ZHCSOW9C october   2022  – july 2023 TPSM82912 , TPSM82913 , TPSM82913E

PRODUCTION DATA  

  1.   1
  2. 特性
  3. 应用
  4. 说明
  5. Revision History
  6. Pin Configuration and Functions
  7. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  8. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  Smart Config (S-CONF)
      2. 7.3.2  Device Enable (EN/SYNC)
      3. 7.3.3  Device Synchronization (EN/SYNC)
      4. 7.3.4  Spread Spectrum Modulation
      5. 7.3.5  Output Discharge
      6. 7.3.6  Undervoltage Lockout (UVLO)
      7. 7.3.7  Power-Good Output
      8. 7.3.8  Noise Reduction and Soft-Start Capacitor (NR/SS)
      9. 7.3.9  Current Limit and Short-Circuit Protection
      10. 7.3.10 Thermal Shutdown
    4. 7.4 Device Functional Modes
      1. 7.4.1 Fixed Frequency Pulse Width Modulation
      2. 7.4.2 Low Duty Cycle Operation
      3. 7.4.3 High Duty Cycle Operation (100% Duty Cycle)
      4. 7.4.4 Second Stage L-C Filter Compensation (Optional)
  9. Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Applications
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Custom Design With WEBENCH® Tools
        2. 8.2.2.2 External Component Selection
          1. 8.2.2.2.1 Switching Frequency Selection
          2. 8.2.2.2.2 Output Capacitor Selection
          3. 8.2.2.2.3 Ferrite Bead Selection for Second L-C Filter
          4. 8.2.2.2.4 Input Capacitor Selection
          5. 8.2.2.2.5 Setting the Output Voltage
          6. 8.2.2.2.6 NR/SS Capacitor Selection
      3. 8.2.3 Application Curves
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. Device and Documentation Support
    1. 9.1 Device Support
      1. 9.1.1 第三方产品免责声明
      2. 9.1.2 Development Support
        1. 9.1.2.1 Custom Design With WEBENCH® Tools
    2. 9.2 Documentation Support
      1. 9.2.1 Related Documentation
    3. 9.3 接收文档更新通知
    4. 9.4 支持资源
    5. 9.5 Trademarks
    6. 9.6 静电放电警告
    7. 9.7 术语表
  11. 10Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

Layout Guidelines

A proper layout is critical for the operation of any switched mode power supply, especially at high switching frequencies. Therefore, the PCB layout of the TPSM8291x demands careful attention to ensure best performance. A poor layout can lead to issues like bad line and load regulation, instability, increased EMI radiation, and noise sensitivity. Refer to the Five Steps to a Great PCB Layout for a Step-Down Converter technical brief for a detailed discussion of general best practices. Specific recommendations for the device are listed below.

  • The TPSM8291x has an integrated input capacitor. However, placement of the input capacitors must be placed as close as possible to the VIN and PGND pins of the device. Route the input capacitors directly to the VIN and PGND pins avoiding vias.
  • Place the output capacitor ground close to the PGND pin and route it directly avoiding vias.
  • Sensitive traces, such as the connections to the NR/SS and FB pins must be connected with short traces and be routed away from any noise source.
  • Connect the PSNS pin directly to the system GND plane with a via.
  • The SW pin must not be connected and must be left floating. If the pin is soldered to PCB copper, the pour needs to be as small as possible with no inner layer connections. The pin is provided for probing the internal SW only, and not to be connected to any external component, as shown on the EVM.
  • Place the second L-C filter, Lf and Cf, near the load to reduce any radiated coupling around the second L-C filter
  • Place the FB resistors, R1 and R2, close to the FB pin and route the VOUT connection from R1 to the load as a remote sense trace. If a second L-C filter is used, this connection must be made after Lf.
  • The recommended layout is implemented on the EVM and shown in the EVM user's guide.