1. 1器件概述
    1. 1.1 特性
    2. 1.2 应用范围
    3. 1.3 说明
    4. 1.4 功能方框图
  2. 2修订历史记录
  3. 3Device Comparison
  4. 4Terminal Configuration and Functions
    1. 4.1 Pin Description
  5. 5Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  Handling Ratings
    3. 5.3  Power-On Hours (POH)
    4. 5.4  Recommended Operating Conditions
    5. 5.5  External Digital Slow Clock Requirements
    6. 5.6  Thermal Characteristics
    7. 5.7  WLAN Performance
      1. 5.7.1 WLAN 2.4-GHz Receiver Characteristics
      2. 5.7.2 WLAN 2.4-GHz Transmitter Power
      3. 5.7.3 WLAN Currents
    8. 5.8  Bluetooth Performance
      1. 5.8.1 Bluetooth BR, EDR Receiver Characteristics—In-Band Signals
      2. 5.8.2 Bluetooth Transmitter, BR
      3. 5.8.3 Bluetooth Transmitter, EDR
      4. 5.8.4 Bluetooth Modulation, BR
      5. 5.8.5 Bluetooth Modulation, EDR
    9. 5.9  Bluetooth LE Performance
      1. 5.9.1 Bluetooth LE Receiver Characteristics - In-Band Signals
      2. 5.9.2 Bluetooth LE Transmitter Characteristics
      3. 5.9.3 Bluetooth LE Modulation Characteristics
    10. 5.10 Bluetooth-BLE Dynamic Currents
    11. 5.11 Bluetooth LE Currents
    12. 5.12 Timing and Switching Characteristics
      1. 5.12.1 Power Management
        1. 5.12.1.1 Block Diagram - Internal DC2DCs
      2. 5.12.2 Power-Up and Shut-Down States
      3. 5.12.3 Chip Top-level Power-Up Sequence
      4. 5.12.4 WLAN Power-Up Sequence
      5. 5.12.5 Bluetooth-BLE Power-Up Sequence
      6. 5.12.6 WLAN SDIO Transport Layer
        1. 5.12.6.1 SDIO Timing Specifications
        2. 5.12.6.2 SDIO Switching Characteristics - High Rate
      7. 5.12.7 HCI UART Shared Transport Layers for All Functional Blocks (Except WLAN)
        1. 5.12.7.1 UART 4-Wire Interface - H4
      8. 5.12.8 Bluetooth Codec-PCM (Audio) Timing Specifications
  6. 6Detailed Description
    1. 6.1 WLAN
    2. 6.2 Bluetooth
    3. 6.3 BLE
    4. 6.4 WiLink 8 Module Markings
    5. 6.5 Test Grades
  7. 7Applications and Implementation
    1. 7.1 Application Information
      1. 7.1.1 Typical Application - WL1835MOD Reference Design
      2. 7.1.2 Design Recommendations
      3. 7.1.3 RF Trace and Antenna Layout Recommendations
      4. 7.1.4 Module Layout Recommendations
      5. 7.1.5 Thermal Board Recommendations
      6. 7.1.6 Baking and SMT Recommendations
        1. 7.1.6.1 Baking Recommendations
        2. 7.1.6.2 SMT Recommendations
  8. 8Device and Documentation Support
    1. 8.1 Device Support
      1. 8.1.1 Development Support
      2. 8.1.2 Device Support Nomenclature
    2. 8.2 Related Links
    3. 8.3 社区资源
    4. 8.4 商标
    5. 8.5 静电放电警告
    6. 8.6 术语表
  9. 9Mechanical Packaging and Orderable Information
    1. 9.1 TI Module Mechanical Outline
    2. 9.2 Packaging Information

封装选项

请参考 PDF 数据表获取器件具体的封装图。

机械数据 (封装 | 引脚)
  • MOC|100
散热焊盘机械数据 (封装 | 引脚)
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