ZHCSJQ1D November   2010  – April  2019 UCD90160

PRODUCTION DATA.  

  1. 1 特性
  2. 2 应用
  3. 3 说明
    1.     简化应用电路原理图
  4. 4 修订历史记录
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Requirements: I2C/SMBus/PMBus
    7. 6.7 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Rail Configuration
      2. 7.3.2 TI Fusion GUI
      3. 7.3.3 PMBus Interface
    4. 7.4 Device Functional Modes
      1. 7.4.1  Power-Supply Sequencing
        1. 7.4.1.1 Turn-on Sequencing
        2. 7.4.1.2 Turn-off Sequencing
        3. 7.4.1.3 Sequencing Configuration Options
      2. 7.4.2  Pin-Selected Rail States
      3. 7.4.3  Voltage Monitoring
      4. 7.4.4  Fault Responses and Alert Processing
      5. 7.4.5  Shut Down All Rails and Sequence On (Resequence)
      6. 7.4.6  GPIOs
      7. 7.4.7  GPO Control
      8. 7.4.8  GPO Dependencies
        1. 7.4.8.1 GPO Delays
        2. 7.4.8.2 State Machine Mode Enable
      9. 7.4.9  GPI Special Functions
      10. 7.4.10 Power-Supply Enables
      11. 7.4.11 Cascading Multiple Devices
      12. 7.4.12 PWM Outputs
        1. 7.4.12.1 FPWM1-8
        2. 7.4.12.2 PWM1-4
      13. 7.4.13 Programmable Multiphase PWMs
      14. 7.4.14 Margining
        1. 7.4.14.1 Open-Loop Margining
        2. 7.4.14.2 Closed-Loop Margining
      15. 7.4.15 System Reset Signal
      16. 7.4.16 Watch Dog Timer
      17. 7.4.17 Run Time Clock
      18. 7.4.18 Data and Error Logging to Flash Memory
      19. 7.4.19 Brownout Function
      20. 7.4.20 PMBus Address Selection
    5. 7.5 Programming
      1. 7.5.1 Device Configuration and Programming
        1. 7.5.1.1 Full Configuration Update While in Normal Mode
      2. 7.5.2 JTAG Interface
      3. 7.5.3 Internal Fault Management and Memory Error Correction (ECC)
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curves
      4. 8.2.4 Estimating ADC Reporting Accuracy
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11器件和文档支持
    1. 11.1 器件支持
      1. 11.1.1 第三方产品免责声明
    2. 11.2 文档支持
      1. 11.2.1 相关文档
    3. 11.3 社区资源
    4. 11.4 商标
    5. 11.5 静电放电警告
    6. 11.6 Glossary
  12. 12机械、封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

6.4 Thermal Information

THERMAL METRIC(1) UCD90160 UNIT
RGC [VQFN]
64 PINS
RθJA Junction-to-ambient thermal resistance 26.4 °C/W
RθJC(top) Junction-to-case(top) thermal resistance 21.2 °C/W
RθJB Junction-to-board thermal resistance 1.7 °C/W
ψJT Junction-to-top characterization parameter 0.7 °C/W
ψJB Junction-to-board characterization parameter 8.8 °C/W
RθJC(bot) Junction-to-case(bottom) thermal resistance 1.7 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953.