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  • 采用 MaxLife技术以与 bq2416x 充电器控制器搭配使用的 bq27530-G1 电池管理单元 Impedance Track™ 电池电量监测计

    • ZHCS240C December   2012  – June 2016 BQ27530-G1

      PRODUCTION DATA.  

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  • 采用 MaxLife技术以与 bq2416x 充电器控制器搭配使用的 bq27530-G1 电池管理单元 Impedance Track™ 电池电量监测计
  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 修订历史记录
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Thermal Information
    4. 6.4  Recommended Operating Conditions
    5. 6.5  Supply Current
    6. 6.6  Digital Input and Output DC Characteristics
    7. 6.7  Power-on Reset
    8. 6.8  2.5-V LDO Regulator
    9. 6.9  Internal Clock Oscillators
    10. 6.10 ADC (Temperature and Cell Measurement) Characteristics
    11. 6.11 Integrating ADC (Coulomb Counter) Characteristics
    12. 6.12 Data Flash Memory Characteristics
    13. 6.13 I2C-Compatible Interface Communication Timing Characteristics
    14. 6.14 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Functional Description
    4. 7.4 Device Functional Modes
      1. 7.4.1 Power Modes
        1. 7.4.1.1 BAT INSERT CHECK Mode
        2. 7.4.1.2 NORMAL Mode
        3. 7.4.1.3 SLEEP Mode
      2. 7.4.2 SLEEP+ Mode
      3. 7.4.3 HIBERNATE Mode
    5. 7.5 Programming
      1. 7.5.1 Standard Data Commands
      2. 7.5.2 Control(): 0x00/0x01
      3. 7.5.3 Communications
        1. 7.5.3.1 I2C Interface
        2. 7.5.3.2 I2C Time Out
        3. 7.5.3.3 I2C Command Waiting Time
        4. 7.5.3.4 I2C Clock Stretching
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 BAT Voltage Sense Input
        2. 8.2.2.2 SRP and SRN Current Sense Inputs
        3. 8.2.2.3 Sense Resistor Selection
        4. 8.2.2.4 TS Temperature Sense Input
        5. 8.2.2.5 Thermistor Selection
        6. 8.2.2.6 REGIN Power Supply Input Filtering
        7. 8.2.2.7 VCC LDO Output Filtering
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
    1. 9.1 Power Supply Decoupling
  10. 10Layout
    1. 10.1 Layout Guidelines
      1. 10.1.1 Sense Resistor Connections
      2. 10.1.2 Thermistor Connections
      3. 10.1.3 High-Current and Low-Current Path Separation
    2. 10.2 Layout Example
  11. 11器件和文档支持
    1. 11.1 接收文档更新通知
    2. 11.2 社区资源
    3. 11.3 商标
    4. 11.4 静电放电警告
    5. 11.5 Glossary
  12. 12机械、封装和可订购信息
  13. 重要声明
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采用 MaxLife技术以与 bq2416x 充电器控制器搭配使用的 bq27530-G1 电池管理单元 Impedance Track™ 电池电量监测计

本资源的原文使用英文撰写。 为方便起见，TI 提供了译文；由于翻译过程中可能使用了自动化工具，TI 不保证译文的准确性。 为确认准确性，请务必访问 ti.com 参考最新的英文版本（控制文档）。

1 特性

  • 适用于 1 节锂离子电池应用的电池电量监测计和充电器 控制器
  • 驻留在系统主板上
  • 基于已获专利的 Impedance Track™技术的电池电量监测计
    • 可为准确续航时间预测建模电池放电曲线
    • 可针对电池老化、电池自放电以及温度/速率低效情况进行自动调节
    • 低值感应电阻器（5mΩ 至 20mΩ）
  • 具有可定制充电曲线的电池充电器控制器
    • 基于温度的可配置充电电压和电流
    • 可选运行状况 (SOH) 和多级充电曲线
  • 无主机自主电池管理系统
    • 减少了软件开销，提升了各平台间的可移植性同时缩短了 OEM 设计周期
    • 提高了安全性
  • 改善了运行时间
    • 借助 Impedance Track 技术延长电池运行时间
    • 能够对充电器终端进行更严格的精度控制
    • 改进的再充电阈值
  • 智能充电 - 定制的自适应充电曲线
    • 基于 SOH 的充电器控制
    • 温度水平充电 (TLC)
  • 针对 bq2416x 单节开关模式电池充电器的电池充电器控制
    • 独立充电解决方案
  • 400kHz I2C™用于与系统微处理器端口相连接的接口
  • 采用 15 引脚 NanoFree™封装

2 应用

  • 智能手机、功能型手机和平板电脑
  • 数码相机与视频摄像机
  • 手持式终端
  • MP3 或多媒体播放器

3 说明

德州仪器 (TI) 的 bq27530-G1 系统侧锂离子电池管理单元是一款微控制器外设，可提供针对单节锂离子电池组的 Impedance Track™ 电量监测和充电控制。此器件只需很少的系统微控制器固件开发。与 bq2416x 单节开关模式充电器搭配使用，bq27530-G1 可管理一个嵌入式电池（不可拆卸）或一个可拆卸电池组。

bq27530-G1 使用获得专利的 Impedance Track™ 算法来进行电量监测，可提供剩余电池电量 (mAh)、充电状态 (%)、续航时间（分钟）、电池电压 (mV)、温度 (°C) 和运行状况 (%) 等信息。

器件信息(1)

器件型号 封装 封装尺寸（标称值）
bq27530-G1 DSBGA (15) 2.61mm x 1.96mm
  1. 如需了解所有可用封装，请参阅数据表末尾的可订购产品附录。

简化电路原理图

bq27530-G1 lusal5_TypApp.gif

4 修订历史记录

Changes from B Revision (January 2016) to C Revision

  • Changed Table 4, Key Data Flash Parameters for ConfigurationGo

Changes from A Revision (May 2015) to B Revision

  • Changed ESD Ratings Go

Changes from * Revision (December 2012) to A Revision

  • 将数据表标题从“与 bq2416x 充电器控制器搭配使用的电池管理单元 Impedance Track™ 电池电量监测计”更改为“采用 MaxLife 技术以与 bq2416x 充电器控制器搭配使用的电池管理单元 Impedance Track™ 电池电量监测计”Go
  • 添加了 ESD 额定值 表、详细 说明部分、特性 说明 部分、器件功能模式 部分、编程 部分以及应用和实施 部分。添加了电源相关建议 部分、布局 部分、器件和文档支持 部分以及机械、封装 和可订购信息 部分Go

5 Pin Configuration and Functions

YZF Package
15-Pin DSBGA
bq27530-G1 bq8035_ds_pinout.gif

Pin Functions

PIN TYPE(1) DESCRIPTION
NAME NO.
SRP A1 IA Analog input pin connected to the internal coulomb counter where SRP is nearest the PACK– connection. Connect to 5-mΩ to 20-mΩ sense resistor.
SRN B1 IA Analog input pin connected to the internal coulomb counter where SRN is nearest the Vss connection. Connect to 5-mΩ to 20-mΩ sense resistor.
VSS C1, C2 P Device ground
VCC D1 P Regulator output and bq27530-G1 power. Decouple with 1μF ceramic capacitor to Vss.
REGIN E1 P Regulator input. Decouple with 0.1-μF ceramic capacitor to Vss.
SOC_INT A2 I/O SOC state interrupts output. Open drain output.
BSCL B2 O Battery Charger clock output line for chipset communication. Push-pull output. Note: CE has an internal ESD protection diode connected to REGIN. Recommend maintaining VCE ≤ VREGIN under all conditions.
CE D2 I Chip Enable. Internal LDO is disconnected from REGIN when driven low.
BAT E2 I Cell-voltage measurement input. ADC input. Recommend 4.8V maximum for conversion accuracy.
SCL A3 I Slave I2C serial communications clock input line for communication with system (Master). Open-drain I/O. Use with 10kΩ pull-up resistor (typical).
SDA B3 I/O Slave I2C serial communications data line for communication with system (Master). Open-drain I/O. Use with 10kΩ pull-up resistor (typical).
BSDA C3 I/O Battery Charger data line for chipset communication. Push-pull output.
TS D3 IA Pack thermistor voltage sense (use 103AT-type thermistor). ADC input.
BI/TOUT E3 I/O Battery-insertion detection input. Power pin for pack thermistor network. Thermistor-multiplexer control pin. Use with pull-up resistor >1MΩ (1.8 MΩ typical).
(1) I/O = Digital input/output, IA = Analog input, P = Power connection

6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1)
MIN MAX UNIT
VREGIN Regulator input range –0.3 to 5.5 5.5 V
–0.3 6 (2) V
VCE CE input pin –0.3 VREGIN + 0.3 V
VCC Supply voltage range –0.3 2.75 V
VIOD Open-drain I/O pins (SDA, SCL, SOC_INT) –0.3 5.5 V
VBAT BAT input pin –0.3 5.5 V
–0.3 6 (2) V
VI Input voltage range to all other pins
(BI/TOUT, TS, SRP, SRN, BSDA, BSCL)		 –0.3 VCC + 0.3 V
TA Operating free-air temperature range –40 85 °C
Tstg Storage temperature range –65 150 °C
(1) Stresses beyond those listed as absolute maximum ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated as recommended operating conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) Condition not to exceed 100 hours at 25°C lifetime.

6.2 ESD Ratings

VALUE UNIT
V(ESD) Electrostatic discharge Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001, BAT pin(1) ±1500 V
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001, All other pins(1) ±2000
Charged device model(CDM), per JEDEC specification JESD22-C101(2) ±250
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.3 Thermal Information

THERMAL METRIC(1) bq27530-G1 UNIT
YZF (DSBGA)
15 PINS
RθJA Junction-to-ambient thermal resistance 70 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 17 °C/W
RθJB Junction-to-board thermal resistance 20 °C/W
ψJT Junction-to-top characterization parameter 1 °C/W
ψJB Junction-to-board characterization parameter 18 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance n/a °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953.

6.4 Recommended Operating Conditions

TA = –40°C to 85°C, VREGIN = VBAT = 3.6 V (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN NOM MAX UNIT
VREGIN Supply voltage No operating restrictions 2.8 4.5 V
No flash writes 2.45 2.8
CREGIN External input capacitor for internal LDO between REGIN and VSS Nominal capacitor values specified. Recommend a 5% ceramic X5R type capacitor located close to the device. 0.1 μF
CLDO25 External output capacitor for internal LDO between VCC and VSS 0.47 1 μF
tPUCD Power-up communication delay 250 ms

6.5 Supply Current

TA = 25°C and VREGIN = VBAT = 3.6 V (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
ICC (1) Normal operating-mode current Fuel gauge in NORMAL mode
ILOAD > Sleep current 		118 μA
ISLP+ (1) Sleep+ operating mode current Fuel gauge in SLEEP+ mode
ILOAD < Sleep current 		62 μA
ISLP (1) Low-power storage-mode current Fuel gauge in SLEEP mode
ILOAD < Sleep current 		23 μA
IHIB (1) Hibernate operating-mode current Fuel gauge in HIBERNATE mode
ILOAD < Hibernate current 		8 μA
(1) Specified by design. Not production tested.

6.6 Digital Input and Output DC Characteristics

TA = –40°C to 85°C, typical values at TA = 25°C and VREGIN = 3.6 V (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
VOL Output voltage, low (SCL, SDA, SOC_INT, BSDA, BSCL) IOL = 3 mA 0.4 V
VOH(PP) Output voltage, high (BSDA, BSCL) IOH = –1 mA VCC – 0.5 V
VOH(OD) Output voltage, high (SDA, SCL, SOC_INT) External pullup resistor connected to VCC VCC – 0.5
VIL Input voltage, low (SDA, SCL) –0.3 0.6 V
Input voltage, low (BI/TOUT) BAT INSERT CHECK MODE active –0.3 0.6
VIH Input voltage, high (SDA, SCL) 1.2 V
Input voltage, high (BI/TOUT) BAT INSERT CHECK MODE active 1.2 VCC + 0.3
VIL(CE) Input voltage, low (CE) VREGIN = 2.8 to 4.5V 0.8 V
VIH(CE) Input voltage, high (CE) 2.65
Ilkg (1) Input leakage current (I/O pins) 0.3 μA
(1) Specified by design. Not production tested.

6.7 Power-on Reset

TA = –40°C to 85°C, typical values at TA = 25°C and VREGIN = 3.6 V (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
VIT+ Positive-going battery voltage input at VCC 2.05 2.15 2.20 V
VHYS Power-on reset hysteresis 115 mV

6.8 2.5-V LDO Regulator

TA = –40°C to 85°C, CLDO25 = 1 μF, VREGIN = 3.6 V (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
VIREG25 Regulator output voltage VCC 2.8 V ≤ VREGIN ≤ 4.5 V, IOUT ≤ 16 mA(1) 2.3 2.5 2.6 V
2.45 V ≤ VREGIN < 2.8 V (low battery), IOUT ≤ 3mA 2.3 V
(1) LDO output current, IOUT, is the total load current. LDO regulator should be used to power internal fuel gauge only.

6.9 Internal Clock Oscillators

TA = –40°C to 85°C, 2.4 V < VCC < 2.6 V; typical values at TA = 25°C and VCC = 2.5 V (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
fOSC High frequency oscillator 8.389 MHz
fLOSC Low frequency oscillator 32.768 kHz

6.10 ADC (Temperature and Cell Measurement) Characteristics

TA = –40°C to 85°C, 2.4 V < VCC < 2.6 V; typical values at TA = 25°C and VCC = 2.5 V (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
VADC1 Input voltage range (TS) VSS – 0.125 2 V
VADC2 Input voltage range (BAT) VSS – 0.125 5 V
VIN(ADC) Input voltage range 0.05 1 V
GTEMP Internal temperature sensor voltage gain –2 mV/°C
tADC_CONV Conversion time 125 ms
Resolution 14 15 bits
VOS(ADC) Input offset 1 mV
ZADC1 (1) Effective input resistance (TS) 8 MΩ
ZADC2 (1) Effective input resistance (BAT) bq27530-G1 not measuring cell voltage 8 MΩ
bq27530-G1 measuring cell voltage 100 kΩ
Ilkg(ADC) (1) Input leakage current 0.3 μA
(1) Specified by design. Not tested in production.

6.11 Integrating ADC (Coulomb Counter) Characteristics

TA = –40°C to 85°C, 2.4 V < VCC < 2.6 V; typical values at TA = 25°C and VCC = 2.5 V (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
VSR Input voltage range,
V(SRP) and V(SRN) 		VSR = V(SRP) – V(SRN) –0.125 0.125 V
tSR_CONV Conversion time Single conversion 1 s
Resolution 14 15 bits
VOS(SR) Input offset 10 μV
INL Integral nonlinearity error ±0.007% ±0.034% FSR
ZIN(SR) (1) Effective input resistance 2.5 MΩ
Ilkg(SR)(1) Input leakage current 0.3 μA
(1) Specified by design. Not tested in production.

6.12 Data Flash Memory Characteristics

TA = –40°C to 85°C, 2.4 V < VCC < 2.6 V; typical values at TA = 25°C and VCC = 2.5 V (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
tDR (1) Data retention 10 Years
Flash-programming write cycles(1) 20,000 Cycles
tWORDPROG (1) Word programming time 2 ms
ICCPROG (1) Flash-write supply current 5 10 mA
tDFERASE (1) Data flash master erase time 200 ms
tIFERASE (1) Instruction flash master erase time 200 ms
tPGERASE (1) Flash page erase time 20 ms
(1) Specified by design. Not production tested

6.13 I2C-Compatible Interface Communication Timing Characteristics

TA = –40°C to 85°C, 2.4 V < VCC < 2.6 V; typical values at TA = 25°C and VCC = 2.5 V (unless otherwise noted)
MIN NOM MAX UNIT
tr SCL/SDA rise time 300 ns
tf SCL/SDA fall time 300 ns
tw(H) SCL pulse duration (high) 600 ns
tw(L) SCL pulse duration (low) 1.3 μs
tsu(STA) Setup for repeated start 600 ns
td(STA) Start to first falling edge of SCL 600 ns
tsu(DAT) Data setup time 100 ns
th(DAT) Data hold time 0 ns
tsu(STOP) Setup time for stop 600 ns
t(BUF) Bus free time between stop and start 66 μs
fSCL Clock frequency (1) 400 kHz
(1) If the clock frequency (fSCL) is > 100 kHz, use 1-byte write commands for proper operation. All other transactions types are supported at 400 kHz. (Refer to I2C Interface and I2C Command Waiting Time.)
bq27530-G1 i2c_timing_diagram.gif Figure 1. I2C-compatible Interface Timing Diagrams

6.14 Typical Characteristics

bq27530-G1 D001_SLUSBU6.gif
Figure 2. Regulator Output Voltage vs. Temperature
bq27530-G1 D003_SLUSBU6.gif
Figure 4. Low-Frequency Oscillator Frequency vs. Temperature
bq27530-G1 D002_SLUSBU6.gif
Figure 3. High-Frequency Oscillator Frequency vs. Temperature
bq27530-G1 D004_SLUSBU6.gif
Figure 5. Reported Internal Temperature Measurement vs. Temperature

7 Detailed Description

7.1 Overview

Battery fuel gauging with the bq27530-G1 requires only PACK+ (P+), PACK– (P–), and Thermistor (T) connections to a removable battery pack or embedded battery circuit. The CSP option is a 15-ball package in the dimensions of 2.61 mm × 1.96 mm with 0.5 mm lead pitch. It is ideal for space constrained applications.

The bq27530-G1 accurately predicts the battery capacity and other operational characteristics of a single Li-based rechargeable cell. It can be interrogated by a system processor to provide cell information, such as time-to-empty (TTE), and state-of-charge (SOC) as well as SOC interrupt signal to the host.

The bq27530-G1 can control a bq2416x Charger IC without the intervention from an application system processor. Using the bq27530-G1 and bq2416x chipset, batteries can be charged with the typical constant-current, constant voltage (CCCV) profile or charged using a Multi-Level Charging (MLC) algorithm.

The fuel gauge can also be configured to suggest charge voltage and current values to the system so that the host can control a charger that is not part of the bq2416x charger family.

NOTE

FORMATTING CONVENTIONS IN THIS DOCUMENT:

Commands: italics with parentheses and no breaking spaces, e.g., RemainingCapacity()

Data flash: italics, bold, and breaking spaces, e.g., Design Capacity

Register bits and flags: brackets and italics, e.g., [TDA]

Data flash bits: brackets, italics and bold, e.g., [LED1]

Modes and states: ALL CAPITALS, e.g., UNSEALED mode.

7.2 Functional Block Diagram

bq27530-G1 lusbu6_FctnBlkDgm.gif

7.3 Feature Description

Information is accessed through a series of commands, called Standard Commands. Further capabilities are provided by the additional Extended Commands set. Both sets of commands, indicated by the general format Command(), are used to read and write information contained within the control and status registers, as well as its data flash locations. Commands are sent from system to gauge using the I2C serial communications engine, and can be executed during application development, pack manufacture, or end-equipment operation.

Cell information is stored in non-volatile flash memory. Many of these data flash locations are accessible during application development. They cannot, generally, be accessed directly during end-equipment operation. Access to these locations is achieved by either use of the companion evaluation software, through individual commands, or through a sequence of data-flash-access commands. To access a desired data flash location, the correct data flash subclass and offset must be known.

The key to the high-accuracy gas gauging prediction is the TI proprietary Impedance Track™ algorithm. This algorithm uses cell measurements, characteristics, and properties to create SOC predictions that can achieve less than 1% error across a wide variety of operating conditions and over the lifetime of the battery.

The fuel gauge measures the charging and discharging of the battery by monitoring the voltage across a small-value series sense resistor (5 to 20 mΩ, typical) located between the system VSS and the battery PACK– terminal. When a cell is attached to the fuel gauge, cell impedance is computed, based on cell current, cell open-circuit voltage (OCV), and cell voltage under loading conditions.

The external temperature sensing is optimized with the use of a high-accuracy negative temperature coefficient (NTC) thermistor with R25 = 10.0 kΩ ±1%, B25/85 = 3435 K ± 1% (such as Semitec NTC 103AT). The fuel gauge can also be configured to use its internal temperature sensor. When an external thermistor is used, a 18.2-kΩ pullup resistor between the BI/TOUT and TS pins is also required. The fuel gauge uses temperature to monitor the battery-pack environment, which is used for fuel gauging and cell protection functionality.

To minimize power consumption, the fuel gauge has different power modes: NORMAL, SLEEP, SLEEP+, HIBERNATE, and BAT INSERT CHECK. The fuel gauge passes automatically between these modes, depending upon the occurrence of specific events, though a system processor can initiate some of these modes directly.

7.3.1 Functional Description

The fuel gauge measures the cell voltage, temperature, and current to determine battery SOC. The fuel gauge monitors the charging and discharging of the battery by sensing the voltage across a small-value resistor (5 mΩ to 20 mΩ, typical) between the SRP and SRN pins and in series with the cell. By integrating charge passing through the battery, the battery SOC is adjusted during battery charge or discharge.

The total battery capacity is found by comparing states of charge before and after applying the load with the amount of charge passed. When an application load is applied, the impedance of the cell is measured by comparing the OCV obtained from a predefined function for present SOC with the measured voltage under load. Measurements of OCV and charge integration determine chemical SOC and chemical capacity (Qmax). The initial Qmax values are taken from a cell manufacturers' data sheet multiplied by the number of parallel cells. It is also used for the value in Design Capacity. The fuel gauge acquires and updates the battery-impedance profile during normal battery usage. It uses this profile, along with SOC and the Qmax value, to determine FullChargeCapacity() and StateOfCharge(), specifically for the present load and temperature. FullChargeCapacity() is reported as capacity available from a fully-charged battery under the present load and temperature until Voltage() reaches the Terminate Voltage. NominalAvailableCapacity() and FullAvailableCapacity() are the uncompensated (no or light load) versions of RemainingCapacity() and FullChargeCapacity(), respectively.

The fuel gauge has two flags accessed by the Flags() function that warn when the battery SOC has fallen to critical levels. When RemainingCapacity() falls below the first capacity threshold as specified in SOC1 Set Threshold, the [SOC1] (State of Charge Initial) flag is set. The flag is cleared once RemainingCapacity() rises above SOC1 Clear Threshold.

When the voltage is discharged to Terminate Voltage, the SOC will be set to 0.

7.4 Device Functional Modes

7.4.1 Power Modes

The fuel gauge has different power modes:

  • BAT INSERT CHECK: The BAT INSERT CHECK mode is a powered-up, but low-power halted, state where the fuel gauge resides when no battery is inserted into the system.
  • NORMAL: In NORMAL mode, the fuel gauge is fully powered and can execute any allowable task.
  • SLEEP: In SLEEP mode, the fuel gauge turns off the high-frequency oscillator and exists in a reduced- power state, periodically taking measurements and performing calculations.
  • SLEEP+: In SLEEP+ mode, both low-frequency and high-frequency oscillators are active. Although the SLEEP+ mode has higher current consumption than the SLEEP mode, it is also a reduced power mode.
  • HIBERNATE: In HIBERNATE mode, the fuel gauge is in a low power state, but can be woken up by communication or certain I/O activity.

The relationship between these modes is shown in Figure 6.

7.4.1.1 BAT INSERT CHECK Mode

This mode is a halted-CPU state that occurs when an adapter, or other power source, is present to power the fuel gauge (and system), yet no battery has been detected. When battery insertion is detected, a series of initialization activities begin, which include: OCV measurement, setting the Flags() [BAT_DET] bit, and selecting the appropriate battery profiles.

Some commands, issued by a system processor, can be processed while the fuel gauge is halted in this mode. The gauge wakes up to process the command, then returns to the halted state awaiting battery insertion.

7.4.1.2 NORMAL Mode

The fuel gauge is in NORMAL mode when not in any other power mode. During this mode, AverageCurrent(), Voltage(), and Temperature() measurements are taken, and the interface data set is updated. Decisions to change states are also made. This mode is exited by activating a different power mode.

Because the gauge consumes the most power in NORMAL mode, the Impedance Track algorithm minimizes the time the fuel gauge remains in this mode.

7.4.1.3 SLEEP Mode

SLEEP mode is entered automatically if the feature is enabled (Op Config [SLEEP] = 1) and AverageCurrent() is below the programmable level Sleep Current . Once entry into SLEEP mode has been qualified, but prior to entering it, the fuel gauge performs a coulomb counter autocalibration to minimize offset.

During SLEEP mode, the fuel gauge periodically takes data measurements and updates its data set. However, a majority of its time is spent in an idle condition.

The fuel gauge exits SLEEP mode if any entry condition is broken, specifically when:

  • AverageCurrent() rises above Sleep Current , or
  • A current in excess of IWAKE through RSENSE is detected.

In the event that a battery is removed from the system while a charger is present (and powering the gauge), Impedance Track updates are not necessary. Hence, the fuel gauge enters a state that checks for battery insertion and does not continue executing the Impedance Track algorithm.

bq27530-G1 system_sleep_luua96.gif Figure 6. Power Mode Diagram—System Sleep
bq27530-G1 system_shutdown_luua96.gif Figure 7. Power Mode Diagram—System Shutdown

7.4.2 SLEEP+ Mode

Compared to the SLEEP mode, SLEEP+ mode has the high-frequency oscillator in operation. The communication delay could be eliminated. The SLEEP+ mode is entered automatically if the feature is enabled (CONTROL_STATUS [SNOOZE] = 1) and AverageCurrent() is below the programmable level Sleep Current.

During SLEEP+ mode, the fuel gauge periodically takes data measurements and updates its data set. However, a majority of its time is spent in an idle condition.

The fuel gauge exits SLEEP+ mode if any entry condition is broken, specifically when:

  • Any communication activity with the gauge, or
  • AverageCurrent() rises above Sleep Current, or
  • A current in excess of IWAKE through RSENSE is detected.

7.4.3 HIBERNATE Mode

HIBERNATE mode should be used when the system equipment needs to enter a low-power state, and minimal gauge power consumption is required. This mode is ideal when system equipment is set to its own HIBERNATE, SHUTDOWN, or OFF mode.

Before the fuel gauge can enter HIBERNATE mode, the system must set the CONTROL_STATUS [HIBERNATE] bit. The gauge waits to enter HIBERNATE mode until it has taken a valid OCV measurement and the magnitude of the average cell current has fallen below Hibernate Current. The gauge can also enter HIBERNATE mode if the cell voltage falls below Hibernate Voltage and a valid OCV measurement has been taken. The gauge remains in HIBERNATE mode until the system issues a direct I2C command to the gauge or a POR occurs. Any I2C communication that is not directed to the gauge does not wake the gauge.

It is the responsibility of the system to wake the fuel gauge after it has gone into HIBERNATE mode. After waking, the gauge can proceed with the initialization of the battery information (OCV, profile selection, and so forth).

7.5 Programming

7.5.1 Standard Data Commands

The bq27530-G1 uses a series of 2-byte standard commands to enable system reading and writing of battery information. Each standard command has an associated command-code pair, as indicated in Table 1. Because each command consists of two bytes of data, two consecutive I2C transmissions must be executed both to initiate the command function, and to read or write the corresponding two bytes of data.

Table 1. Standard Commands

NAME COMMAND CODE UNITS SEALED ACCESS UNSEALED ACCESS
Control() 0x00/0x01 N/A R/W R/W
AtRate() 0x02/0x03 mA R/W R/W
AtRateTimeToEmpty() 0x04/0x05 Minutes R R/W
Temperature() 0x06/0x07 0.1 K R/W R/W
Voltage() 0x08/0x09 mV R R/W
Flags() 0x0a/0x0b N/A R R/W
NominalAvailableCapacity() 0x0c/0x0d mAh R R/W
FullAvailableCapacity() 0x0e/0x0f mAh R R/W
RemainingCapacity() 0x10/0x11 mAh R R/W
FullChargeCapacity() 0x12/0x13 mAh R R/W
AverageCurrent() 0x14/0x15 mA R R/W
TimeToEmpty() 0x16/0x17 Minutes R R/W
RemainingCapacityUnfiltered() 0x18/0x19 mAh R R/W
StandbyCurrent() 0x1a/0x1b mA R R/W
RemainingCapacityFiltered() 0x1c/0x1d mAh R R/W
ProgChargingCurrent() 0x1e/0x1f mA R(1) R(1)
ProgChargingVoltage() 0x20/0x21 mV R(1) R(1)
FullChargeCapacityUnfiltered() 0x22/0x23 mAh R R/W
AveragePower() 0x24/0x25 mW R R/W
FullChargeCapacityFiltered() 0x26/0x27 mAh R R/W
StateOfHealth() 0x28/0x29 %/num R R/W
CycleCount() 0x2a/0x2b Counters R R/W
StateOfCharge() 0x2c/0x2d % R R/W
TrueSOC() 0x2e/0x2f % R R/W
InstantaneousCurrentReading() 0x30/0x31 mA R R/W
InternalTemperature() 0x32/0x33 0.1 K R R/W
ChargingLevel() 0x34/0x35 HEX R R
LevelTaperCurrent() 0x6e/0x6f mA R R
CalcChargingCurrent() 0x70/0x71 mA R R
CalcChargingVoltage() 0x72/0x73 V R R
(1) Only writeable when Charger Options [BYPASS] is set.

7.5.2 Control(): 0x00/0x01

Issuing a Control() command requires a subsequent 2-byte subcommand. These additional bytes specify the particular control function desired. The Control() command allows the system to control specific features of the bq27530-G1 during normal operation and additional features when the device is in different access modes, as described in Table 2.

Table 2. Control( ) Subcommands

CNTL FUNCTION CNTL
DATA		 SEALED
ACCESS		 DESCRIPTION
CONTROL_STATUS 0x0000 Yes Reports the status of hibernate, IT, and so on
DEVICE_TYPE 0x0001 Yes Reports the device type (for example: bq27530)
FW_VERSION 0x0002 Yes Reports the firmware version on the device type
HW_VERSION 0x0003 Yes Reports the hardware version of the device type
PREV_MACWRITE 0x0007 Yes Returns previous MAC subcommand code
CHEM_ID 0x0008 Yes Reports the chemical identifier of the Impedance Track™ configuration
BOARD_OFFSET 0x0009 No Forces the device to measure and store the board offset
CC_OFFSET 0x000a No Forces the device to measure the internal CC offset
CC_OFFSET_SAVE 0x000b No Forces the device to store the internal CC offset
OCV_CMD 0x000c Yes Request the gauge to take a OCV measurement
BAT_INSERT 0x000d Yes Forces the BAT_DET bit set when the [BIE] bit is 0
BAT_REMOVE 0x000e Yes Forces the BAT_DET bit clear when the [BIE] bit is 0
SET_HIBERNATE 0x0011 Yes Forces CONTROL_STATUS [HIBERNATE] to 1
CLEAR_HIBERNATE 0x0012 Yes Forces CONTROL_STATUS [HIBERNATE] to 0
SET_SLEEP+ 0x0013 Yes Forces CONTROL_STATUS [SNOOZE] to 1
CLEAR_SLEEP+ 0x0014 Yes Forces CONTROL_STATUS [SNOOZE] to 0
DIV_CUR_ENABLE 0x0017 Yes Makes the programmed charge current to be half of what is calculated by the gauge charging algorithm.
CHG_ENABLE 0x001A Yes Enable charger. Charge will continue as dictated by gauge charging algorithm.
CHG_DISABLE 0x001B Yes Disable charger (Set CE bit of bq2416x)
GG_CHGRCTL_ENABLE 0x001C Yes Enables the gas gauge to control the charger while continuosly resetting the charger watchdog
GG_CHGRCTL_DISABLE 0x001D Yes The gas gauge stops resetting the charger watchdog
DIV_CUR_DISABLE 0x001E Yes Makes the programmed charge current to be same as what is calculated by the gauge charging algorithm.
DF_VERSION 0x001F Yes Returns the Data Flash Version
SEALED 0x0020 No Places device in SEALED access mode
IT_ENABLE 0x0021 No Enables the Impedance Track™ algorithm
RESET 0x0041 No Forces a full reset of the bq27530-G1

7.5.3 Communications

7.5.3.1 I2C Interface

The bq27530-G1 supports the standard I2C read, incremental read, quick read, one-byte write, and incremental write functions. The 7-bit device address (ADDR) is the most significant 7 bits of the hex address and is fixed as 1010101. The first 8 bits of the I2C protocol are, therefore, 0xAA or 0xAB for write or read, respectively.

bq27530-G1 i2c_packet_format.gif

The quick read returns data at the address indicated by the address pointer. The address pointer, a register internal to the I2C communication engine, increments whenever data is acknowledged by the bq27530-G1 or the I2C master. “Quick writes” function in the same manner and are a convenient means of sending multiple bytes to consecutive command locations (such as two-byte commands that require two bytes of data).

The following command sequences are not supported:

  • Attempt to write a read-only address (NACK after data sent by master):
    • bq27530-G1 i2c_invalid_write.gif
  • Attempt to read an address above 0x6B (NACK command):
    • bq27530-G1 i2c_invalid_read.gif

7.5.3.2 I2C Time Out

The I2C engine releases both SDA and SCL if the I2C bus is held low for 2 seconds. If the bq27530-G1 is holding the lines, releasing them frees them for the master to drive the lines. If an external condition is holding either of the lines low, the I2C engine enters the low-power sleep mode.

7.5.3.3 I2C Command Waiting Time

To ensure proper operation at 400 kHz, a t(BUF) ≥ 66 μs bus-free waiting time must be inserted between all packets addressed to the bq27530-G1. In addition, if the SCL clock frequency (fSCL) is > 100 kHz, use individual 1-byte write commands for proper data flow control. Figure 8 shows the standard waiting time required between issuing the control subcommand the reading the status result. A DF_CHECKSUM subcommand requires 100 ms minimum prior to reading the result. An OCV_CMD subcommand requires 1.2 seconds prior to reading the result. For read-write standard command, a minimum of 2 seconds is required to get the result updated. For read-only standard commands, there is no waiting time required, but the host must not issue any standard command more than two times per second. Otherwise, the gauge could result in a reset issue due to the expiration of the watchdog timer.

bq27530-G1 i2c_comm_wait.gif Figure 8. Standard Waiting Time

7.5.3.4 I2C Clock Stretching

A clock stretch can occur during all modes of fuel gauge operation. In SLEEP and HIBERNATE modes, a short clock stretch occurs on all I2C traffic as the device must wake-up to process the packet. In the other modes (BAT INSERT CHECK, NORMAL, SLEEP+) clock stretching only occurs for packets addressed for the fuel gauge. The majority of clock stretch periods are small as the I2C interface performs normal data flow control. However, less frequent yet more significant clock stretch periods may occur as blocks of Data Flash are updated. Table 3 summarizes the approximate clock stretch duration for various fuel gauge operating conditions.

Table 3. Approximate Clock Stretch Duration

GAUGING MODE OPERATING CONDITION/COMMENT APPROXIMATE
DURATION
SLEEP
HIBERNATE		 Clock stretch occurs at the beginning of all traffic as the device wakes up. ≤ 4 ms
BAT INSERT CHECK NORMAL SLEEP+ Clock stretch occurs within the packet for flow control (after a start bit, ACK or first data bit). ≤ 4 ms
Normal Ra table Data Flash updates. 24 ms
Data Flash block writes. 72 ms
Restored Data Flash block write after loss of power. 116 ms
End of discharge Ra table Data Flash update. 144 ms

8 Application and Implementation

NOTE

Information in the following applications sections is not part of the TI component specification, and TI does not warrant its accuracy or completeness. TI’s customers are responsible for determining suitability of components for their purposes. Customers should validate and test their design implementation to confirm system functionality.

8.1 Application Information

The fuel gauge can control a bq2416x Charger IC without the intervention from an application system processor. Using the bq27530-G1 and bq2416x chipset, batteries can be charged with the typical constant-current, constant-voltage (CCCV) profile or charged using a Multi-Level Charging (MLC) algorithm.

8.2 Typical Application

bq27530-G1 lusal5_TypApp.gif Figure 9. Typical Application

8.2.1 Design Requirements

Several key parameters must be updated to align with a given application's battery characteristics. For highest accuracy gauging, it is important to follow-up this initial configuration with a learning cycle to optimize resistance and maximum chemical capacity (Qmax) values prior to sealing and shipping systems to the field. Successful and accurate configuration of the fuel gauge for a target application can be used as the basis for creating a "golden" gas gauge (.fs) file that can be written to all gauges, assuming identical pack design and Li-ion cell origin (chemistry, lot, and so on). Calibration data is included as part of this golden GG file to cut down on system production time. If going this route, it is recommended to average the voltage and current measurement calibration data from a large sample size and use these in the golden file. Table 4, shows the items that should be configured to achieve reliable protection and accurate gauging with minimal initial configuration.

Table 4. Key Data Flash Parameters for Configuration

NAME DEFAULT UNIT RECOMMENDED SETTING
Design Capacity 1544 mAh Set based on the nominal pack capacity as interpreted from cell manufacturer's data sheet. If multiple parallel cells are used, should be set to N × Cell Capacity.
Reserve Capacity-mAh 0 mAh Set to desired runtime remaining (in seconds/3600) × typical applied load between reporting 0% SOC and reaching Terminate Voltage, if needed.
Cycle Count Threshold 1390 mAh Set to 90% of configured Design Capacity.
Chem ID 1189 hex Should be configured using TI-supplied Battery Management Studio software. Default open-circuit voltage and resistance tables are also updated in conjunction with this step. Do not attempt to manually update reported Device Chemistry as this does not change all chemistry information! Always update chemistry using the appropriate software tool (that is, bqStudio).
Load Mode 0 — Set to applicable load model, 0 for constant current or 1 for constant power.
Load Select 1 — Set to load profile which most closely matches typical system load.
Qmax Cell 0 1544 mAh Set to initial configured value for Design Capacity. The gauge will update this parameter automatically after the optimization cycle and for every regular Qmax update thereafter.
V at Chg Term Cell 0 4200 mV Set to nominal cell voltage for a fully charged cell. The gauge will update this parameter automatically each time full charge termination is detected.
Terminate Voltage 3200 mV Set to empty point reference of battery based on system needs. Typical is between 3000 mV and 3200 mV.
Ra Max Delta 44 mΩ Set to 15% of Cell0 R_a 4 resistance after an optimization cycle is completed.
Charging Voltage 4200 mV Set based on nominal charge voltage for the battery in normal conditions (25°C, etc). Used as the reference point for offsetting by Taper Voltage for full charge termination detection.
Taper Current 77 mA Set to the nominal taper current of the charger + taper current tolerance to ensure that the gauge will reliably detect charge termination.
Taper Voltage 100 mV Sets the voltage window for qualifying full charge termination. Can be set tighter to avoid or wider to ensure possibility of reporting 100% SOC in outer JEITA temperature ranges that use derated charging voltage.
Dsg Current Threshold 60 mA Sets threshold for gauge detecting battery discharge. Should be set lower than minimal system load expected in the application and higher than Quit Current.
Chg Current Threshold 75 mA Sets the threshold for detecting battery charge. Can be set higher or lower depending on typical trickle charge current used. Also should be set higher than Quit Current.
Quit Current 40 mA Sets threshold for gauge detecting battery relaxation. Can be set higher or lower depending on typical standby current and exhibited in the end system.
Avg I Last Run –299 mA Current profile used in capacity simulations at onset of discharge or at all times if Load Select = 0. Should be set to nominal system load. Is automatically updated by the gauge every cycle.
Avg P Last Run –1131 mW Power profile used in capacity simulations at onset of discharge or at all times if Load Select = 0. Should be set to nominal system power. Is automatically updated by the gauge every cycle.
Sleep Current 10 mA Sets the threshold at which the fuel gauge enters SLEEP mode. Take care in setting above typical standby currents else entry to SLEEP may be unintentionally blocked.
Charge T0 0 °C Sets the boundary between charging inhibit and charging with T0 parameters.
Charge T1 10 °C Sets the boundary between charging with T0 and T1 parameters.
Charge T2 45 °C Sets the boundary between charging with T1 and T2 parameters.
Charge T3 50 °C Sets the boundary between charging with T2 and T3 parameters.
Charge T4 60 °C Sets the boundary between charging with T3 and T4 parameters.
Charge Current T0 50 % Des Cap Sets the charge current parameter for T0.
Charge Current T1 100 % Des Cap Sets the charge current parameter for T1.
Charge Current T2 100 % Des Cap Sets the charge current parameter for T2.
Charge Current T3 100 % Des Cap Sets the charge current parameter for T3.
Charge Current T4 0 % Des Cap Sets the charge current parameter for T4.
Charge Voltage T0 210 20 mV Sets the charge voltage parameter for T0.
Charge Voltage T1 210 20 mV Sets the charge voltage parameter for T1.
Charge Voltage T2 207 20 mV Sets the charge voltage parameter for T2.
Charge Voltage T3 205 20 mV Sets the charge voltage parameter for T3.
Charge Voltage T4 0 20 mV Sets the charge voltage parameter for T4.
Chg Temp Hys 3 °C Adds temperature hysteresis for boundary crossings to avoid oscillation if temperature is changing by a degree or so on a given boundary.
Chg Disabled Regulation V 4200 mV Sets the voltage threshold for voltage regulation to system when charge is disabled. It is recommended to program to same value as Charging Voltage and maximum charge voltage that is obtained from Charge Voltage Tn parameters.
CC Gain 10 mΩ Calibrate this parameter using TI-supplied bqStudio software and calibration procedure in the TRM. Determines conversion of coulomb counter measured sense resistor voltage to current.
CC Delta 10 mΩ Calibrate this parameter using TI-supplied bqStudio software and calibration procedure in the TRM. Determines conversion of coulomb counter measured sense resistor voltage to passed charge.
CC Offset –1418 Counts Calibrate this parameter using TI-supplied bqStudio software and calibration procedure in the TRM. Determines native offset of coulomb counter hardware that should be removed from conversions.
Board Offset 0 Counts Calibrate this parameter using TI-supplied bqStudio software and calibration procedure in the TRM. Determines native offset of the printed circuit board parasitics that should be removed from conversions.
Pack V Offset 0 mV Calibrate this parameter using TI-supplied bqStudio software and calibration procedure in the TRM. Determines voltage offset between cell tab and ADC input node to incorporate back into or remove from measurement, depending on polarity.

8.2.2 Detailed Design Procedure

8.2.2.1 BAT Voltage Sense Input

A ceramic capacitor at the input to the BAT pin is used to bypass AC voltage ripple to ground, greatly reducing its influence on battery voltage measurements. It proves most effective in applications with load profiles that exhibit high-frequency current pulses (that is, cell phones) but is recommended for use in all applications to reduce noise on this sensitive high-impedance measurement node.

8.2.2.2 SRP and SRN Current Sense Inputs

The filter network at the input to the coulomb counter is intended to improve differential mode rejection of voltage measured across the sense resistor. These components should be placed as close as possible to the coulomb counter inputs and the routing of the differential traces length-matched to best minimize impedance mismatch-induced measurement errors.

8.2.2.3 Sense Resistor Selection

Any variation encountered in the resistance present between the SRP and SRN pins of the fuel gauge will affect the resulting differential voltage, and derived current, it senses. As such, it is recommended to select a sense resistor with minimal tolerance and temperature coefficient of resistance (TCR) characteristics. The standard recommendation based on best compromise between performance and price is a 1% tolerance, 100 ppm drift sense resistor with a 1-W power rating.

8.2.2.4 TS Temperature Sense Input

Similar to the BAT pin, a ceramic decoupling capacitor for the TS pin is used to bypass AC voltage ripple away from the high-impedance ADC input, minimizing measurement error. Another helpful advantage is that the capacitor provides additional ESD protection since the TS input to system may be accessible in systems that use removable battery packs. It should be placed as close as possible to the respective input pin for optimal filtering performance.

8.2.2.5 Thermistor Selection

The fuel gauge temperature sensing circuitry is designed to work with a negative temperature coefficient-type (NTC) thermistor with a characteristic 10-kΩ resistance at room temperature (25°C). The default curve-fitting coefficients configured in the fuel gauge specifically assume a 103AT-2 type thermistor profile and so that is the default recommendation for thermistor selection purposes. Moving to a separate thermistor resistance profile (for example, JT-2 or others) requires an update to the default thermistor coefficients in data flash to ensure highest accuracy temperature measurement performance.

8.2.2.6 REGIN Power Supply Input Filtering

A ceramic capacitor is placed at the input to the fuel gauge internal LDO to increase power supply rejection (PSR) and improve effective line regulation. It ensures that voltage ripple is rejected to ground instead of coupling into the internal supply rails of the fuel gauge.

8.2.2.7 VCC LDO Output Filtering

A ceramic capacitor is also needed at the output of the internal LDO to provide a current reservoir for fuel gauge load peaks during high peripheral utilization. It acts to stabilize the regulator output and reduce core voltage ripple inside of the fuel gauge.

8.2.3 Application Curves

bq27530-G1 D001_SLUSBU6.gif
Figure 10. Regulator Output Voltage vs. Temperature
bq27530-G1 D003_SLUSBU6.gif
Figure 12. Low-Frequency Oscillator Frequency vs. Temperature
bq27530-G1 D002_SLUSBU6.gif
Figure 11. High-Frequency Oscillator Frequency vs. Temperature
bq27530-G1 D004_SLUSBU6.gif
Figure 13. Reported Internal Temperature Measurement vs. Temperature

9 Power Supply Recommendations

9.1 Power Supply Decoupling

Both the REGIN input pin and the VCC output pin require low equivalent series resistance (ESR) ceramic capacitors placed as closely as possible to the respective pins to optimize ripple rejection and provide a stable and dependable power rail that is resilient to line transients. A 0.1-µF capacitor at the REGIN and a 1-µF capacitor at VCC will suffice for satisfactory device performance.

 
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