SFFSB48 June   2026 TMP4719-Q1

 

  1.   1
  2.   Trademarks
  3. 1Overview
  4. 2Functional Safety Failure In Time (FIT) Rates
    1. 2.1 DGS (VSSOP, 10) Package
    2. 2.2 DSQ (WSON, 10) Package
  5. 3Failure Mode Distribution (FMD)
  6. 4Pin Failure Mode Analysis (Pin FMA)
    1. 4.1 DGS (VSSOP, 10) and DSQ (WSON, 10) Packages
  7. 5Revision History

3 Failure Mode Distribution (FMD)

The failure mode distribution estimation for the TMP4719-Q1 in Table 3-1 comes from the combination of common failure modes listed in standards such as IEC 61508 and ISO 26262, the ratio of sub-circuit function size and complexity, and from best engineering judgment.

The failure modes listed in this section reflect random failure events and do not include failures resulting from misuse or overstress.

Table 3-1 Die Failure Modes and Distribution
Die Failure Modes Failure Mode Distribution (%)
Local temperature measurement error 30
Remote temperature measurement error 25
Serial communication error 30
Register bank data bit error 10
ALERT/T_crit false trip, fails to trip 5