SFFS363 January   2022 TMAG5123-Q1

 

  1.   Trademarks
  2. 1Overview
  3. 2Functional Safety Failure In Time (FIT) Rates
  4. 3Failure Mode Distribution (FMD)
  5. 4Pin Failure Mode Analysis (Pin FMA)

4 Pin Failure Mode Analysis (Pin FMA)

This section provides a failure mode analysis (FMA) for the pins of the TMAG5123-Q1. The failure modes covered in this document include the typical pin-by-pin failure scenarios:

  • Pin short-circuited to ground (see Table 4-2)
  • Pin open-circuited (see Table 4-3)
  • Pin short-circuited to an adjacent pin (see Table 4-4)
  • Pin short-circuited to supply (see Table 4-5)

Table 4-2 through Table 4-5 also indicate how these pin conditions can affect the device as per the failure effects classification in Table 4-1.

Table 4-1 TI Classification of Failure Effects
ClassFailure Effects
APotential device damage that affects functionality.
BNo device damage, but loss of functionality.
CNo device damage, but performance degradation.
DNo device damage, no impact to functionality or performance.

Figure 4-1 shows the TMAG5123-Q1 pin diagram. For a detailed description of the device pins, see the Pin Configuration and Functions section in the TMAG5123-Q1 data sheet.

Figure 4-1 Pin Diagram

Following are the assumptions of use and the device configuration assumed for the pin FMA in this section:

  • TA= -40°C to +150°C
  • VCC = 2.7 V to 28 V
Table 4-2 Pin FMA for Device Pins Short-Circuited to Ground
Pin NamePin No.Description of Potential Failure Effect(s)Failure Effect Class
VCC1A lot of current may be sourced external to the device, with the current only being limited by the source that supplies VCC. Device output stuck in HIGH state.B
OUT2Device not damaged and output stuck at LOW state.B
GND3Normal Operation.D
Table 4-3 Pin FMA for Device Pins Open-Circuited
Pin NamePin No.Description of Potential Failure Effect(s)Failure Effect Class
VCC1OUT stuck in HIGH state.B
OUT2A transition to HIGH may be slow or not occur a all.B
GND3No damage, output stuck in HIGH state.B
Table 4-4 Pin FMA for Device Pins Short-Circuited to Adjacent Pin
Pin NamePin No.Shorted toDescription of Potential Failure Effect(s)Failure Effect Class
VCC12-OUT The output will sink current limited by the power supply. The output signal will be pulled to VCC. If the device BOP threshold is triggered, the device may be damaged. If the ambient field remains below the BRP threshold, the device will not be damaged.A
OUT23-GNDDevice not damaged and output stuck in LOW state.B
GND31-VCCA lot of current may be sourced external to the device, with the current only being limited by the source that supplies VCC. Device output stuck in HIGH state.B
Table 4-5 Pin FMA for Device Pins Short-Circuited to supply
Pin NamePin No.Description of Potential Failure Effect(s)Failure Effect Class
VCC1Normal OperationD
OUT2The output will sink current limited by the power supply. The output signal will be pulled to VCC. If the device BOP threshold is triggered, the device may be damaged. If the ambient field remains below the BRP threshold, the device will not be damaged.A
GND3A lot of current may be sourced external to the device, with the current only being limited by the source that supplies VCC. Device output stuck in HIGH state.B