1 Introduction

The DS250DF230 is available in two package variants with identical features sets – BGA and QFN. Of the two variants, TI recommends designing with the latter 32-pin RTV (QFN) package variant due to improved thermal efficiency that improves heat dissipation from the package. As a result, the QFN provides superior thermal coefficient performance to facilitate outdoor applications where PCB temperatures may increase up to 105°C.

The DS250DF230EVM is currently only available for evaluation with the BGA package, as the high-speed performance and the feature set is identical between the two package variants. For new designs and existing designs with the BGA package, it is important to account for the differences in pinout, schematic, and layout considerations when transitioning to the QFN package. This document facilitates design-ins with the recommended alternative QFN package variant.