ZHCSEN7D October   2014  – February 2022 DS90UB948-Q1

PRODUCTION DATA  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  DC Electrical Characteristics
    6. 6.6  AC Electrical Characteristics
    7. 6.7  Timing Requirements for the Serial Control Bus
    8. 6.8  Switching Characteristics
    9. 6.9  Timing Diagrams and Test Circuits
    10. 6.10 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  High-Speed Forward Channel Data Transfer
      2. 7.3.2  Low-Speed Back Channel Data Transfer
      3. 7.3.3  FPD-Link III Port Register Access
      4. 7.3.4  Oscillator Output
      5. 7.3.5  Clock and Output Status
      6. 7.3.6  LVCMOS VDDIO Option
      7. 7.3.7  Power Down (PDB)
      8. 7.3.8  Interrupt Pin — Functional Description and Usage (INTB_IN)
      9. 7.3.9  General-Purpose I/O (GPIO)
        1. 7.3.9.1 GPIO[3:0] and D_GPIO[3:0] Configuration
        2. 7.3.9.2 Back Channel Configuration
        3. 7.3.9.3 GPIO Register Configuration
      10. 7.3.10 SPI Communication
        1. 7.3.10.1 SPI Mode Configuration
        2. 7.3.10.2 Forward Channel SPI Operation
        3. 7.3.10.3 Reverse Channel SPI Operation
      11. 7.3.11 Backward Compatibility
      12. 7.3.12 Adaptive Equalizer
        1. 7.3.12.1 Transmission Distance
        2. 7.3.12.2 Adaptive Equalizer Algorithm
        3. 7.3.12.3 AEQ Settings
          1. 7.3.12.3.1 AEQ Start-Up and Initialization
          2. 7.3.12.3.2 AEQ Range
          3. 7.3.12.3.3 AEQ Timing
      13. 7.3.13 I2S Audio Interface
        1. 7.3.13.1 I2S Transport Modes
        2. 7.3.13.2 I2S Repeater
        3. 7.3.13.3 I2S Jitter Cleaning
        4. 7.3.13.4 MCLK
      14. 7.3.14 Repeater
        1. 7.3.14.1 Repeater Configuration
        2. 7.3.14.2 Repeater Connections
          1. 7.3.14.2.1 Repeater Fan-Out Electrical Requirements
      15. 7.3.15 Built-In Self Test (BIST)
        1. 7.3.15.1 BIST Configuration and Status
          1. 7.3.15.1.1 Sample BIST Sequence
        2. 7.3.15.2 Forward Channel and Back Channel Error Checking
      16. 7.3.16 Internal Pattern Generation
    4. 7.4 Device Functional Modes
      1. 7.4.1 Configuration Select MODE_SEL[1:0]
        1. 7.4.1.1 1-Lane FPD-Link III Input, Single Link OpenLDI Output
        2. 7.4.1.2 1-Lane FPD-Link III Input, Dual Link OpenLDI Output
        3. 7.4.1.3 2-Lane FPD-Link III Input, Dual Link OpenLDI Output
        4. 7.4.1.4 2-Lane FPD-Link III Input, Single Link OpenLDI Output
        5. 7.4.1.5 1-Lane FPD-Link III Input, Single Link OpenLDI Output (Replicate)
      2. 7.4.2 MODE_SEL[1:0]
        1. 7.4.2.1 Dual Swap
      3. 7.4.3 OpenLDI Output Frame and Color Bit Mapping Select
    5. 7.5 Image Enhancement Features
      1. 7.5.1 White Balance
      2. 7.5.2 LUT Contents
      3. 7.5.3 Enabling White Balance
        1. 7.5.3.1 LUT Programming Example
      4. 7.5.4 Adaptive Hi-FRC Dithering
    6. 7.6 Programming
      1. 7.6.1 Serial Control Bus
      2. 7.6.2 Multi-Controller Arbitration Support
      3. 7.6.3 I2C Restrictions on Multi-Controller Operation
      4. 7.6.4 Multi-Controller Access to Device Registers for Newer FPD-Link III Devices
      5. 7.6.5 Multi-Controller Access to Device Registers for Older FPD-Link III Devices
      6. 7.6.6 Restrictions on Control Channel Direction for Multi-Controller Operation
    7. 7.7 Register Maps
      1. 7.7.1 DS90UB948-Q1 Registers
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Applications
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 FPD-Link III Interconnect Guidelines
        2. 8.2.2.2 AV Mute Prevention
        3. 8.2.2.3 Prevention of I2C Errors During Abrupt System Faults
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
    1. 9.1 Power-Up Requirements and PDB Pin
    2. 9.2 Power Sequence
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Ground
    3. 10.3 Routing FPD-Link III Signal Traces
    4. 10.4 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 接收文档更新通知
    3. 11.3 支持资源
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 术语表
  12. 12Mechanical, Packaging, and Orderable Information

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1 特性

  • 符合汽车应用要求
  • 具有符合 AEC-Q100 标准的下列特性：
    • 器件温度等级 2：–40°C 至 +105°C 环境工作温度范围
  • 支持高达 192MHz 的像素时钟频率，可实现 2K (2048x1080) 的分辨率和 24 位色深
  • 具有偏斜校正能力的单通道或双通道 FPD-Link III 接口
  • 单通道或双通道 OpenLDI (LVDS) 发送器
    • 单通道：高达 96MHz 的像素时钟
    • 双通道：高达 192MHz 的像素时钟
    • 可配置的 18 位 RGB 或 24 位 RGB
  • 提供功能安全
    • 有助于进行 ISO 26262 系统设计的文档
  • 四通道高速 GPIO（每个通道最高 2Mbps）
  • 自适应接收均衡
    • 在 1.48GHz 下的通道插入损耗补偿高达 –15.5dB，在 1.68GHz 下的通道插入损耗补偿高达 -9dB
    • 提供自动温度和电缆老化补偿
  • SPI 控制接口速率高达 3.3Mbps
  • 具有 1Mbps 快速模式增强版的 I2C（控制器/目标）
  • 图像增强功能（白平衡和抖动）
  • 支持 7.1 多条 I2S（4 个数据）通道