SCDA023B April   2020  – January 2022 TMUX1308-Q1 , TMUX1309-Q1

 

  1.   Trademarks
  2. 1Overview
  3. 2Functional Safety Failure In Time (FIT) Rates
    1. 2.1 TSSOP, SOT-23-THIN, and WQFN Packages
  4. 3Failure Mode Distribution (FMD)
  5. 4Pin Failure Mode Analysis (Pin FMA)
    1. 4.1 TMUX1308-Q1 TSSOP and SOT-23-THIN Package
    2. 4.2 TMUX1308-Q1 WQFN Package
    3. 4.3 TMUX1309-Q1 TSSOP and SOT-23-THIN Package
    4. 4.4 TMUX1309-Q1 WQFN Package
  6. 5Revision History

2.1 TSSOP, SOT-23-THIN, and WQFN Packages

This section provides Functional Safety Failure In Time (FIT) rates for TSSOP, SOT-23-THIN, and WQFN packages of the TMUX1308-Q1 and TMUX1309-Q1 based on two different industry-wide used reliability standards:

  • Table 2-1 provides FIT rates based on IEC TR 62380 / ISO 26262 part 11
  • Table 2-3 provides FIT rates based on the Siemens Norm SN 29500-2
Table 2-1 Component Failure Rates per IEC TR 62380 / ISO 26262 Part 11 TSSOP
FIT IEC TR 62380 / ISO 26262FIT (Failures Per 109 Hours)
Total Component FIT Rate

12

Die FIT Rate3
Package FIT Rate

9

Table 2-2 Component Failure Rates per IEC TR 62380 / ISO 26262 Part 11 SOT-23-THIN and WQFN
FIT IEC TR 62380 / ISO 26262 FIT (Failures Per 109 Hours)
Total Component FIT Rate 8
Die FIT Rate 3
Package FIT Rate 5

The failure rate and mission profile information in Table 2-1 comes from the Reliability data handbook IEC TR 62380 / ISO 26262 part 11:

  • Mission Profile: Motor Control from Table 11
  • Power dissipation: 100 mW
  • Climate type: World-wide Table 8
  • Package factor (lambda 3): Table 17b
  • Substrate Material: FR4
  • EOS FIT rate assumed: 0 FIT
Table 2-3 Component Failure Rates per Siemens Norm SN 29500-2
TableCategoryReference FIT RateReference Virtual TJ
5BICMOS
ASICs Analog and Mixed =<50 V supply		20 FIT55°C

The Reference FIT Rate and Reference Virtual TJ (junction temperature) in Table 2-3 come from the Siemens Norm SN 29500-2 tables 1 through 5. Failure rates under operating conditions are calculated from the reference failure rate and virtual junction temperature using conversion information in SN 29500-2 section 4.