SFFSB48 June 2026 TMP4719-Q1
4.1 DGS (VSSOP, 10) and DSQ (WSON, 10) Packages
Figure 4-1 and Figure 4-2 shows the TMP4719-Q1 pin diagram for the DGS (VSSOP, 10) and DSQ (WSON, 10) packages. For a detailed description of the device pins, see the Pin Configuration and Functions section in the TMP4719-Q1 datasheet.
Figure 4-1 Pin Diagram (DGS (VSSOP, 10)) Package
Figure 4-2 Pin Diagram (DSQ (WSON, 10)) PackageTable 4-2 Pin FMA for Device Pins
Short-Circuited to Ground
| Pin Name | Pin No. | Description of Potential Failure Effects | Failure Effect Class |
|---|---|---|---|
| VDD | 1 | The device is not powered. The device is not functional. Observe that the absolute maximum ratings for all pins of the device are met; otherwise, device damage is plausible. | A |
| DP1 | 2 | The positive remote connection is stuck low. The
remote temperature measurement is out of specification. |
B |
| DN1 | 3 | There is no effect. Operation is normal. | D |
| DP2 | 4 | The positive remote connection is stuck low. The
remote temperature measurement is out of specification. |
B |
| DN2 | 5 | There is no effect. Operation is normal. | D |
| GND | 6 | There is no effect. Operation is normal. | D |
| T_CRIT | 7 | T_CRIT is stuck low and is not functional. T_CRIT falsely asserts. | B |
| ALERT | 8 | ALERT is stuck low and is not functional. ALERT falsely asserts. | B |
| SDA | 9 | SDA is stuck low. I2C communication with the device is not possible. | B |
| SCL | 10 | SCL is stuck low. I2C communication with the device is not possible. | B |
Table 4-3 Pin FMA for Device Pins
Open-Circuited
| Pin Name | Pin No. | Description of Potential Failure Effects | Failure Effect Class |
|---|---|---|---|
| VDD | 1 | The functionality of the device is undetermined. If there is voltage on the other pins, the device can power up through internal ESD diodes. | B |
| DP1 | 2 | DP1 is undetermined. The channel 1 remote temperature measurement is out of specification. | B |
| DN1 | 3 | DN1 is undetermined. The channel 1 remote temperature measurement is out of specification. | B |
| DP2 | 4 | DP2 is undetermined. The channel 2 remote temperature measurement is out of specification. | B |
| DN2 | 5 | DN2 is undetermined. The channel 2 remote temperature measurement is out of specification. | B |
| GND | 6 | The functionality of the device is undetermined. The device can be not powered or connected to ground internally through an alternate pin ESD diode and powered up. | B |
| T_CRIT | 7 | The state of T_CRIT is undetermined. T_CRIT can falsely assertor fail to assert. | B |
| ALERT | 8 | The state of ALERT is undetermined. ALERT can falsely assertor fail to assert. | B |
| SDA | 9 | The state of SDA is undetermined.I2C communication with the device is not possible. | B |
| SCL | 10 | The state of SDA is undetermined. I2C communication with the device is not possible. | B |
Table 4-4 Pin FMA for Device Pins
Short-Circuited to Adjacent Pin
| Pin Name | Pin No. | Shorted to | Description of Potential Failure Effects | Failure Effect Class |
|---|---|---|---|---|
| VDD | 1 | DP1 | DP1 is stuck high. The channel 1 remote temperature measurement is out of specification. | B |
| DP1 | 2 | DN1 | DP1 and the DN1 are shorted. The channel 1 remote temperature measurement is out of specification. | B |
| DN1 | 3 | DP2 | DN1 and DP2 are shorted. The channel 1 and 2 remote temperature measurements are out of specification. | B |
| DP2 | 4 | DN2 | DP2 and DN2 is shorted. The channel 2 remote temperature measurement is out of specification. | B |
| DN2 | 5 | GND | There is no effect. Operation is normal. | D |
| GND | 6 | T_CRIT | T_CRIT is stuck low and not functional. T_CRIT falsely asserts. | B |
| T_CRIT | 7 | ALERT | T_CRIT and ALERT are shorted. T_CRIT or ALERT can falsely assert. | B |
| ALERT | 8 | SDA | The SDA communication line is stuck high or low. I2C communication with the device is not possible. | B |
| SDA | 9 | SCL | The communication lines are shorted. I2C communication with the device is not possible. | B |
| SCL | 10 | VDD | SCL is stuck high. I2C communication with the device is not possible. | B |
Table 4-5 Pin FMA for Device Pins
Short-Circuited to
Supply
| Pin Name | Pin No. | Description of Potential Failure Effects | Failure Effect Class |
|---|---|---|---|
| VDD | 1 | There is no effect. Operation is normal. | D |
| DP1 | 2 | DP1 is stuck high. The channel 1 remote temperature measurement is out of specification. | B |
| DN1 | 3 | DN1 is stuck high. The channel 1 remote temperature measurement is out of specification. | B |
| DP2 | 4 | DP2 is stuck high. The channel 2 remote temperature measurement is out of specification. | B |
| DN2 | 5 | DN2 is stuck high. The channel 2 remote temperature measurement is out of specification. | B |
| GND | 6 | The device functionality is undetermined. Observe that the absolute maximum ratings for all pins of the device are met, otherwise, device damage is plausible. | A |
| T_CRIT | 7 | T_CRIT is stuck high and is not functional. T_CRIT does not assert. | B |
| ALERT | 8 | ALERT is stuck high and is not functional. ALERT does not assert. | B |
| SDA | 9 | SDA is stuck high. I2C communication with the device is not possible. | B |
| SCL | 10 | SCL is stuck high. I2C communication with the device is not possible. | B |