ZHCSB24F
May 2013 – August 2018
TS3DV642
PRODUCTION DATA.
1
特性
2
应用
3
说明
Device Images
简化原理图
4
修订历史记录
5
Pin Configuration and Functions
Pin Functions
6
Specifications
6.1
Absolute Maximum Ratings
6.2
ESD Ratings
6.3
Recommended Operating Conditions
6.4
Thermal Information
6.5
Electrical Characteristics
6.6
Dynamic Characteristics
6.7
Switching Characteristics
6.8
Typical Characteristics
7
Parameter Measurement Information
8
Detailed Description
8.1
Overview
8.2
Functional Block Diagram
8.3
Feature Description
8.4
Device Functional Modes
9
Application and Implementation
9.1
Application Information
9.2
Typical Application
9.2.1
Display Port (DP) Application
9.2.1.1
Design Requirements
9.2.1.2
Detailed Design Procedure
9.2.1.3
Application Curves
9.2.2
Docking Application
9.2.2.1
Design Requirements
9.2.2.2
Detailed Design Procedure
9.2.2.3
Application Curves
9.2.3
HDMI Application
9.2.3.1
Design Requirements
9.2.3.2
Detailed Design Procedure
9.2.3.3
Application Curves
10
Power Supply Recommendations
11
Layout
11.1
Layout Guidelines
11.2
Layout Example
12
器件和文档支持
12.1
接收文档更新通知
12.2
社区资源
12.3
商标
12.4
静电放电警告
12.5
术语表
13
机械、封装和可订购信息
封装选项
机械数据 (封装 | 引脚)
RUA|42
MPQF210D
散热焊盘机械数据 (封装 | 引脚)
RUA|42
QFND142D
订购信息
zhcsb24f_oa
zhcsb24f_pm
6.2
ESD Ratings
VALUE
UNIT
V
(ESD)
Electrostatic discharge
Human body model (HBM), per ANSI/ESDA/JEDEC JS-001,
(1)
±2000
V
Charged device model (CDM), per JEDEC specification JESD22-C101,
(2)
±1000
(1)
JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2)
JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.