ZHCSBQ0B July   2013  – March 2015 TPS7A3501

PRODUCTION DATA.  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 修订历史记录
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Power Filter Operation
      2. 7.3.2 Minimum Load
      3. 7.3.3 Shutdown
      4. 7.3.4 Internal Current Limit
      5. 7.3.5 Reverse Current
      6. 7.3.6 Undervoltage Lockout (UVLO)
      7. 7.3.7 Thermal Protection
    4. 7.4 Device Functional Modes
      1. 7.4.1 Normal Operation
      2. 7.4.2 Disabled
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Adjustable Voltage Drop
        2. 8.2.2.2 Input and Output Capacitor Requirements
        3. 8.2.2.3 Output Noise
        4. 8.2.2.4 Power-Supply Rejection Ratio (PSRR)
        5. 8.2.2.5 Start-up
        6. 8.2.2.6 Transient Response
      3. 8.2.3 Application Curves
    3. 8.3 Do's and Don'ts
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
    3. 10.3 Power Dissipation
    4. 10.4 Estimating Junction Temperature
  11. 11器件和文档支持
    1. 11.1 器件支持
      1. 11.1.1 开发支持
        1. 11.1.1.1 评估模块
        2. 11.1.1.2 Spice 模型
    2. 11.2 文档支持
      1. 11.2.1 相关文档
    3. 11.3 商标
    4. 11.4 静电放电警告
    5. 11.5 术语表
  12. 12机械封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

4 修订历史记录

Changes from A Revision (October 2013) to B Revision

  • Changed "free-air temperature" to "junction temperature" in Absolute Maximum Ratings condition statement Go
  • Changed Figure 14 to Figure 18: collected new dataGo

Changes from * Revision (July 2013) to A Revision

  • Added ESD 额定值表，特性描述部分，器件功能模式，应用和实施部分，电源相关建议部分，布局部分，器件和文档支持部分以及机械、封装和可订购信息部分Go
  • Changed 文档状态至量产数据Go
  • Changed 文档标题Go
  • Deleted 第一个特性着重号的第二个子着重号Go
  • Changed 电源抑制比内的子着重号和低噪声输出特性着重号Go
  • Changed 输出电流，瞬态响应，陶瓷电容器，和封装特性着重号Go
  • Deleted 输入电压范围特性着重号Go
  • Added 输出电压范围特性着重号Go
  • Added 第 4 个至第 7 个应用着重号Go
  • Changed 说明部分的第 1 段和第 3 段Go
  • Changed 说明第二段中的稳压值Go
  • Added 更改为典型应用电路Go
  • Changed descriptions of IN, NR, OUT, and PowerPAD pins in Pin Functions tableGo
  • Added PowerPAD row to Pin Functions tableGo
  • Changed associated pins of Voltage parameter in Absolute Maximum Ratings tableGo
  • Changed TJTemperature range parameter minimum specification in Absolute Maximum Ratings tableGo
  • Changed conditions of Electrical Characteristics tableGo
  • Changed VIN and VOUT parameter maximum specifications in Electrical Characteristics tableGo
  • Added VUVLO(in) parameter to Electrical Characteristics tableGo
  • Changed VIN – VOUT voltage range, Vn, and Tsd parameters in Electrical Characteristics tableGo
  • Changed ICL and IEN parameter specifications in Electrical Characteristics tableGo
  • Changed IGND parameter typical specification in Electrical Characteristics tableGo
  • Changed ISHDN test conditions and parameter specifications in Electrical Characteristics tableGo
  • Changed VEN(HI) parameter minimum specification in Electrical Characteristics tableGo
  • Changed Typical Characteristics sectionGo
  • Added Functional Block DiagramGo
  • Changed Application Information sectionGo
  • Changed Board Layout Recommendations sectionGo