SLVA528D September   2012  – August 2021 TPS65381-Q1 , TPS65381A-Q1

 

  1.   Trademarks
  2. 1Introduction
  3. 2Product Overview
    1. 2.1 Safety Functions and Diagnostics Overview
    2. 2.2 Target Applications
    3. 2.3 Product Safety Constraints
  4. 3Development Process for Management of Systematic Faults
    1. 3.1 TI New-Product Development Process
  5. 4TPS65381x-Q1 Product Architecture for Management of Random Faults
    1. 4.1 Device Operating States
    2.     Device Operating States (continued)
    3. 4.2 NRES (MCU Reset) Driver and ENDRV (SAFING Path Enable) Driver
  6. 5TPS65381x-Q1 Architecture Safety Mechanisms and Assumptions of Use
    1. 5.1 Power Supply
    2. 5.2 Regulated Supplies
      1. 5.2.1 VDD6 Buck Switch-Mode Supply
      2. 5.2.2 VDD5 Linear Supply
      3. 5.2.3 VDD3/5 Linear Supply
      4. 5.2.4 VDD1 Linear Supply
      5. 5.2.5 VSOUT1 Linear Supply
      6. 5.2.6 Charge Pump
    3. 5.3 Diagnostic, Monitoring, and Protection Functions
      1. 5.3.1 External MCU Fault Detection and Management
        1. 5.3.1.1 External MCU Error Signal Monitor (MCU ESM)
        2. 5.3.1.2 Watchdog Timer
      2. 5.3.2 Voltage Monitor (VMON)
      3. 5.3.3 Loss-of-Clock Monitor (LCMON)
      4. 5.3.4 Junction Temperature Monitoring and Current Limiting
      5. 5.3.5 Analog and Digital MUX (AMUX and DMUX) and Diagnostic Output Pin (DIAG_OUT)
      6. 5.3.6 Analog Built-In Self-Test (ABIST)
      7. 5.3.7 Logic Built-In Self-Test (LBIST)
      8. 5.3.8 Device Configuration Register Protection
  7. 6Application Diagrams
    1. 6.1 TPS65381x-Q1 With TMS570
    2. 6.2 TPS65381x-Q1 With C2000
    3. 6.3 TPS65381x-Q1 With TMS470
  8. 7TPS65381x-Q1 as Safety Element out of Context (SEooC)
    1. 7.1 TPS65381x-Q1 Used in an EV/HEV Inverter System
    2. 7.2 SPI Note
  9. 8Revision History

TI New-Product Development Process

Texas Instruments has been developing components for automotive and industrial markets since 1996. Automotive markets have strong requirements regarding quality management and product reliability. The TI new-product development process features many elements necessary to manage systematic faults. Additionally, the documentation and reports for these components can be used to assist with compliance to a wide range of standards for customer’s end applications including automotive and industrial systems (for example ISO 26262-4, IEC 61508-2).

This component was developed using TI’s new product development process which has been certified as compliant to ISO 9001 / IATF 16949 as assessed by Bureau Veritas (BV).

The standard development process breaks development into phases:

  • Assess
  • Plan
  • Create
  • Validate

Figure 3-1 shows the standard process.

GUID-DF7C0AB2-05F6-4B27-A98E-295B7D3AA122-low.gif Figure 3-1 TI New-Product Development Process