATUS [SNOOZE] to 1 |
| CLEAR_SLEEP+ | 0x0014 | Yes | Forces CONTROL_STATUS [SNOOZE] to 0 |
| DIV_CUR_ENABLE | 0x0017 | Yes | Makes the programmed charge current to be half of what is calculated by the gauge charging algorithm. |
| CHG_ENABLE | 0x001A | Yes | Enable charger. Charge will continue as dictated by gauge charging algorithm. |
| CHG_DISABLE | 0x001B | Yes | Disable charger (Set CE bit of bq2416x) |
| GG_CHGRCTL_ENABLE | 0x001C | Yes | Enables the gas gauge to control the charger while continuosly resetting the charger watchdog |
| GG_CHGRCTL_DISABLE | 0x001D | Yes | The gas gauge stops resetting the charger watchdog |
| DIV_CUR_DISABLE | 0x001E | Yes | Makes the programmed charge current to be same as what is calculated by the gauge charging algorithm. |
| DF_VERSION | 0x001F | Yes | Returns the Data Flash Version |
| SEALED | 0x0020 | No | Places device in SEALED access mode |
| IT_ENABLE | 0x0021 | No | Enables the Impedance Track™ algorithm |
| RESET | 0x0041 | No | Forces a full reset of the bq27530-G1 |
7.5.3 Communications
7.5.3.1 I2C Interface
The bq27530-G1 supports the standard I2C read, incremental read, quick read, one-byte write, and incremental write functions. The 7-bit device address (ADDR) is the most significant 7 bits of the hex address and is fixed as 1010101. The first 8 bits of the I2C protocol are, therefore, 0xAA or 0xAB for write or read, respectively.
The quick read returns data at the address indicated by the address pointer. The address pointer, a register internal to the I2C communication engine, increments whenever data is acknowledged by the bq27530-G1 or the I2C master. “Quick writes” function in the same manner and are a convenient means of sending multiple bytes to consecutive command locations (such as two-byte commands that require two bytes of data).
The following command sequences are not supported:
- Attempt to write a read-only address (NACK after data sent by master):
- Attempt to read an address above 0x6B (NACK command):
7.5.3.2 I2C Time Out
The I2C engine releases both SDA and SCL if the I2C bus is held low for 2 seconds. If the bq27530-G1 is holding the lines, releasing them frees them for the master to drive the lines. If an external condition is holding either of the lines low, the I2C engine enters the low-power sleep mode.
7.5.3.3 I2C Command Waiting Time
To ensure proper operation at 400 kHz, a t(BUF) ≥ 66 μs bus-free waiting time must be inserted between all packets addressed to the bq27530-G1. In addition, if the SCL clock frequency (fSCL) is > 100 kHz, use individual 1-byte write commands for proper data flow control. Figure 8 shows the standard waiting time required between issuing the control subcommand the reading the status result. A DF_CHECKSUM subcommand requires 100 ms minimum prior to reading the result. An OCV_CMD subcommand requires 1.2 seconds prior to reading the result. For read-write standard command, a minimum of 2 seconds is required to get the result updated. For read-only standard commands, there is no waiting time required, but the host must not issue any standard command more than two times per second. Otherwise, the gauge could result in a reset issue due to the expiration of the watchdog timer.
Figure 8. Standard Waiting Time
7.5.3.4 I2C Clock Stretching
A clock stretch can occur during all modes of fuel gauge operation. In SLEEP and HIBERNATE modes, a short clock stretch occurs on all I2C traffic as the device must wake-up to process the packet. In the other modes (BAT INSERT CHECK, NORMAL, SLEEP+) clock stretching only occurs for packets addressed for the fuel gauge. The majority of clock stretch periods are small as the I2C interface performs normal data flow control. However, less frequent yet more significant clock stretch periods may occur as blocks of Data Flash are updated. Table 3 summarizes the approximate clock stretch duration for various fuel gauge operating conditions.
Table 3. Approximate Clock Stretch Duration
| GAUGING MODE | OPERATING CONDITION/COMMENT | APPROXIMATE DURATION |
|---|---|---|
| SLEEP HIBERNATE |
Clock stretch occurs at the beginning of all traffic as the device wakes up. | ≤ 4 ms |
| BAT INSERT CHECK NORMAL SLEEP+ | Clock stretch occurs within the packet for flow control (after a start bit, ACK or first data bit). | ≤ 4 ms |
| Normal Ra table Data Flash updates. | 24 ms | |
| Data Flash block writes. | 72 ms | |
| Restored Data Flash block write after loss of power. | 116 ms | |
| End of discharge Ra table Data Flash update. | 144 ms |
8 Application and Implementation
NOTE
Information in the following applications sections is not part of the TI component specification, and TI does not warrant its accuracy or completeness. TI’s customers are responsible for determining suitability of components for their purposes. Customers should validate and test their design implementation to confirm system functionality.
8.1 Application Information
The fuel gauge can control a bq2416x Charger IC without the intervention from an application system processor. Using the bq27530-G1 and bq2416x chipset, batteries can be charged with the typical constant-current, constant-voltage (CCCV) profile or charged using a Multi-Level Charging (MLC) algorithm.
8.2 Typical Application
Figure 9. Typical Application
8.2.1 Design Requirements
Several key parameters must be updated to align with a given application's battery characteristics. For highest accuracy gauging, it is important to follow-up this initial configuration with a learning cycle to optimize resistance and maximum chemical capacity (Qmax) values prior to sealing and shipping systems to the field. Successful and accurate configuration of the fuel gauge for a target application can be used as the basis for creating a "golden" gas gauge (.fs) file that can be written to all gauges, assuming identical pack design and Li-ion cell origin (chemistry, lot, and so on). Calibration data is included as part of this golden GG file to cut down on system production time. If going this route, it is recommended to average the voltage and current measurement calibration data from a large sample size and use these in the golden file. Table 4, shows the items that should be configured to achieve reliable protection and accurate gauging with minimal initial configuration.
Table 4. Key Data Flash Parameters for Configuration
8.2.2 Detailed Design Procedure
8.2.2.1 BAT Voltage Sense Input
A ceramic capacitor at the input to the BAT pin is used to bypass AC voltage ripple to ground, greatly reducing its influence on battery voltage measurements. It proves most effective in applications with load profiles that exhibit high-frequency current pulses (that is, cell phones) but is recommended for use in all applications to reduce noise on this sensitive high-impedance measurement node.
8.2.2.2 SRP and SRN Current Sense Inputs
The filter network at the input to the coulomb counter is intended to improve differential mode rejection of voltage measured across the sense resistor. These components should be placed as close as possible to the coulomb counter inputs and the routing of the differential traces length-matched to best minimize impedance mismatch-induced measurement errors.
8.2.2.3 Sense Resistor Selection
Any variation encountered in the resistance present between the SRP and SRN pins of the fuel gauge will affect the resulting differential voltage, and derived current, it senses. As such, it is recommended to select a sense resistor with minimal tolerance and temperature coefficient of resistance (TCR) characteristics. The standard recommendation based on best compromise between performance and price is a 1% tolerance, 100 ppm drift sense resistor with a 1-W power rating.
8.2.2.4 TS Temperature Sense Input
Similar to the BAT pin, a ceramic decoupling capacitor for the TS pin is used to bypass AC voltage ripple away from the high-impedance ADC input, minimizing measurement error. Another helpful advantage is that the capacitor provides additional ESD protection since the TS input to system may be accessible in systems that use removable battery packs. It should be placed as close as possible to the respective input pin for optimal filtering performance.
8.2.2.5 Thermistor Selection
The fuel gauge temperature sensing circuitry is designed to work with a negative temperature coefficient-type (NTC) thermistor with a characteristic 10-kΩ resistance at room temperature (25°C). The default curve-fitting coefficients configured in the fuel gauge specifically assume a 103AT-2 type thermistor profile and so that is the default recommendation for thermistor selection purposes. Moving to a separate thermistor resistance profile (for example, JT-2 or others) requires an update to the default thermistor coefficients in data flash to ensure highest accuracy temperature measurement performance.
8.2.2.6 REGIN Power Supply Input Filtering
A ceramic capacitor is placed at the input to the fuel gauge internal LDO to increase power supply rejection (PSR) and improve effective line regulation. It ensures that voltage ripple is rejected to ground instead of coupling into the internal supply rails of the fuel gauge.
8.2.2.7 VCC LDO Output Filtering
A ceramic capacitor is also needed at the output of the internal LDO to provide a current reservoir for fuel gauge load peaks during high peripheral utilization. It acts to stabilize the regulator output and reduce core voltage ripple inside of the fuel gauge.
8.2.3 Application Curves
9 Power Supply Recommendations
9.1 Power Supply Decoupling
Both the REGIN input pin and the VCC output pin require low equivalent series resistance (ESR) ceramic capacitors placed as closely as possible to the respective pins to optimize ripple rejection and provide a stable and dependable power rail that is resilient to line transients. A 0.1-µF capacitor at the REGIN and a 1-µF capacitor at VCC will suffice for satisfactory device performance.
10 Layout
10.1 Layout Guidelines
10.1.1 Sense Resistor Connections
Kelvin connections at the sense resistor are just as critical as those for the battery terminals themselves. The differential traces should be connected at the inside of the sense resistor pads and not anywhere along the high-current trace path to prevent false increases to measured current that could result when measuring between the sum of the sense resistor and trace resistance between the tap points. In addition, the routing of these leads from the sense resistor to the input filter network and finally into the SRP and SRN pins needs to be as closely matched in length as possible else additional measurement offset could occur. It is further recommended to add copper trace or pour-based "guard rings" around the perimeter of the filter network and coulomb counter inputs to shield these sensitive pins from radiated EMI into the sense nodes. This prevents differential voltage shifts that could be interpreted as real current change to the fuel gauge. All of the filter components need to be placed as close as possible to the coulomb counter input pins.
10.1.2 Thermistor Connections
The thermistor sense input should include a ceramic bypass capacitor placed as close to the TS input pin as possible. The capacitor helps to filter measurements of any stray transients as the voltage bias circuit pulses periodically during temperature sensing windows.
10.1.3 High-Current and Low-Current Path Separation
For best possible noise performance, it is extremely important to separate the low-current and high-current loops to different areas of the board layout. The fuel gauge and all support components should be situated on one side of the boards and tap off of the high-current loop (for measurement purposes) at the sense resistor. Routing the low-current ground around instead of under high-current traces will further help to improve noise rejection.
10.2 Layout Example
Figure 14. Layout Example
11 器件和文档支持
11.1 接收文档更新通知
要接收文档更新通知，请导航至 ti.com 上的器件产品文件夹。单击右上角的提醒我注册后，即可收到任何产品的每周摘要
11.2 社区资源
The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use.
-
TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers.
-
Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and contact information for technical support.
11.3 商标
Impedance Track, NanoFree, E2E are trademarks of Texas Instruments.
I2C is a trademark of NXP B.V. Corp Netherlands.
All other trademarks are the property of their respective owners.
11.4 静电放电警告
这些装置包含有限的内置 ESD 保护。 存储或装卸时，应将导线一起截短或将装置放置于导电泡棉中，以防止 MOS 门极遭受静电损伤。
11.5 Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
12 机械、封装和可订购信息
以下页面包括机械、封装和可订购信息。这些信息是指定器件的最新可用数据。这些数据发生变化时，我们可能不会另行通知或修订此文档。如欲获取此产品说明书的浏览器版本，请参见左侧的导航栏。
重要声明
德州仪器(TI) 及其下属子公司有权根据 JESD46 最新标准, 对所提供的产品和服务进行更正、修改、增强、改进或其它更改， 并有权根据 JESD48最新标准中止提供任何产品和服务。客户在下订单前应获取最新的相关信息, 并验证这些信息是否完整且是最新的。所有产品的销售都遵循在订单确认时所提供的TI 销售条款与条件。
TI 保证其所销售的组件的性能符合产品销售时 TI 半导体产品销售条件与条款的适用规范。仅在 TI 保证的范围内，且 TI 认为有必要时才会使用测试或其它质量控制技术。除非适用法律做出了硬性规定，否则没有必要对每种组件的所有参数进行测试。
TI 对应用帮助或客户产品设计不承担任何义务。客户应对其使用 TI 组件的产品和应用自行负责。为尽量减小与客户产品和应用相关的风险，客户应提供充分的设计与操作安全措施。
TI 不对任何 TI 专利权、版权、屏蔽作品权或其它与使用了 TI 组件或服务的组合设备、机器或流程相关的 TI 知识产权中授予 的直接或隐含权限作出任何保证或解释。TI所发布的与第三方产品或服务有关的信息，不能构成从 TI 获得使用这些产品或服 务的许可、授权、或认可。使用此类信息可能需要获得第三方的专利权或其它知识产权方面的许可，或是 TI 的专利权或其它知识产权方面的许可。
对于 TI 的产品手册或数据表中 TI 信息的重要部分，仅在没有对内容进行任何篡改且带有相关授权、条件、限制和声明的情况 下才允许进行复制。TI 对此类篡改过的文件不承担任何责任或义务。复制第三方的信息可能需要服从额外的限制条件。
在转售 TI 组件或服务时，如果对该组件或服务参数的陈述与 TI 标明的参数相比存在差异或虚假成分，则会失去相关 TI 组件或服务的所有明示或暗示授权，且这是不正当的、欺诈性商业行为。TI 对任何此类虚假陈述均不承担任何责任或义务。
客户认可并同意，尽管任何应用相关信息或支持仍可能由 TI 提供，但他们将独力负责满足与其产品及在其应用中使用 TI 产品相关的所有法律、法规和安全相关要求。客户声明并同意，他们具备制定与实施安全措施所需的全部专业技术和知识，可预见故障的危险后果、监测故障及其后果、降低有可能造成人身伤害的故障的发生机率并采取适当的补救措施。客户将全额赔偿因 在此类安全关键应用中使用任何 TI 组件而对 TI及其代理造成的任何损失。
在某些场合中，为了推进安全相关应用有可能对 TI 组件进行特别的促销。TI 的目标是利用此类组件帮助客户设计和创立其特有的可满足适用的功能安全性标准和要求的终端产品解决方案。尽管如此，此类组件仍然服从这些条款。
TI 组件未获得用于 FDA Class III（或类似的生命攸关医疗设备）的授权许可，除非各方授权官员已经达成了专门管控此类使 用的特别协议。
只有那些 TI 特别注明属于军用等级或“增强型塑料”的 TI 组件才是设计或专门用于军事/航空应用或环境的。购买者认可并同 意，对并非指定面向军事或航空航天用途的 TI组件进行军事或航空航天方面的应用，其风险由客户单独承担，并且由客户独 力负责满足与此类使用相关的所有法律和法规要求。
TI 已明确指定符合 ISO/TS16949 要求的产品，这些产品主要用于汽车。在任何情况下，因使用非指定产品而无法达到 ISO/TS16949要求，TI不承担任何责任。
产品
- 数字音频: www.ti.com.cn/audio
- 放大器和线性器件: www.ti.com.cn/amplifiers
- 数据转换器: www.ti.com.cn/dataconverters
- DLP® 产品: www.dlp.com
- DSP - 数字信号处理器: www.ti.com.cn/dsp
- 时钟和计时器: www.ti.com.cn/clockandtimers
- 接口: www.ti.com.cn/interface
- 逻辑: www.ti.com.cn/logic
- 电源管理: www.ti.com.cn/power
- 微控制器 (MCU): www.ti.com.cn/microcontrollers
- RFID 系统: www.ti.com.cn/rfidsys
- OMAP应用处理器: www.ti.com/omap
- 无线连通性: www.ti.com.cn/wirelessconnectivity
应用
- 通信与电信: www.ti.com.cn/telecom
- 计算机及周边: www.ti.com.cn/computer
- 消费电子: www.ti.com/consumer-apps
- 能源: www.ti.com/energy
- 工业应用: www.ti.com.cn/industrial
- 医疗电子: www.ti.com.cn/medical
- 安防应用: www.ti.com.cn/security
- 汽车电子: www.ti.com.cn/automotive
- 视频和影像: www.ti.com.cn/video
德州仪器在线技术支持社区: www.deyisupport.com
邮寄地址： 上海市浦东新区世纪大道1568 号，中建大厦32 楼邮政编码： 200122
Copyright© 2016, 德州仪器半导体技术（上海）有限公司
