SLUS704C FEBRUARY   2007  – December 2014 UCC27423-EP , UCC27424-EP

PRODUCTION DATA.  

  1. Features
  2. Applications
  3. Description
  4. Revision History
  5. Pin Configuration and Functions
  6. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Power Dissipation Ratings
    6. 6.6 Electrical Characteristics
    7. 6.7 Typical Characteristics
  7. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Input Stage
      2. 7.3.2 Output Stage
      3. 7.3.3 Operational Waveforms and Circuit Layout
      4. 7.3.4 VDD
      5. 7.3.5 Enable
    4. 7.4 Device Functional Modes
  8. Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Source/Sink Capabilities During Miller Plateau
        2. 8.2.2.2 Parallel Outputs
      3. 8.2.3 Application Curve
  9. Power Supply Recommendations
    1. 9.1 Drive Current and Power Requirements
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
    3. 10.3 Thermal Considerations
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Development Support
    2. 11.2 Documentation Support
      1. 11.2.1 Related Documentation
    3. 11.3 Related Links
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

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6 Specifications

6.1 Absolute Maximum Ratings(1)(2)

over operating free-air temperature range (unless otherwise noted)
MN MAX UNIT
VDD Supply voltage –0.3 16 V
Output current OUTA, OUTB DC, IOUT_DC 0.2 A
Pulsed (0.5 μs), IOUT_PULSED 4.5
VIN Input voltage INA, INB –5 6 or VDD + 0.3(3) V
Enable voltage ENBA, ENBB –0.3 6 or VDD + 0.3(3) V
Power dissipation at TA = 25°C D package 650 mW
DGN package 3 W
TJ Junction operating temperature –55 150 °C
Lead temperature (soldering, 10 s) 300 °C
Tstg Storage temperature –65 150 °C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltages are with respect to GND. Currents are positive into and negative out of the specified terminal.
(3) Whichever is larger

6.2 ESD Ratings

VALUE UNIT
V(ESD) Electrostatic discharge Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all pins(1) ±4000 V
Charged device model (CDM), per JEDEC specification JESD22-C101, all pins(2) ±1000
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)
MIN MAX UNIT
TJ Operating junction temperature –55 125 °C

6.4 Thermal Information

THERMAL METRIC(1) UCC27423-EP UCC27424-EP UNIT
D DGN
8 PINS
RθJA Junction-to-ambient thermal resistance 111.4 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 70.8
RθJB Junction-to-board thermal resistance 56.6
ψJT Junction-to-top characterization parameter 10.9
ψJB Junction-to-board characterization parameter 56.1
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

6.5 Power Dissipation Ratings

PACKAGE SUFFIX RθJC
(°C/W)
RθJA
(°C/W)
POWER RATING
(mW)
TA = 70°C
DERATING FACTOR ABOVE 70°C (mW/°C)
MSOP-8 PowerPAD(3) DGN 4.7 50 to 59 1370(1) 17.1(1)
SOIC 8 D 42 84 to 160 344 to 655(2)(4) 6.25 to 11.9(2)(4)
(1) 150°C operating junction temperature is used for power-rating calculations.
(2) The range of values indicates the effect of PCB. These values are intended to give the system designer an indication of the best- and worst-case conditions. In general, the system designer should attempt to use larger traces on the PCB where possible, in order to spread the heat away from the device more effectively. For information on the PowerPAD package, refer to technical brief, PowerPad™ Thermally-Enhanced Package, SLMA002, and application brief, PowerPad™ Made Easy, SLMA004.
(3) The PowerPAD package is not directly connected to any leads of the package. However, it is electrically and thermally connected to the substrate, which is the ground of the device.
(4) 125°C operating junction temperature is used for power-rating calculation.

6.6 Electrical Characteristics

VDD = 4.5 V to 15 V, TA = –55°C to 125°C, TA = TJ (unless otherwise noted)
PARAMETER TEST CONDITIONS UCC27423 UCC27424 UNIT
MIN TYP MAX MIN TYP MAX
INPUT (INA, INB)
VIN_H Logic 1 input threshold 2 2 V
VIN_L Logic 0 input threshold 1 1 V
Input current 0 V ≤ VIN ≤ VDD –10 0 10 –10 0 10 μA
OUTPUT (OUTA, OUTB)
Output current VDD = 14 V(1)(2) 4 4 A
VOH High-level output voltage VOH = VDD  – VOUT, IOUT  = –10 mA 330 450 330 450 mV
VOL Low-level output level IOUT  = 10 mA 22 40 22 40 mV
Output resistance high IOUT  = –10 mA, VDD = 14 V(3) TA = 25°C 25 30 35 25 30 35 Ω
TA = full range 14 45 18 45
Output resistance low IOUT  = –10 mA, VDD = 14 V(3) TA = 25°C 1.9 2.2 2.5 1.9 2.2 2.5 Ω
TA = full range 0.95 4 1.2 4
Latch-up protection(1) 500 500 mA
SWITCHING TIME
tR Rise time (OUTA, OUTB) CLOAD = 1.8 nF(1) 20 40 20 40 ns
tF Fall time (OUTA, OUTB) CLOAD = 1.8 nF(1) 15 40 15 40 ns
tD1 Delay, IN rising (IN to OUT) CLOAD = 1.8 nF(1) 35 55 35 50 ns
tD2 Delay, IN falling (IN to OUT) CLOAD = 1.8 nF(1) 25 60 25 45 ns
ENABLE (ENBA, ENBB)
VIN_H High-level input voltage Low-to-high transition 1.7 2.4 3.1 1.7 2.4 2.9 V
VIN_L Low-level input voltage High-to-low transition 1.1 1.8 2.3 1.1 1.8 2.2 V
Hysteresis 0.13 0.55 1.1 .10 0.55 0.9 V
RENBL Enable impedance VDD = 14 V, ENBL = GND 75 100 160 75 100 140
tD3 Propagation delay time(4) CLOAD = 1.8 nF(1) 30 60 30 60 ns
tD4 Propagation delay time(4) CLOAD = 1.8 nF(1) 100 150 100 150 ns
OVERALL
IDD Static operating current,
VDD = 15 V,
ENBA =
ENBB = 15 V
INA = 0 V INB = 0 V 900 1350 300 450 μA
INB = High 750 1100 750 1100
INA = HIGH INB = 0 V 750 1100 750 1100
INB = High 600 900 1200 1800
Disabled,
VDD = 15 V,
ENBA =
ENBB = 0 V
INA = 0 V INB = 0 V 300 450 300 450
INA = High 450 700 450 700
INA = HIGH INB = 0 V 450 700 450 700
INB = High 600 900 600 900
(1) Specified by design. Not tested in production.
(2) The pullup/pulldown circuits of the driver are bipolar and MOSFET transistors in parallel. The pulsed output current rating is the combined current from the bipolar and MOSFET transistors.
(3) The pullup/pulldown circuits of the driver are bipolar and MOSFET transistors in parallel. The output resistance is the RDS(ON) of the MOSFET transistor when the voltage on the driver output is less than the saturation voltage of the bipolar transistor.
(4) See Figure 2.
swdriver_lus704.gif
A. The 10% and 90% thresholds depict the dynamics of the bipolar output devices that dominate the power MOSFET transition through the Miller regions of operation.
Figure 1. Switching Waveforms for (a) Inverting Driver and (b) Noninverting Driver
swenable_lus704.gif
A. The 10% and 90% thresholds depict the dynamics of the bipolar output devices that dominate the power MOSFET transition through the Miller regions of operation.
Figure 2. Switching Waveform for Enable to Output
grp1x.gif
A. See data sheet for absolute maximum and minimum recommended operating conditions.
B. Silicon operating life design goal is 10 years at 105°C junction temperature (does not include package interconnect life).
C. Enhanced plastic product disclaimer applies
Figure 3. UCC27424MDGNREP Operating Life Derating Chart

6.7 Typical Characteristics

typ7_lus704.gif
Figure 4. Supply Current vs Frequency (VDD = 4.5 V)
typ9_lus704.gif
Figure 6. Supply Current vs Frequency (VDD = 12 V)
typ11_lus704.gif
Figure 8. Supply Current vs Supply Voltage
(CLOAD = 2.2 nF)
typ13_lus704.gif
Figure 10. Supply Current vs Supply Voltage
typ15a_lus704.gif
Figure 12. Fall Time vs Supply Voltage
typ17_lus704.gif
Figure 14. Enable Resistance vs Temperature
typ19_lus704.gif
IN = GND ENBL = VDD
Figure 16. Output Behavior vs Supply Voltage (Inverting)
typ21_lus704.gif
IN = VDD ENBL = VDD
Figure 18. Output Behavior vs VDD (Inverting)
typ23_lus704.gif
IN = VDD ENBL = VDD
Figure 20. Output Behavior vs VDD (Noninverting)
typ25_lus704.gif
IN = GND ENBL = VDD
Figure 22. Output Behavior vs VDD (Noninverting)
typ8_lus704.gif
Figure 5. Supply Current vs Frequency (VDD = 8 V)
typ10_lus704.gif
Figure 7. Supply Current vs Frequency (VDD = 15 V)
typ12_lus704.gif
Figure 9. Supply Current vs Supply Voltage
(CLOAD = 4.7 nF)
typ14a_lus704.gif
Figure 11. Rise Time vs Supply Voltage
typ16_lus704.gif
Figure 13. Enable Threshold and Hysteresis vs Temperature
typ18_lus704.gif
IN = GND ENBL = VDD
Figure 15. Output Behavior vs Supply Voltage (Inverting)
typ20_lus704.gif
IN = VDD ENBL = VDD
Figure 17. Output Behavior vs VDD (Inverting)
typ22_lus704.gif
IN = VDD ENBL = VDD
Figure 19. Output Behavior vs VDD (Noninverting)
typ24_lus704.gif
IN = GND ENBL = VDD
Figure 21. Output Behavior vs VDD (Noninverting)
typ26_lus704.gif
Figure 23. Input Threshold vs Temperature