SNLS493A October   2014  – January 2015

PRODUCTION DATA.  

  1. Features
  2. Applications
  3. Description
  4. Revision History
  5. Pin Configuration and Functions
  6. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Handling Ratings
    4. 6.4 Recommended Operating Conditions
    5. 6.5 Thermal Information
    6. 6.6 Electrical Characteristics
    7. 6.7 Electrical Characteristics — Serial Management Bus Interface
    8. 6.8 Timing Requirements Serial Bus Interface
    9. 6.9 Typical Characteristics
  7. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
      1. 7.2.1 19
      2. 7.2.2 Functional Datapath Blocks
    3. 7.3 Feature Description
      1. 7.3.1 Typical 4-Level Input Thresholds
    4. 7.4 Device Functional Modes
      1. 7.4.1 Pin Control Mode:
      2. 7.4.2 Slave SMBus Mode:
      3. 7.4.3 SMBus Master Mode
      4. 7.4.4 Signal Conditioning Settings
    5. 7.5 Programming
      1. 7.5.1 EEPROM Address Map for Single Device
      2. 7.5.2 SMBus
      3. 7.5.3 Transfer Of Data Via The SMBus
      4. 7.5.4 SMBus Transactions
    6. 7.6 Writing a Register
    7. 7.7 Reading a Register
    8. 7.8 Register Maps
  8. Applications and Implementation
    1. 8.1 Application Information
      1. 8.1.1 DS80PCI810 versus DS80PCI800
      2. 8.1.2 Signal Integrity in PCIe Applications
      3. 8.1.3 Rx Detect Functionality in PCIe Applications
    2. 8.2 Typical Applications
      1. 8.2.1 Generic High Speed Repeater
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
        3. 8.2.1.3 Application Performance Plots
          1. 8.2.1.3.1 Pre-Channel Only Setup
          2. 8.2.1.3.2 Pre-Channel and Post-Channel Setup
      2. 8.2.2 PCIe Board Applications (PCIe Gen-3)
        1. 8.2.2.1 Design Requirements
        2. 8.2.2.2 Design Procedure
        3. 8.2.2.3 Application Performance Plots
  9. Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Trademarks
    2. 11.2 Electrostatic Discharge Caution
    3. 11.3 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

9 Power Supply Recommendations

Two approaches are recommended to ensure that the DS80PCI810 is provided with an adequate power supply. First, the supply (VDD) and ground (GND) pins should be connected to power planes routed on adjacent layers of the printed circuit board. The layer thickness of the dielectric should be minimized so that the VDD and GND planes create a low inductance supply with distributed capacitance. Second, careful attention to supply bypassing through the proper use of bypass capacitors is required. A 0.1 μF bypass capacitor should be connected to each VDD pin such that the capacitor is placed as close as possible to the DS80PCI810. Smaller body size capacitors can help facilitate proper component placement. Additionally, capacitor with capacitance in the range of 1 μF to 10 μF should be incorporated in the power supply bypassing design as well. These capacitors can be either tantalum or an ultra-low ESR ceramic.

The DS80PCI810 has an optional internal voltage regulator to provide the 2.5 V supply to the device. In 3.3 V mode operation, the VIN pin = 3.3 V is used to supply power to the device. The internal regulator then provides the 2.5 V to the VDD pins of the device, and a 0.1 μF cap is needed at each of the five VDD pins for power supply de-coupling (total capacitance should equal 0.5 μF). The VDD_SEL pin must be tied to GND to enable the internal regulator. In 2.5 V mode operation, the VIN pin should be left open and 2.5 V supply must be applied to the five VDD pins to power the device. The VDD_SEL pin must be left open (no connect) to disable the internal regulator.

30198706.gifFigure 31. 3.3 V or 2.5 V Supply Connection Diagram