SBAK030 April   2024 AFE7950-SP

 

  1.   1
  2.   Abstract
  3.   Trademarks
  4. 1Texas Instruments Product Qualification and Reliability Report
  5. 2Space High Grade in Plastic Production Flow
  6. 3Device Qualification
  7. 4Outgas Test Report
  8. 5Construction Exceptions and Manufacturing Flow Optimizations

3 Device Qualification

The following is the device qualification summary.

Qualification by Similarity (Qualification Family)

A new device can be qualified either by performing full-scale quality and reliability tests on the actual device or using previously qualified devices through qualification by similarity (QBS) rules. By establishing similarity between the new device and those qualified previously, repetitive tests are eliminated, allowing for timely production release. When adopting QBS methodology, the emphasis is on qualifying the differences between a previously qualified product and the new product under consideration.

The QBS rules for a technology, product, test parameters or package shall define which attributes are required to remain fixed in order for the QBS rules to apply. The attributes which are expected and allowed to vary are reviewed and a QBS plan shall be developed, based on the reliability impact assessment above, specifying what subset of the full complement of environmental stresses is required to evaluate the reliability impact of those variations. Each new device shall be reviewed for conformance to the QBS rule sets applicable to that device.

See JEDEC JESD47 for more information

Table 3-1 Device Baseline
TI DeviceAFE7950ALKSHPAssembly SiteTI-PHI (Phillipines)
Wafer FabTSMC F15Test SiteTI-PHI (Phillipines)
Fab ProcessTSMC C28.HPC+Pin and Package typeALK, 400
Fab TechnologyTSMC C28.HPC+SubstratePb Free SOP/uBall
Die RevisionATermination FinishSnAgCu
ESD CDM±150VChip Cap TerminationPure Sn
ESD HBM±1000VMoisture SensitivityMSL 3/ 220°C
Table 3-2 Space Products New Device Qualification Matrix
Req nameMethod / ConditionsLots / DevicesSS / Accept
Precon MSL3MSL3 220°C1120/0
UHAST (110°C)110C/85%RH, 264, 528 Hours130/0
BHAST (110°C)110C/85%RH, 264, 528 Hours130/0
HTSL (150°C)150C, 1000 Hours130/0
Temperature Cycle-55C/125C, 700 cycles130/0
Solderability22 leads/lot, min 3 devices. 245C + 5C Condition A (steam age for 8 hours)13/0
Physical DimensionsPer case outline drawing115/0
D3 per QCI planPrecon MSL3, 220C b) JESD22-A104, -55/125C, 100 cycles c) JESD22-A118, 110C/85%RH, 264 hours115/0
D5 Salt Atmosphere, per QCI planCondition A, per 883 TM1009115/0
ESD CDMJS-002, 150V13/0
ESD HBMJS-001, 1KV13/0
Latch-Up HTJESD78, 105C13/0
C1 - Life Test, 125°CTM1005 125C, 1000 Hours145/0
Outgassing CharacterizationASTM E595
TML <=1%
CVCM <=0.1%		-PASS
Thermal Resistance QMLSimulation-See Data sheet / Complete
Radiation Response CharacterizationTotal ionization dose, single-event latch-up MIL-STD-883/Method 10191Complete (Refer to radiation report on www.ti.com)