ZHCSNI2 September   2021 TPSM560R6H

PRODUCTION DATA  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics (VIN = 12 V)
    7. 6.7 Typical Characteristics (VIN = 24 V)
    8. 6.8 Typical Characteristics (VIN = 48 V)
    9. 6.9 Typical Characteristics (VIN = 60 V)
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Adjustable Output Voltage (FB)
      2. 7.3.2 Minimum Input Capacitance
      3. 7.3.3 Minimum Output Capacitance
      4. 7.3.4 Precision Enable (EN), Undervoltage Lockout (UVLO), and Hysteresis (HYS)
      5. 7.3.5 Power Good (PGOOD)
      6. 7.3.6 Overcurrent Protection (OCP)
      7. 7.3.7 Thermal Shutdown
    4. 7.4 Device Functional Modes
      1. 7.4.1 Active Mode
      2. 7.4.2 Standby Mode
      3. 7.4.3 Shutdown Mode
  8. 8 Applications and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Custom Design With WEBENCH® Tools
        2. 8.2.2.2 Output Voltage Setpoint
        3. 8.2.2.3 Input Capacitor Selection
        4. 8.2.2.4 Output Capacitor Selection
        5. 8.2.2.5 Power-Good Signal
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
      1. 10.2.1 Theta JA Versus PCB Area
      2. 10.2.2 Package Specifications
      3. 10.2.3 EMI
        1. 10.2.3.1 EMI Plots
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 第三方产品免责声明
      2. 11.1.2 Development Support
        1. 11.1.2.1 Custom Design With WEBENCH® Tools
    2. 11.2 Documentation Support
      1. 11.2.1 Related Documentation
    3. 11.3 接收文档更新通知
    4. 11.4 支持资源
    5. 11.5 Trademarks
    6. 11.6 Electrostatic Discharge Caution
    7. 11.7 术语表
  12. 12Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

1 特性

  • 提供功能安全
  • 5.0mm × 5.5mm × 4.0mm 增强型 HotRod™ QFN
    • 出色的热性能：在 85°C 且无散热的情况下高达 9.6W 的输出功率
    • 标准封装尺寸：单个大型散热焊盘和所有引脚均分布在封装外围
  • 专为可靠耐用的应用而设计
    • 宽输入电压范围：4.2V 至 60V
    • 高达 66V 的输入电压瞬态保护
    • 工作结温范围：–40°C 至 +125°C
  • 固定 1MHz 开关频率
  • FPWM 运行模式
  • 针对超低 EMI 要求进行了优化
  • 26µA 非开关静态电流
  • 单调启动至预偏置输出
  • 无环路补偿或自举组件
  • 具有迟滞功能的精密使能和输入 UVLO
  • 具有迟滞功能的热关断保护
  • 使用 TPSM560R6H 并借助 WEBENCH® Power Designer 创建定制设计