ZHCSDM3D October   2014  – June 2019 TPS82084 , TPS82085

PRODUCTION DATA.  

  1. 1 特性
  2. 2 应用
  3. 3 说明
    1.     Device Images
      1.      1.8V 输出应用
      2.      1.8V 输出效率
  4. 4 修订历史记录
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommend Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Power Save Mode (PSM)
      2. 7.3.2 Low Dropout Operation (100% Duty Cycle)
      3. 7.3.3 Soft Startup
      4. 7.3.4 Switch Current Limit and Short Circuit Protection (Hiccup-Mode)
      5. 7.3.5 Undervoltage Lockout
      6. 7.3.6 Thermal Shutdown
    4. 7.4 Device Functional Modes
      1. 7.4.1 Enable and Disable
      2. 7.4.2 Power Good Output
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Applications
      1. 8.2.1 1.2-V Output Application
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
          1. 8.2.1.2.1 Setting the Output Voltage
          2. 8.2.1.2.2 Input and Output Capacitor Selection
        3. 8.2.1.3 Application Performance Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
    3. 10.3 Thermal Consideration
  11. 11器件和文档支持
    1. 11.1 器件支持
      1. 11.1.1 第三方产品免责声明
    2. 11.2 相关链接
    3. 11.3 社区资源
    4. 11.4 商标
    5. 11.5 静电放电警告
    6. 11.6 Glossary
  12. 12机械、封装和可订购信息
    1. 12.1 Tape and Reel Information

封装选项

请参考 PDF 数据表获取器件具体的封装图。

机械数据 (封装 | 引脚)
  • SIL|8
散热焊盘机械数据 (封装 | 引脚)
订购信息

10.3 Thermal Consideration

The TPS82084/5's output current needs to be derated when the device operates in a high ambient temperature or deliver high output power. The amount of current derated is dependent upon the input voltage, output power, PCB layout design and environmental thermal condition.

The TPS82084/5 module temperature must be kept less than the maximum rating of 125°C. Three basic approaches for enhancing thermal performance are listed below:

  • Improve the power dissipation capability of the PCB design.
  • Improve the thermal coupling of the component to the PCB.
  • Introduce airflow into the system.

To estimate approximate module temperature of TPS82084/5, apply the typical efficiency stated in this datasheet to the desired application condition for the module power dissipation, then calculate the module temperature rise by multiplying the power dissipation by its thermal resistance. For more details on how to use the thermal parameters in real applications, see the application notes: SZZA017 and SPRA953.