SDAA435 July   2026 TAA5212 , TAA5242 , TAC5211 , TAC5242 , TAD5212 , TAD5212-Q1 , TAD5242

 

  1.   1
  2.   Abstract
  3.   Trademarks
  4. 1Introduction
  5. 2Detailed Description
    1. 2.1 Internal Noise (Within the IC)
      1. 2.1.1 Noise Shaping and Filtering Out the Noise
      2. 2.1.2 Avoiding Noise Coupling between Internal Digital and Analog Modules
    2. 2.2 External Noise
      1. 2.2.1 Clock Jitter
      2. 2.2.2 Power Supplies
    3. 2.3 Noise from PCB Design and Routing
  6. 3Summary
  7. 4References

Avoiding Noise Coupling between Internal Digital and Analog Modules

Similar to the PCB design, in which the placement of digital and analog sections is planned carefully, the internal design of the DAC follows a similar approach. The analog and digital domains are separated, and each requires dedicated power supplies.

Clocks are the most dominant source of noise injection to the ground lines and thus the analog and digital domains must be isolated with their own ground lines. In many designs submodules exist within the main module and have separate supplies to help with containing the noise within a submodule. In all of TI's audio devices, not only the digital, analog, and IO buffer supplies are separated, but also in many cases multiple ground pins or independent supplies are provided for each submodule or channel. Care must be taken in the layout phase as well by isolating or shielding to complete the noise containment attempts.

While the end users have no control over the design and layout of a given IC, the selection of the part with suitable architecture and features can improve the performance of the system as a whole.