3 Failure Mode Distribution (FMD)

The failure mode distribution estimation for the TPS65219-Q1 in Table 3-1 comes from the combination of common failure modes listed in standards such as IEC 61508 and ISO 26262, the ratio of sub-circuit function size and complexity, and from best engineering judgment.

The failure modes listed in this section reflect random failure events and do not include failures resulting from misuse or overstress.

Table 3-1 Die Failure Modes and Distribution

Die Failure Modes	Failure Mode Distribution (%)
Reference system failure	3.73
Temperature monitor failure	0.46
BUCK1 failure	18.22
BUCK2 failure	12.88
BUCK3 failure	12.88
LDO1 failure	7.83
LDO2 failure	7.83
LDO3 failure	6.22
LDO4 failure	6.22
VDD1P8 failure	3.40
Oscillator failure	0.74
I2C interface failure	0.11
IO driver failure	1.85
nINT or nRSTOUT driver failure	0.76
NVM LDO failure	1.22
EEPROM failure	3.82
Digital logic failure	11.83