ZHCSC42J July   2013  – October 2014 WL1801MOD , WL1805MOD , WL1831MOD , WL1835MOD

PRODUCTION DATA.  

  1. 1器件概述
    1. 1.1 特性
    2. 1.2 应用范围
    3. 1.3 说明
    4. 1.4 功能方框图
  2. 2修订历史记录
  3. 3Device Comparison
  4. 4Terminal Configuration and Functions
    1. 4.1 Pin Description
  5. 5Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  Handling Ratings
    3. 5.3  Power-On Hours (POH)
    4. 5.4  Recommended Operating Conditions
    5. 5.5  External Digital Slow Clock Requirements
    6. 5.6  Thermal Characteristics
    7. 5.7  WLAN Performance
      1. 5.7.1 WLAN 2.4-GHz Receiver Characteristics
      2. 5.7.2 WLAN 2.4-GHz Transmitter Power
      3. 5.7.3 WLAN Currents
    8. 5.8  Bluetooth Performance
      1. 5.8.1 Bluetooth BR, EDR Receiver Characteristics—In-Band Signals
      2. 5.8.2 Bluetooth Transmitter, BR
      3. 5.8.3 Bluetooth Transmitter, EDR
      4. 5.8.4 Bluetooth Modulation, BR
      5. 5.8.5 Bluetooth Modulation, EDR
    9. 5.9  Bluetooth LE Performance
      1. 5.9.1 Bluetooth LE Receiver Characteristics - In-Band Signals
      2. 5.9.2 Bluetooth LE Transmitter Characteristics
      3. 5.9.3 Bluetooth LE Modulation Characteristics
    10. 5.10 Bluetooth-BLE Dynamic Currents
    11. 5.11 Bluetooth LE Currents
    12. 5.12 Timing and Switching Characteristics
      1. 5.12.1 Power Management
        1. 5.12.1.1 Block Diagram - Internal DC2DCs
      2. 5.12.2 Power-Up and Shut-Down States
      3. 5.12.3 Chip Top-level Power-Up Sequence
      4. 5.12.4 WLAN Power-Up Sequence
      5. 5.12.5 Bluetooth-BLE Power-Up Sequence
      6. 5.12.6 WLAN SDIO Transport Layer
        1. 5.12.6.1 SDIO Timing Specifications
        2. 5.12.6.2 SDIO Switching Characteristics - High Rate
      7. 5.12.7 HCI UART Shared Transport Layers for All Functional Blocks (Except WLAN)
        1. 5.12.7.1 UART 4-Wire Interface - H4
      8. 5.12.8 Bluetooth Codec-PCM (Audio) Timing Specifications
  6. 6Detailed Description
    1. 6.1 WLAN
    2. 6.2 Bluetooth
    3. 6.3 BLE
    4. 6.4 WiLink 8 Module Markings
    5. 6.5 Test Grades
  7. 7Applications and Implementation
    1. 7.1 Application Information
      1. 7.1.1 Typical Application - WL1835MOD Reference Design
      2. 7.1.2 Design Recommendations
      3. 7.1.3 RF Trace and Antenna Layout Recommendations
      4. 7.1.4 Module Layout Recommendations
      5. 7.1.5 Thermal Board Recommendations
      6. 7.1.6 Baking and SMT Recommendations
        1. 7.1.6.1 Baking Recommendations
        2. 7.1.6.2 SMT Recommendations
  8. 8Device and Documentation Support
    1. 8.1 Device Support
      1. 8.1.1 Development Support
      2. 8.1.2 Device Support Nomenclature
    2. 8.2 Related Links
    3. 8.3 社区资源
    4. 8.4 商标
    5. 8.5 静电放电警告
    6. 8.6 术语表
  9. 9Mechanical Packaging and Orderable Information
    1. 9.1 TI Module Mechanical Outline
    2. 9.2 Packaging Information

封装选项

请参考 PDF 数据表获取器件具体的封装图。

机械数据 (封装 | 引脚)
  • MOC|100
散热焊盘机械数据 (封装 | 引脚)
订购信息

4 Terminal Configuration and Functions

Figure 4-1 shows the pin assignments for the 100-pin MOC package.

WL1835MOD_bottom_view_swrs152.gifFigure 4-1 100-Pin MOC Package (Bottom View)

Figure 4-2 shows the outline of the 100-pin MOC package.

WG7835-T0 Stencil_140710.gif
NOTE: 1. Module size: 13.4 x 13.3 mm
2. Pad size: 0.75 x 0.40 mm
3. Pitch: 0.7 mm
Figure 4-2 Outline of 100-Pin MOC Package

Figure 4-3 shows the outline of the recommended PCB pattern for the 100-pin MOC package.

WG7835-T0 PCB Pattern_140710.gifFigure 4-3 Outline of Recommended PCB Pattern for 100-Pin MOC Package

4.1 Pin Description

Table 4-1 describes the module pins.

Table 4-1 Pin Description

PIN NAME PIN TYPE/DIR SHUTDOWN STATE AFTER POWER UP(2) VOLTAGE LEVEL CONNECTIVITY(3) DESCRIPTION
1801 1805 1831 1835
Clocks and Reset SIgnals
WL_SDIO_CLK_1V8 8 I Hi-Z Hi-Z 1.8 V v v v v WLAN SDIO clock. Must be driven by the host.
EXT_32K 36 ANA – v v v v Input sleep clock: 32.768 kHz
WLAN_EN 40 I PD PD 1.8 V v v v v Mode setting: high = enable
BT_EN 41 I PD PD 1.8 V x x v v Mode setting: high = enable
Power-Management Signals
VIO_IN 38 POW PD PD 1.8 V v v v v Connect to 1.8-V external VIO
VBAT_IN 46 POW VBAT v v v v Power supply input, 2.9 to 4.8 V
VBAT_IN 47 POW VBAT v v v v Power supply input, 2.9 to 4.8 V
TI Reserved
GPIO11 2 I/O PD PD 1.8 V v v v v Reserved for future use. NC if not used.
GPIO9 3 I/O PD PD 1.8 V v v v v Reserved for future use. NC if not used.
GPIO10 4 I/O PU PU 1.8 V v v v v Reserved for future use. NC if not used.
GPIO12 5 I/O PU PU 1.8 V v v v v Reserved for future use. NC if not used.
RESERVED1 21 I PD PD 1.8 V x x x x Reserved for future use. NC if not used.
RESERVED2 22 I PD PD 1.8 V x x x x Reserved for future use. NC if not used.
GPIO4 25 I/O PD PD 1.8 V v v v v Reserved for future use. NC if not used.
RESERVED3 62 O PD PD 1.8 V x x x x Reserved for future use. NC if not used.
RESERVED 64 GND – v v v v Reserved for future use. NC if not used.
WLAN Functional Block: Int Signals
WL_SDIO_CMD_1V8 6 I/O Hi-Z Hi-Z 1.8 V v v v v WLAN SDIO command in(1)
WL_SDIO_D0_1V8 10 I/O Hi-Z Hi-Z 1.8 V v v v v WLAN SDIO data bit 0(1)
WL_SDIO_D1_1V8 11 I/O Hi-Z Hi-Z 1.8 V v v v v WLAN SDIO data bit 1(1)
WL_SDIO_D2_1V8 12 IO Hi-Z Hi-Z 1.8 V v v v v WLAN SDIO data bit 2(1)
WL_SDIO_D3_1V8 13 I/O Hi-Z PU 1.8 V v v v v WLAN SDIO data bit 3. Changes state to PU at WL_EN or BT_EN assertion for card detects. Later disabled by software during initialization. (1)
WL_IRQ_1V8 14 O PD 0 1.8 V v v v v SDIO available, interrupt out. Active high. (For WL_RS232_TX/RX pullup is at power up.) Set to rising edge (active high) on power up. The Wi-Fi interrupt line can be configured by the driver according to the IRQ configuration (polarity/level/edge).
GPIO2 26 I/O PD PD 1.8 V v v v v WL_RS232_RX (when WLAN_IRQ = 1 at power up)
2G4_ANT2_W 18 ANA – x v x v 2.4G ant2 TX, RX
GPIO1 27 I/O PD PD 1.8 V v v v v WL_RS232_TX (when WLAN_IRQ = 1 at power up)
2G4_ANT1_WB 32 ANA – v v v v 2.4G ant1 TX, RX
WL_UART_DBG 42 O PU PU 1.8 V v v v v Option: WLAN logger
Bluetooth Functional Block: Int Signals
BT_UART_DBG 43 O PU PU 1.8 V x x v v Option: Bluetooth logger
BT_HCI_RTS_1V8 50 O PU PU 1.8 V x x v v UART RTS to host. NC if not used.
BT_HCI_CTS_1V8 51 I PU PU 1.8 V x x v v UART CTS from host. NC if not used.
BT_HCI_TX_1V8 52 O PU PU 1.8 V x x v v UART TX to host. NC if not used.
BT_HCI_RX_1V8 53 I PU PU 1.8 V x x v v UART RX from host. NC if not used.
BT_AUD_IN 56 I PD PD 1.8 V x x v v Bluetooth PCM/I2S bus. Data in. NC if not used.
BT_AUD_OUT 57 O PD PD 1.8 V x x v v Bluetooth PCM/I2S bus. Data out. NC if not used.
BT_AUD_FSYNC 58 I/O PD PD 1.8 V x x v v Bluetooth PCM/I2S bus. Frame sync. NC if not used.
BT_AUD_CLK 60 I/O PD PD 1.8 V x x v v Bluetooth PCM/I2S bus. NC if not used.
Ground Pins
GND 1, 7, 9, 15, 16, 17, 19, 20, 23, 24, 28, 29, 30, 31, 33, 34, 35, 37, 39, 44, 45, 48, 49, 54, 55, 59, 61, 63, G1-G36 GND – v v v v
(1) Host must provide PU using a 10-K resistor for all non-CLK SDIO signals.
(2) PU = pullup; PD = pulldown.
(3) v = connect; x = no connect.