SFFS191 March   2022 UCC27211A-Q1 , UCC27212A-Q1

 

  1.   Trademarks
  2. 1Overview
  3. 2Functional Safety Failure In Time (FIT) Rates
  4. 3Failure Mode Distribution (FMD)
  5. 4Pin Failure Mode Analysis (Pin FMA)

Pin Failure Mode Analysis (Pin FMA)

This section provides a Failure Mode Analysis (FMA) for the pins of the UCC27211A-Q1 UCC27212A-Q1. The failure modes covered in this document include the typical pin-by-pin failure scenarios:

  • Pin short-circuited to Ground (see Table 4-2)
  • Pin open-circuited (see Table 4-3)
  • Pin short-circuited to an adjacent pin (see Table 4-4)
  • Pin short-circuited to supply (see Table 4-5)

Table 4-2 through Table 4-5 also indicate how these pin conditions can affect the device as per the failure effects classification in Table 4-1.

Table 4-1 TI Classification of Failure Effects
ClassFailure Effects
APotential device damage that affects functionality
BNo device damage, but loss of functionality
CNo device damage, but performance degradation
DNo device damage, no impact to functionality or performance

Figure 4-1 shows the UCC27211A-Q1 UCC27212A-Q1 pin diagram. For a detailed description of the device pins please refer to the Pin Configuration and Functions section in the UCC27211A-Q1 UCC27212A-Q1 data sheet.

GUID-3B46D474-A261-4344-904D-67401997E423-low.gif Figure 4-1 Pin Diagram

Following are the assumptions of use and the device configuration assumed for the pin FMA in this section:

  • Pin #1 short to Pin #8 and Pin #4 short to Pin #5 are not considered.
  • Short-Circuited to supply case is analyzed for short to VDD.
Table 4-2 Pin FMA for Device Pins Short-Circuited to Ground
Pin NamePin No.Description of Potential Failure Effect(s)Failure Effect Class
VDD1Device power up not possible. Device positive supply short to ground.B
HB2Possible boostrap diode damage. HO output is stuck low.A
HO3Possible damage to HO output driver. HO output is stuck low.A
HS 4 HO level is stuck low or ground level. High side power FET can't pull up HO node. B
HI 5 HO is stuck low. B
LI 6 LO is stuck low. B
VSS 7 No effect. Short to same potential. D
LO 8 LO is stuck low. Possible LO output driver damage. A
Table 4-3 Pin FMA for Device Pins Open-Circuited
Pin Name Pin No. Description of Potential Failure Effect(s) Failure Effect Class
VDD 1 Device power up not possible. Device positive supply is open. B
HB 2 High side UVLO is detected. HO is stuck low. B
HO 3 Power FET gate is disconnected from HO. D
HS 4 HO output level is unknown. B
HI 5 HO is stuck low. B
LI 6 LO is stuck low. B
VSS 7 No ground connection to the device. LO and HO potentially pulled up to VDD level.
LO 8 Power FET gate is disconnected from HO.
Table 4-4 Pin FMA for Device Pins Short-Circuited to Adjacent Pin
Pin NamePin No.Shorted toDescription of Potential Failure Effect(s)Failure Effect Class
VDD1HBHigh side UVLO is detected. HO is stuck lowB
HB2HOPossible damage to boostrap diode and HO output stage.A
HO3HSPossible damage to boostrap diode and HO output stage.A
HI 5 LI HO and LO states depend on the driving source of LI and HI. B
LI 6 VSS LO is stuck low. B
VSS 7 LO LO is stuck low. Possible damage to LO output driver. A
Table 4-5 Pin FMA for Device Pins Short-Circuited to supply
Pin Name Pin No. Description of Potential Failure Effect(s) Failure Effect Class
VDD 1 No effect. Short to same potential. D
HB 2 High side UVLO is detected. HO is stuck low B
HO 3 HO is stcuk high at VDD level. Possible damgae to HO driver. A
HS 4 HO is stcuk high at VDD level. Possible damgae to HO driver. A
HI 5 HO is stuck high. B
LI 6 LO is stuck high. B
VSS 7 Device power up not possible. Device positive supply short to ground. B
LO 8 LO is stcuk high at VDD level. Possible damgae to LO driver. A