SBOA409A May   2020  – October 2020 INA381-Q1

 

  1. 1Overview
  2. 2Functional Safety Failure In Time (FIT) Rates
  3. 3Failure Mode Distribution (FMD)
  4. 4Pin Failure Mode Analysis (Pin FMA)
  5. 5Revision History

Pin Failure Mode Analysis (Pin FMA)

This section provides a Failure Mode Analysis (FMA) for the pins of the INA381-Q1. The failure modes covered in this document include the typical pin-by-pin failure scenarios:

  • Pin short-circuited to Ground (see Table 4-2)
  • Pin open-circuited (see Table 4-3)
  • Pin short-circuited to an adjacent pin (see Table 4-4)
  • Pin short-circuited to Supply (see Table 4-5)

Table 4-2 through Table 4-5 also indicate how these pin conditions can affect the device as per the failure effects classification in Table 4-1.

Table 4-1 TI Classification of Failure Effects
ClassFailure Effects
APotential device damage that affects functionality
BNo device damage, but loss of functionality
CNo device damage, but performance degradation
DNo device damage, no impact to functionality or performance

Figure 4-1 shows the INA381-Q1 pin diagram. For a detailed description of the device pins please refer to the Pin Configuration and Functions section in the INA381-Q1 data sheet.

GUID-20200915-CA0I-T5HJ-QFMQ-BZX1LNNCJQ6C-low.gif Figure 4-1 Pin Diagram

Following are the assumptions of use and the device configuration assumed for the pin FMA in this section:

  • TA = -40°C to +125°C
  • VS = 5 V
  • VIN+ = 12 V
  • CMPREF = 2 V.
Table 4-2 Pin FMA for Device Pins Short-Circuited to Ground
Pin Name Pin No. Description of Potential Failure Effect(s) Failure Effect Class
IN+ 1 In high-side configuration, a short from the bus supply to GND will occur. High current will flow from bus supply to ground. In low side configuration, input pins are shorted. B
VS+ 2 Power supply shorted to ground B
ALERT 3 ALERT output is stuck low B
RESET 4 If intended connection is not GND, functionality will be affected. D if RESET=GND by design; B otherwise
GND 5 Normal Operation D
NC 6 Normal Operation D
CMPREF 7 ALERT output is stuck low B
CMPIN 8 ALERT output is stuck high B
VOUT 9 Output shorts to ground. When left in this configuration for a long time, under high supplies self heating could cause dice junction temperature to exceed 150 degrees Celsius. B
IN- 10 In high-side configuration, a short from the bus supply to GND will occur. High current will flow from bus supply to ground. In low side configuration, normal operation B for High side or D for low side
Table 4-3 Pin FMA for Device Pins Open-Circuited
Pin Name Pin No. Description of Potential Failure Effect(s) Failure Effect Class
IN+ 1 Differential input voltage is not well defined B
VS+ 2 No power supply to device. Device may be biased through inputs. Output will be close to GND. B
ALERT 3 Pin can be left open if not needed D if ALERT=open by design; B otherwise
RESET 4 Comparator mode is not defined B
GND 5 GND is floating. Output will be incorrect as it is no longer referenced to GND. B
NC 6 Normal Operation D
CMPREF 7 Comparator threshold is not defined. B
CMPIN 8 Comparator input is not defined B
VOUT 9 Output can be left open, there is no effect on the IC. B
IN- 10 Differential input voltage is not well defined. B
Table 4-4 Pin FMA for Device Pins Short-Circuited to Adjacent Pin
Pin Name Pin No. Shorted to Description of Potential Failure Effect(s) Failure Effect Class
IN+ 1 VS+ In high-side configuration, a short from the bus supply to VS will occur. High current will flow from bus supply to VS or vice versa. Device could be damaged. A for High side or B for low side
VS+ 2 ALERT ALERT is stuck high or unpredictable. B
ALERT 3 RESET ALERT is unpredictable. B
RESET 4 GND If intended connection is not GND, functionality will be affected. D if RESET=GND by design; B otherwise
GND 5 NC Normal Operation. D
NC 6 CMPREF Normal Operation. D
CMPREF 7 CMPIN Comparator input pins are shorted. B
CMPIN 8 VOUT Normal Operation. D
VOUT 9 IN- In high-side configuration, a short from the bus supply to VOUT will occur. Device could be damaged . In low side configuration, power supply is shorted to GND. A for High side or B for low side
IN- 10 IN+ Input differential voltage=0V. C
Table 4-5 Pin FMA for Device Pins Short-Circuited to Supply
Pin Name Pin No. Description of Potential Failure Effect(s) Failure Effect Class
IN+ 1 In high-side configuration, a short from the bus supply to VS will occur. High current will flow from bus supply to VS or vice versa. Device could be damaged. A for High side or B for low side
VS+ 2 Normal operation D
ALERT 3 ALERT is stuck high or unpredictable. B
RESET 4 If intended connection is not VS, functionality will be affected. D if RESET=VS by design; B otherwise
GND 5 Power supply shorted to GND B
NC 6 Normal operation D
CMPREF 7 ALERT is stuck high. B
CMPIN 8 ALERT is stuck low. B
VOUT 9 Output shorts to supply. When left in this configuration for a long time, under high supplies self heating could cause dice junction temperature to exceed 150 degrees Celsius. B
IN- 10 In high-side configuration, a short from the bus supply to VS will occur. High current will flow from bus supply to VS or vice versa. Device could be damaged. A for High side or B for low side