ZHCSOV0E March   2005  – November 2021 UCD7100

PRODUCTION DATA  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 Revision History
  5. 5 说明（续）
  6. 6 Device Comparison Table
  7. 7 Pin Configuration and Functions
  8. 8 Specifications
    1. 8.1 Absolute Maximum Ratings
    2. 8.2 Handling Ratings
    3. 8.3 Recommended Operating Conditions
    4. 8.4 Thermal Information
    5. 8.5 Electrical Characteristics
    6. 8.6 Typical Characteristics
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1 Input
      2. 9.3.2 Current Sensing and Protection
      3. 9.3.3 Handshaking
      4. 9.3.4 Driver Output
      5. 9.3.5 Source/Sink Capabilities During Miller Plateau
      6. 9.3.6 Drive Current and Power Requirements
    4. 9.4 Device Functional Modes
      1. 9.4.1 Operation with VDD < 4.25 V (minimum VDD)
      2. 9.4.2 Operation with IN Pin Open
      3. 9.4.3 Operation with ILIM Pin Open
      4. 9.4.4 Operation with ILIM Pin High
  10. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Application
      1. 10.2.1 Design Requirements
      2. 10.2.2 Detailed Design Procedure
      3. 10.2.3 Application Curve
  11. 11Power Supply Recommendations
    1. 11.1 Supply
    2. 11.2 Reference and External Bias Supply
  12. 12Layout
    1. 12.1 Layout Guidelines
    2. 12.2 Layout Example
    3. 12.3 Thermal Considerations
  13. 13Device and Documentation Support
    1. 13.1 Device Support
      1. 13.1.1 Development Support
    2. 13.2 第三方产品免责声明
    3. 13.3 Documentation Support
      1. 13.3.1 Related Documentation
    4. 13.4 Receiving Notification of Documentation Updates
    5. 13.5 支持资源
    6. 13.6 Trademarks
    7. 13.7 术语表
    8. 13.8 Electrostatic Discharge Caution
  14. 14Mechanical, Packaging, and Orderable Information

封装选项

请参考 PDF 数据表获取器件具体的封装图。

机械数据 (封装 | 引脚)
  • PWP|14
散热焊盘机械数据 (封装 | 引脚)
订购信息

8.4 Thermal Information

THERMAL METRIC(1)UCD7100UNIT
HTSSOP
14 PINS
RθJAJunction-to-ambient thermal resistance44.3°C/W
RθJC(top)Junction-to-case (top) thermal resistance35.3
RθJBJunction-to-board thermal resistance29.6
ψJTJunction-to-top characterization parameter1.5
ψJBJunction-to-board characterization parameter29.3
RθJC(bot)Junction-to-case (bottom) thermal resistance4.7
(1) For more information about traditional and new thermal metrics, see the application report, IC Package Thermal Metrics Application Report.