SLVAEY4A november   2021  – april 2023 TPSI3050-Q1

 

  1.   Trademarks
  2. 1Overview
  3. 2Functional Safety Failure In Time (FIT) Rates
  4. 3Failure Mode Distribution (FMD)
  5. 4Pin Failure Mode Analysis (Pin FMA)
  6. 5Revision History

Overview

This document contains information for TPSI3050-Q1 (SOIC package) to aid in a functional safety system design. Information provided are:

  • Functional Safety Failure In Time (FIT) rates of the semiconductor component estimated by the application of industry reliability standards
  • Pin failure mode analysis (Pin FMA)

Figure 1-1 shows the device functional block diagram for reference.

GUID-20201201-CA0I-HXCT-NHJF-X23THNPKSNXZ-low.svg Figure 1-1 Functional Block Diagram

TPSI3050-Q1 was developed using a quality-managed development process, but was not developed in accordance with the IEC 61508 or ISO 26262 standards.