SNLU314 June   2022 OPA818

 

  1.   Abstract
  2.   Trademarks
  3. 1Features
  4. 2Power Connections
  5. 3Operating Modes
    1. 3.1 Single-Supply Operation
    2. 3.2 Split-Supply Configuration
  6. 4Input and Output Configurations
  7. 5Differences Between DTK and DRG Packages
  8. 6Schematic
  9. 7Layout

5 Differences Between DTK and DRG Packages

The DEM-OPA-DTK-EVM board can be used with either of Texas Instruments 8-pin SON packages marked DTK or DRG. By default the board is design with the DTK package footprint, but it is also compatable with the DRG, which has a larger thermal pad than the DTK package. When using either package, the thermal pad solder amount should match the footprint on the board even if using the DRG package with the larger thermal pad footprint. In the case of the DRG package, the solder on the board will simply connect within the bounds of the larger thermal pad located on the device. It is important not to add extra solder to the thermal pad connection when using the DRG package as it could create short circuits under the package between the pins and the thermal pad.