ZHCSOI8A November   2021  – March 2022 TXU0202

PRODUCTION DATA  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 Revision History
  5. 5 Related Products
  6. 6 Pin Configuration and Functions—TXU0202
  7. 7 Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  Recommended Operating Conditions
    4. 7.4  Thermal Information
    5. 7.5  Electrical Characteristics
    6. 7.6  Switching Characteristics, VCCA = 1.2 ± 0.1 V
    7. 7.7  Switching Characteristics, VCCA = 1.5 ± 0.1 V
    8. 7.8  Switching Characteristics, VCCA = 1.8 ± 0.15 V
    9. 7.9  Switching Characteristics, VCCA = 2.5 ± 0.2 V
    10. 7.10 Switching Characteristics, VCCA = 3.3 ± 0.3 V
    11. 7.11 Switching Characteristics, VCCA = 5.0 ± 0.5 V
    12. 7.12 Operating Characteristics
    13. 7.13 Typical Characteristics
  8. 8 Parameter Measurement Information
    1. 8.1 Load Circuit and Voltage Waveforms
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1 CMOS Schmitt-Trigger Inputs with Integrated Pulldowns
        1. 9.3.1.1 Inputs with Integrated Static Pull-Down Resistors
      2. 9.3.2 Control Logic (OE) with VCC(MIN) Circuitry
      3. 9.3.3 Balanced High-Drive CMOS Push-Pull Outputs
      4. 9.3.4 VCC Isolation and VCC Disconnect
      5. 9.3.5 Over-Voltage Tolerant Inputs
      6. 9.3.6 Glitch-Free Power Supply Sequencing
      7. 9.3.7 Negative Clamping Diodes
      8. 9.3.8 Fully Configurable Dual-Rail Design
      9. 9.3.9 Supports High-Speed Translation
    4. 9.4 Device Functional Modes
  10. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Application
      1. 10.2.1 Design Requirements
      2. 10.2.2 Detailed Design Procedure
      3. 10.2.3 Application Curve
  11. 11Power Supply Recommendations
  12. 12Layout
    1. 12.1 Layout Guidelines
    2. 12.2 Layout Example
  13. 13Device and Documentation Support
    1. 13.1 Device Support
      1. 13.1.1 Regulatory Requirements
    2. 13.2 Documentation Support
      1. 13.2.1 Related Documentation
    3. 13.3 接收文档更新通知
    4. 13.4 支持资源
    5. 13.5 Trademarks
    6. 13.6 Electrostatic Discharge Caution
    7. 13.7 术语表
  14. 14Mechanical, Packaging, and Orderable Information

封装选项

请参考 PDF 数据表获取器件具体的封装图。

机械数据 (封装 | 引脚)
  • DCU|8
  • DTM|8
  • DTT|8
散热焊盘机械数据 (封装 | 引脚)
订购信息

12.1 Layout Guidelines

To ensure reliability of the device, following common printed-circuit board layout guidelines are recommended:

  • Use bypass capacitors on the power supply pins and place them as close to the device as possible. A 0.1 µF capacitor is recommended, but transient performance can be improved by having 1 µF and 0.1 µF capacitors in parallel as bypass capacitors.
  • The high drive capability of this device creates fast edges into light loads so routing and load conditions should be considered to prevent ringing.