SFFS875 April   2024 SN74AVC4T245-Q1

 

  1.   1
  2.   Trademarks
  3. 1Overview
  4. 2Functional Safety Failure In Time (FIT) Rates
    1. 2.1 TSSOP Package
    2. 2.2 WQFN Package
    3. 2.3 UQFN Package
  5. 3Failure Mode Distribution (FMD)
  6. 4Pin Failure Mode Analysis (Pin FMA)
    1. 4.1 TSSOP Package
    2. 4.2 WQFN Package
    3. 4.3 UQFN Package

1 Overview

This document contains information for the SN74AVC4T245-Q1 (TSSOP, WQFN, and UQFN packages) to aid in a functional safety system design. Information provided are:

  • Functional safety failure in time (FIT) rates of the semiconductor component estimated by the application of industry reliability standards
  • Component failure modes and their distribution (FMD) based on the primary function of the device
  • Pin failure mode analysis (pin FMA)

Figure 1-1 shows the device functional block diagram for reference.

GUID-A367CBD1-276B-4647-9500-0F4A3E6ACCEB-low.gifFigure 1-1 Functional Block Diagram

The SN74AVC4T245-Q1 was developed using a quality-managed development process, but was not developed in accordance with the IEC 61508 or ISO 26262 standards.