ZHCSIV6A September   2018  – December 2018 TVS2701

PRODUCTION DATA.  

  1. 特性
  2. 应用
  3. 说明
    1.     Device Images
      1.      对 8/20µs 浪涌事件的电压钳位响应
      2.      功能方框图
  4. 修订历史记录
  5. Device Comparison Table
  6. Pin Configuration and Functions
    1.     Pin Functions
  7. Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings - JEDEC
    3. 7.3 ESD Ratings - IEC
    4. 7.4 Recommended Operating Conditions
    5. 7.5 Thermal Information
    6. 7.6 Electrical Characteristics
    7. 7.7 Typical Characteristics
  8. Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
    4. 8.4 Device Functional Modes
      1. 8.4.1 Protection Specifications
      2. 8.4.2 Reliability Testing
      3. 8.4.3 Zero Derating
      4. 8.4.4 Bidirectional Operation
      5. 8.4.5 Transient Performance
  9. Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12器件和文档支持
    1. 12.1 文档支持
      1. 12.1.1 相关文档
    2. 12.2 接收文档更新通知
    3. 12.3 社区资源
    4. 12.4 商标
    5. 12.5 静电放电警告
    6. 12.6 术语表
  13. 13机械、封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

Layout Guidelines

The optimum placement is close to the connector. EMI during an ESD event can couple from the tested trace to other nearby unprotected traces, which could result in system failures. The PCB designer must minimize the possibility of EMI coupling by keeping all unprotected traces away from protected traces between the TVS and the connector. Route the protected traces straight. Use rounded corners with the largest radii possible to eliminate any sharp corners on the protected traces between the TVS2701 and the connector. Electric fields tend to build up on corners, which could increase EMI coupling.

Ensure that the thermal pad on the layout is floating rather than grounded. Grounding the thermal pad will impede the operating range of the TVS2701, and can cause failures when the applied voltage is negative. A floating thermal pad allows the maximum operating range without sacrificing any transient performance.