SCDU018A December   2020  – December 2020 TMUX7208

 

  1.   Abstract
  2.   Trademarks
  3. Introduction
  4. Information About Cautions and Warnings
  5. Features of this EVM
  6. EVM Images
  7. EVM Setup
  8. EVM Connectors and Test Points
    1. 6.1 Connectors
    2. 6.2 Test Points
  9. PCB Layouts
  10. Schematics
  11. Bill of Materials
  12. 10Related Documentation
  13. 11Revision History

Features of this EVM

The EVM has the following features:

  • Quick prototyping and testing setup for the 16-pin TMUX7208 device in the TSSOP (PW) package.
  • TMUX7208 control logic truth table listed on board.
  • No specific TMUX7208 is supplied or soldered to the evaluation module. Allows flexibility to choose the desired IC for evaluation.
  • Support for both single supply and dual supply operation.
  • Six power supply decoupling capacitors (2 × 0.1 μF, 2 × 1 μF, and 2 × 10 μF).
  • Jumpers to nine signal lanes, VDD and VSS power rails, and control signals.
  • Nine pads are available for placement of SMA connectors.
  • Pads are available for pull-up or pull-down resistors on control signal pathways.
  • Pads are available for surge protection diodes.
  • 0805 capacitor pads are available on all signal pathways referenced to ground.