ZHCSGC7 April   2017 TUSB8044

PRODUCTION DATA.  

  1. 特性
  2. 应用
  3. 说明
  4. 修订历史记录
  5. 说明 (续)
  6. Pin Configuration and Functions
  7. Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics, 3.3-V I/O
    6. 7.6 Timing Requirements, Power-Up
    7. 7.7 Hub Input Supply Current
  8. Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Battery Charging Features
      2. 8.3.2 USB Power Management
      3. 8.3.3 I2C Programming Support Using Internal Hid to I2C Interface
        1. 8.3.3.1 SET REPORT (Output)
        2. 8.3.3.2 GET REPORT (Feature)
        3. 8.3.3.3 GET REPORT (Input)
      4. 8.3.4 USB2.0 Billboard
      5. 8.3.5 One Time Programmable (OTP) Configuration
      6. 8.3.6 Clock Generation
      7. 8.3.7 Crystal Requirements
      8. 8.3.8 Input Clock Requirements
      9. 8.3.9 Power-Up and Reset
    4. 8.4 Device Functional Modes
      1. 8.4.1 External Configuration Interface
      2. 8.4.2 I2C EEPROM Operation
      3. 8.4.3 Port Configuration
      4. 8.4.4 SMBus Slave Operation
    5. 8.5 Register Maps
      1. 8.5.1  Configuration Registers
      2. 8.5.2  ROM Signature Register
      3. 8.5.3  Vendor ID LSB Register
      4. 8.5.4  Vendor ID MSB Register
      5. 8.5.5  Product ID LSB Register
      6. 8.5.6  Product ID MSB Register
      7. 8.5.7  Device Configuration Register
      8. 8.5.8  Battery Charging Support Register
      9. 8.5.9  Device Removable Configuration Register
      10. 8.5.10 Port Used Configuration Register
      11. 8.5.11 Device Configuration Register 2
      12. 8.5.12 USB 2.0 Port Polarity Control Register
      13. 8.5.13 UUID Registers
      14. 8.5.14 Language ID LSB Register
      15. 8.5.15 Language ID MSB Register
      16. 8.5.16 Serial Number String Length Register
      17. 8.5.17 Manufacturer String Length Register
      18. 8.5.18 Product String Length Register
      19. 8.5.19 Device Configuration Register 3
      20. 8.5.20 USB 2.0 Only Port Register
      21. 8.5.21 Billboard SVID LSB
      22. 8.5.22 Billboard SVID MSB
      23. 8.5.23 Billboard PID LSB
      24. 8.5.24 Billboard PID MSB
      25. 8.5.25 Billboard Configuration
      26. 8.5.26 Billboard String1 Length
      27. 8.5.27 Billboard String2 Length
      28. 8.5.28 Serial Number String Registers
      29. 8.5.29 Manufacturer String Registers
      30. 8.5.30 Product String Registers
      31. 8.5.31 Additional Feature Configuration Register
      32. 8.5.32 SMBus Device Status and Command Register
      33. 8.5.33 Billboard String1_2
  9. Applications and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Discrete USB Hub Product
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
          1. 9.2.1.2.1  Upstream Port Implementation
          2. 9.2.1.2.2  Downstream Port 1 Implementation
          3. 9.2.1.2.3  Downstream Port 2 Implementation
          4. 9.2.1.2.4  Downstream Port 3 Implementation
          5. 9.2.1.2.5  Downstream Port 4 Implementation
          6. 9.2.1.2.6  VBUS Power Switch Implementation
          7. 9.2.1.2.7  PD Controller and EEPROM Implementation
          8. 9.2.1.2.8  DisplayPort Implementation
          9. 9.2.1.2.9  Clock, Reset, and Misc
          10. 9.2.1.2.10 TUSB8044 Power Implementation
        3. 9.2.1.3 Application Curves
  10. 10Power Supply Recommendations
    1. 10.1 TUSB8044 Power Supply
    2. 10.2 Downstream Port Power
    3. 10.3 Ground
  11. 11Layout
    1. 11.1 Layout Guidelines
      1. 11.1.1 Placement
      2. 11.1.2 Package Specific
      3. 11.1.3 Differential Pairs
    2. 11.2 Layout Examples
      1. 11.2.1 Upstream Port
      2. 11.2.2 Downstream Port
  12. 12器件和文档支持
    1. 12.1 接收文档更新通知
    2. 12.2 社区资源
    3. 12.3 商标
    4. 12.4 静电放电警告
    5. 12.5 Glossary
  13. 13机械、封装和可订购信息

封装选项

请参考 PDF 数据表获取器件具体的封装图。

机械数据 (封装 | 引脚)
  • RGC|64
散热焊盘机械数据 (封装 | 引脚)
订购信息

器件和文档支持

接收文档更新通知

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社区资源

The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use.

    TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers.
    Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and contact information for technical support.

商标

E2E is a trademark of Texas Instruments.

All other trademarks are the property of their respective owners.

静电放电警告

esds-image

这些装置包含有限的内置 ESD 保护。 存储或装卸时,应将导线一起截短或将装置放置于导电泡棉中,以防止 MOS 门极遭受静电损伤。

Glossary

SLYZ022TI Glossary.

This glossary lists and explains terms, acronyms, and definitions.