SDAA435 July 2026 TAA5212 , TAA5242 , TAC5211 , TAC5242 , TAD5212 , TAD5212-Q1 , TAD5242
Similar to the PCB design, in which the placement of digital and analog sections is planned carefully, the internal design of the DAC follows a similar approach. The analog and digital domains are separated, and each requires dedicated power supplies.
Clocks are the most dominant source of noise injection to the ground lines and thus the analog and digital domains must be isolated with their own ground lines. In many designs submodules exist within the main module and have separate supplies to help with containing the noise within a submodule. In all of TI's audio devices, not only the digital, analog, and IO buffer supplies are separated, but also in many cases multiple ground pins or independent supplies are provided for each submodule or channel. Care must be taken in the layout phase as well by isolating or shielding to complete the noise containment attempts.
While the end users have no control over the design and layout of a given IC, the selection of the part with suitable architecture and features can improve the performance of the system as a whole.